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    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME
    3.
    发明申请
    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME 审中-公开
    包括底片的电子组件及其制造方法

    公开(公告)号：US20140335635A1

    公开(公告)日：2014-11-13

    申请号：US13891637

    申请日：2013-05-10

    申请人： Sridharan Venk ,  Adam Scotch ,  David Hamby

    发明人： Sridharan Venk ,  Adam Scotch ,  David Hamby

    IPC分类号： H01L23/00 ,  H01L33/48

    CPC分类号： H01L24/80 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K1/141 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10106 ,  H01L2924/00

    摘要： Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

    摘要翻译： 这里描述的是包括子组件膜的电子组件及其制造方法。 在一些实施例中，通过将电子管芯放置在子组件膜上的管芯放置位置来形成第一子组件。 第二子组件可以通过将第一子组件放置在基底层上的子组件放置位置而形成，使得第一膜上的电接触/迹线与基底层上的子组件连接点处的电触点/迹线重叠。 可以使用具有大于将第一子组件放置在基层上所需的放置精度的自动放置机械来执行模具在子组件薄膜上的放置。 结果，可以避免成本高且耗时的针头放置的手动检查。

    Tubular LED Lamp
    4.
    发明申请
    Tubular LED Lamp 审中-公开
    管状LED灯

    公开(公告)号：US20160084446A1

    公开(公告)日：2016-03-24

    申请号：US14860978

    申请日：2015-09-22

    申请人： Richard Speer ,  Bruce Radl ,  Adam Scotch

    发明人： Richard Speer ,  Bruce Radl ,  Adam Scotch

    IPC分类号： F21K99/00 ,  F21V3/02 ,  F21V3/04 ,  F21V7/00

    CPC分类号： F21V3/0625 ,  F21K9/27 ,  F21K9/69 ,  F21V3/02 ,  F21V7/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/0014 ,  H05K3/281 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/2054

    摘要： There is herein described an LED lamp comprising a tubular body having a diffuser portion and a circuit board portion. The circuit board portion has a plurality of light-emitting diodes mounted thereon and electric circuitry for providing power to the LEDs. In one embodiment, the circuit board and diffuser portions are integrally formed from a sheet of a translucent polymer. As the circuit board forms a part of the tubular body of the lamp, the LEDs are located at the circumference of the lamp instead of near the center. Such a configuration improves diffusion and distribution of the light. Moreover, since the circuit board is not contained within the tubular body, there is no enclosure to trap excess heat which is an additional advantage.

    摘要翻译： 这里描述了一种LED灯，其包括具有扩散器部分和电路板部分的管状体。 电路板部分具有安装在其上的多个发光二极管和用于向LED提供电力的电路。 在一个实施例中，电路板和扩散器部分由半透明聚合物片整体形成。 当电路板形成灯的管状体的一部分时，LED位于灯的圆周处，而不是靠近中心。 这种构造改善了光的扩散和分布。 此外，由于电路板不包含在管状体内，所以没有外壳来捕获多余的热量，这是额外的优点。

    Techniques for adhering surface mount devices to a flexible substrate
    5.
    发明授权
    Techniques for adhering surface mount devices to a flexible substrate 有权
    将表面贴装装置粘贴到柔性基板上的技术

    公开(公告)号：US09287467B2

    公开(公告)日：2016-03-15

    申请号：US14273054

    申请日：2014-05-08

    申请人： Richard Speer ,  Dave Hamby ,  Adam Scotch

    发明人： Richard Speer ,  Dave Hamby ,  Adam Scotch

    IPC分类号： H01L23/34 ,  H01L33/48 ,  H01L33/62 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/028 ,  H05K1/0326 ,  H05K1/111 ,  H05K1/118 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0145 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611

    摘要： Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.

    摘要翻译： 公开了使用导电环氧接合焊盘将SMD连接到柔性衬底上的技术。 每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。 接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。 可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。 导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨过接合焊盘条的暴露部分，以便附接SMD。 环氧接合焊盘条的数量，尺寸和取向可以通过柔性基板预期承受的弯曲量和/或弯曲的取向来确定。

    TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE
    6.
    发明申请
    TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE 有权
    用于将表面安装装置附着到柔性基板的技术

    公开(公告)号：US20150325755A1

    公开(公告)日：2015-11-12

    申请号：US14273054

    申请日：2014-05-08

    申请人： Richard Speer ,  Dave Hamby ,  Adam Scotch

    发明人： Richard Speer ,  Dave Hamby ,  Adam Scotch

    IPC分类号： H01L33/48 ,  H05K1/03 ,  H05K1/11 ,  H01L33/62 ,  H05K1/02

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/028 ,  H05K1/0326 ,  H05K1/111 ,  H05K1/118 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0145 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611

    摘要： Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.

