摘要:
A monolithic charge-coupled infrared imaging device (CCIRID) is fabricated on N-type HgCdTe. A native oxide layer on the semiconductor is used, in combination with ZnS to provide first level insulation. An opaque field plate over first level insulation is provided for signal channel definition. Second level insulation (ZnS) is substantially thicker than the first level, and is provided with a stepped or sloped geometry under the first level gates. Input and output diodes are provided with MIS guard rings to increase breakdown voltages.
摘要:
A monolithic charge-coupled infrared imaging device (CCIRID) is fabricated on N-type HgCdTe. A native oxide layer on the semiconductor is used, in combination with ZnS to provide first level insulation. An opaque field plate over first level insulation is provided for signal channel definition. Second level insulation (ZnS) is substantially thicker than the first level, and is provided with a stepped or sloped geometry under the first level gates. Input and output diodes are provided with MIS guard rings to increase breakdown voltages.
摘要:
An infrared charge transfer device (CTD) imaging system is disclosed which includes an optic system for focusing infrared energy emanating from a scene, a detector matrix for receiving the focused infrared energy and converting it to electrical signals representative of the intensity of the infrared energy, and a video processor for processing the electrical signals into video signals. The detector matrix of the system is a plurality of IR detector cells arranged in rows and columns. Each detector cell includes a substrate of semiconductor material, an integrating electrode, a drain electrode, a transfer electrode and insulating layers. The integrating electrode is centrally disposed with respect to the drain and transfer electrodes with the integrating electrode in a spaced relationship with the drain electrode. The integrating and drain electrodes form first level MIS electrodes on the semiconductor substrate. The transfer gate forms a second level MIS electrode as to the semiconductor substrate and overlaps the space between the integrating and drain electrodes. In a second MIS embodiment the drain electrode is replaced by a diode formed in the semiconductor substrate. In both embodiments, the integrating electrodes are connected together in columns and the transfer electrodes are connected together in rows. In operation, the integrating electrode and the drain are on while a row of transfer electrodes are turned on and then off transferring the charge from wells under the integrating electrode to the drain well. The column voltages are sampled before and after the turn-on and turn-off of the integrating well the voltage difference on the column lines is proportional to the charge transferred and is used to indicate the intensity of the impinging infrared image. Charge collected by the drain is either injected to the substrate in the first embodiment or drained out the contact to the junction diode in the second embodiment.
摘要:
An infrared charge transfer device (CTD) imager system is disclosed which includes an optic system, a charge transfer device detector matrix and a signal processor. The optic system focuses infrared energy from a scene onto the detector matrix. The detector matrix produces electrical signals representative of the impinging energy and the signal processor processes the electrical signals into video signals. The CTD detector matrix comprises a plurality of charge injection devices (CID). Each CID has an IR sensitive area, and two metal/insulator/semiconductor gate electrodes surrounded by a field plate. One, a column gate electrode, is centrally located within the IR sensitive area and the other, a row gate electrode, surrounds the column gate electrode. In one embodiment, the field plate and column gate electrode are in a spaced but overlapping relationship with minimum overlap, and the row gate electrode is in a spaced relationship to the field plate and column gate electrode whereby the electric field generated between the edges (corners in particular) of the field plate and column and row gate electrodes is substantially reduced. The column electrode is formed as an integral part of the column read line metallization. In a second embodiment, the column gate electrode is formed in a spaced relationship to the field plate and on the same level without overlap. However, the column read line is spaced above the column electrode and electrically connected through a via. The electric fields at the edges and corners are substantially reduced in this second embodiment.
摘要:
A semiconductor device having high and low voltage transistors on the same chip. High voltage NMOS transistor 76 comprises a polysilicon gate 40 doped at first dopant level. Low voltage NMOS transistor comprises a polysilicon gate 44 doped at a second dopant level. The second dopant level is higher than the first. High voltage PMOS transistor 84 comprises a polysilicon gate 48 doped at a third dopant level. Low voltage PMOS transistor comprises a polysilicon gate 52 doped at a fourth dopant level. The fourth dopant level is higher than the third.
摘要:
A process for making CMOS device wherein the N-channel devices have n+ gates, and the P-channel devices have p+ gates. A TiN local interconnect system is used to connect the two types of gates, as well as providing connections to moat. A titanium nitride layer may be formed by depositing titanium metal everywhere, and then heating the integrated circuit structure in a nitrogen atmosphere. This process may also be used with other refractory metal nitride interconnect layers. In addition to titanium based thin film compositions, other metals can be substituted and used for direct-react silicidation and simultaneous formation of a conductive nitride to form local interconnects, including molybdenum, tungsten, vanadium, cobalt, and others.
摘要:
A multiple recess isolation technology avoids stress induced defects while providing a substantially planar surface. A silicon substrate (10) is patterned and etched, creating active moat regions (18) and recesses (20a-b and 21a-b). The recesses are filled with oxide by growing a field oxide (40) in wide recessed regions (21) using a LOCOS process, while depositing a planarization field oxide (44) in narrow recessed regions (20). After etching the structure to obtain a planar surface, standard procedures are used to fabricate the active devices. The process uses a single photolithographic masking step and results in only a very small loss of the width electrically active regions.
摘要:
A non-volatile JRAM cell is constructed to require only positive voltage for programming and erasing of data in the cell. The "well" region of the cell JFET device may be implanted with an impurity concentration that will permit lower breakdown voltage or the non-volatile gate may overlap the JFET gate sufficiently to be able to have the same effect, or some combination of both may be used. This allows the cell to be erased using voltages of one polarity.
摘要:
This disclosure defines an infrared image detector formed in a block of semiconductor material by etching slots in the semiconductor material. The slots define the individual detectors, effectively isolate them from each other both optically and electrically, and permit the detectors to be placed very close to each other.
摘要:
A counter-doped epitaxial silicon (doped opposite to the substrate type) is used to form the buried layer in a CMOS transistor, while maintaining an abrupt channel profile. Shallow source/drain junctions with abrupt source/drain profiles may be formed using raised (or elevated) source/drain design. The invention encompasses a transistor structure including a doped silicon substrate, and an oppositely-doped epitaxial silicon layer formed on the substrate. A gate is formed on the epitaxial layer, the gate defining a channel region in the epitaxial layer underneath the gate. A layer is formed on the epitaxial silicon layer on opposing sides of, and is electrically isolated from, the gate.