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    Lighting module
    3.
    发明授权
    Lighting module 有权
    照明模组

    公开(公告)号：US08183585B2

    公开(公告)日：2012-05-22

    申请号：US12211351

    申请日：2008-09-16

    申请人： Adam Scotch ,  John Selverian ,  David Hamby

    发明人： Adam Scotch ,  John Selverian ,  David Hamby

    IPC分类号： H01S5/00

    CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

    摘要翻译： 一种照明模块，包括基板和直接附接到基板的多个发光二极管（LED）芯片。 LED芯片与基板上的导电迹线电连通，其向LED芯片传送电流。 还提供了这个一般描述的照明模块的各种实施例。 另外，提出了制备这种照明模块的方法以及照明模块的系统组件。

    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME
    4.
    发明申请
    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME 审中-公开
    包括底片的电子组件及其制造方法

    公开(公告)号：US20140335635A1

    公开(公告)日：2014-11-13

    申请号：US13891637

    申请日：2013-05-10

    申请人： Sridharan Venk ,  Adam Scotch ,  David Hamby

    发明人： Sridharan Venk ,  Adam Scotch ,  David Hamby

    IPC分类号： H01L23/00 ,  H01L33/48

    CPC分类号： H01L24/80 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K1/141 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10106 ,  H01L2924/00

    摘要： Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

    摘要翻译： 这里描述的是包括子组件膜的电子组件及其制造方法。 在一些实施例中，通过将电子管芯放置在子组件膜上的管芯放置位置来形成第一子组件。 第二子组件可以通过将第一子组件放置在基底层上的子组件放置位置而形成，使得第一膜上的电接触/迹线与基底层上的子组件连接点处的电触点/迹线重叠。 可以使用具有大于将第一子组件放置在基层上所需的放置精度的自动放置机械来执行模具在子组件薄膜上的放置。 结果，可以避免成本高且耗时的针头放置的手动检查。

    ELECTROSTATIC DISCHARGE PROTECTION FOR ELECTRICAL COMPONENTS, DEVICES INCLUDING SUCH PROTECTION AND METHODS FOR MAKING THE SAME
    5.
    发明申请
    ELECTROSTATIC DISCHARGE PROTECTION FOR ELECTRICAL COMPONENTS, DEVICES INCLUDING SUCH PROTECTION AND METHODS FOR MAKING THE SAME 有权
    电气元件的静电放电保护，包括这种保护的装置及其制造方法

    公开(公告)号：US20130114174A1

    公开(公告)日：2013-05-09

    申请号：US13724713

    申请日：2012-12-21

    申请人： David Hamby ,  Adam Scotch

    发明人： David Hamby ,  Adam Scotch

    IPC分类号： H02H3/20

    CPC分类号： H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

    摘要： Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

    摘要翻译： 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

    Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same
    6.
    发明授权
    Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same 有权
    电气元件的静电放电保护，包括这种保护的器件及其制造方法

    公开(公告)号：US09000453B2

    公开(公告)日：2015-04-07

    申请号：US13724713

    申请日：2012-12-21

    申请人： David Hamby ,  Adam Scotch

    发明人： David Hamby ,  Adam Scotch

    IPC分类号： H01L21/00 ,  H02H3/20 ,  H05K1/02 ,  H05K1/18 ,  H02H7/20 ,  H05K1/16 ,  H02H9/04

    CPC分类号： H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

    摘要： Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

    摘要翻译： 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

    LIGHT ENGINE CIRCUIT WITH CONFIGURABLE PULSED LIGHT OUTPUT AND HORTICULTURE LIGHTING DEVICE USING SAME
    7.
    发明申请
    LIGHT ENGINE CIRCUIT WITH CONFIGURABLE PULSED LIGHT OUTPUT AND HORTICULTURE LIGHTING DEVICE USING SAME 审中-公开

    公开(公告)号：US20190082610A1

    公开(公告)日：2019-03-21

    申请号：US15711091

    申请日：2017-09-21

    申请人： Richard Speer ,  David Hamby ,  John Selverian

    发明人： Richard Speer ,  David Hamby ,  John Selverian

    IPC分类号： A01G7/04 ,  H05B37/02

    摘要： In general, one embodiment of the present disclosure includes a horticulture lighting device having a plurality of LED light channels that may be selectively energized to produce a predefined light pattern. Each of the LED light channels may emit one or more wavelengths and may be pulsed at a rate that may be imperceivable to a human eye, e.g., at 120 Hz to 720 Hz. Plants may respond biochemically to light patterns that include a period of delay between pulses of light, e.g., from 500 microseconds to 5 milliseconds. The biochemical response has been shown to significantly increase plant growth, e.g., up to 100%, relative to plants grown with lighting systems that use continuous, non-pulsing light sources. Thus, aspects and embodiments disclosed herein include a horticulture device capable of emitting light patterns which introduce a predefined delay period between energizing/pulsing of LED light channels to aid photosynthesis.

    Flexible circuit board for LED lighting fixtures
    9.
    发明授权
    Flexible circuit board for LED lighting fixtures 有权

    公开(公告)号：US10134714B2

    公开(公告)日：2018-11-20

    申请号：US14075142

    申请日：2013-11-08

    申请人： Richard Speer ,  David Hamby ,  John Selverian

    发明人： Richard Speer ,  David Hamby ,  John Selverian

    IPC分类号： H01L33/00 ,  H01L29/205 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H05K3/10 ,  H05K1/02 ,  H05K1/18

    摘要： Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

    FLEXIBLE CIRCUIT BOARD FOR LED LIGHTING FIXTURES
    10.
    发明申请
    FLEXIBLE CIRCUIT BOARD FOR LED LIGHTING FIXTURES 审中-公开
    柔性电路板用于LED照明设备

    公开(公告)号：US20150129909A1

    公开(公告)日：2015-05-14

    申请号：US14075142

    申请日：2013-11-08

    申请人： Richard Speer ,  David Hamby ,  John Selverian

    发明人： Richard Speer ,  David Hamby ,  John Selverian

    IPC分类号： H01L25/075 ,  H01L33/60 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0274 ,  H05K1/0287 ,  H05K1/181 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/2054 ,  H05K2203/063 ,  H01L2924/00

    摘要： Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

    摘要翻译： 公开了用于制造使用可附着有SMD的金属导体的柔性层叠电路板的技术。 可以将导电金属条层压以形成柔性基板，然后可以穿过金属条以放置LED封装引线。 LED封装可以使用焊料或导电环氧树脂附着到导电条，并且上层叠层可以包括暴露金属条的部分以穿过LED封装的穿孔。 或者，可以通过将LED封装连接到导电条上来制造LED封装串，并且这些串可以层压在柔性片之间以形成层压的LED电路。 塑料外壳可能有助于将LED封装连接到导电条上。 塑料外壳和/或层压片可以由反射材料制成。