    摘要翻译： 公开了使用导电环氧接合焊盘将SMD连接到柔性衬底上的技术。 每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。 接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。 可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。 导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨过接合焊盘条的暴露部分，以便附接SMD。 环氧接合焊盘条的数量，尺寸和取向可以通过柔性基板预期承受的弯曲量和/或弯曲的取向来确定。

    Ceramic Wavelength Converter Having a High Reflectivity Reflector
    7.
    发明申请
    Ceramic Wavelength Converter Having a High Reflectivity Reflector 审中-公开

    公开(公告)号：US20200012022A1

    公开(公告)日：2020-01-09

    申请号：US16572402

    申请日：2019-09-16

    申请人： Alan Lenef ,  James Avallon ,  Adam Scotch

    发明人： Alan Lenef ,  James Avallon ,  Adam Scotch

    IPC分类号： G02B5/08 ,  C04B37/02 ,  C09K11/08 ,  C09K11/77 ,  G02B7/18 ,  H01L33/60 ,  H01L33/50

    摘要： There is herein described a ceramic wavelength converter having a high reflectivity reflector. The ceramic wavelength converter is capable of converting a primary light into a secondary light and the reflector comprises a reflective metal layer and a dielectric buffer layer between the ceramic wavelength converter and the reflective metal layer. The buffer layer is non-absorbing with respect to the secondary light and has an index of refraction that is less than an index of refraction of the ceramic wavelength converter. Preferably the reflectivity of the reflector is at least 80%, more preferably at least 85% and even more preferably at least 95% with respect to the secondary light emitted by the converter.

    HID lamp with rapid relight aid
    8.
    发明授权
    HID lamp with rapid relight aid 失效
    HID灯具快速重力辅助

    公开(公告)号：US07663318B2

    公开(公告)日：2010-02-16

    申请号：US11901532

    申请日：2007-09-18

    申请人： William D Koenigsberg ,  Adam Scotch ,  Walter P Lapatovich ,  Victor Perez

    发明人： William D Koenigsberg ,  Adam Scotch ,  Walter P Lapatovich ,  Victor Perez

    IPC分类号： H01J61/54 ,  H01J17/30

    CPC分类号： H01J61/545 ,  H01J61/82

    摘要： The restrike time for re-light up of an arc discharge lamp may be decreased by including at least one refractory bimetallic start up electrode that provides a shorter arc path intermediate the main arc path in a cool state, but when heated withdraws to have a relatively longer arc path. The longer arc path in the hot state results in a relatively higher path impedance that can be used by itself or in combination with a supplemental impedance device to extinguish the starting arc in favor of the main arc. The withdrawn bimetallic starting electrode then does not interfere with the main arc function.

    摘要翻译： 可以通过包括至少一个难熔双金属启动电极来降低电弧放电灯重新点亮的重启时间，该耐火双金属启动电极在冷却状态下在主电弧路径之间提供较短的电弧路径，但是当加热时， 较长的弧径。 在热状态下的较长的电弧路径导致相对较高的路径阻抗，其可以自身使用或与补充阻抗装置组合以消除起弧电弧以有利于主电弧。 撤出的双金属起始电极不会干扰主电弧功能。

    Hid lamp with rapid relight aid
    9.
    发明申请
    Hid lamp with rapid relight aid 失效
    隐藏灯具快速重新援助

    公开(公告)号：US20090072740A1

    公开(公告)日：2009-03-19

    申请号：US11901532

    申请日：2007-09-18

    申请人： William D. Koenigsberg ,  Adam Scotch ,  Walter P. Lapatovich ,  Victor Perez

    发明人： William D. Koenigsberg ,  Adam Scotch ,  Walter P. Lapatovich ,  Victor Perez

    IPC分类号： H01J61/54

    CPC分类号： H01J61/545 ,  H01J61/82

    摘要： The restrike time for re-light up of an arc discharge lamp may be decreased by including at least one refractory bimetallic start up electrode that provides a shorter arc path intermediate the main arc path in a cool state, but when heated withdraws to have a relatively longer arc path. The longer arc path in the hot state results in a relatively higher path impedance that can be used by itself or in combination with a supplemental impedance device to extinguish the starting arc in favor of the main arc. The withdrawn bimetallic starting electrode then does not interfere with the main arc function.

    摘要翻译： 可以通过包括至少一个难熔双金属启动电极来降低电弧放电灯重新点亮的重启时间，该耐火双金属启动电极在冷却状态下在主电弧路径之间提供较短的电弧路径，但是当加热时， 较长的弧径。 在热状态下的较长的电弧路径导致相对较高的路径阻抗，其可以自身使用或与补充阻抗装置组合以消除起弧电弧以有利于主电弧。 撤出的双金属起始电极不会干扰主电弧功能。