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14 条记录 (耗时 0.021 秒)

    HID lamp with rapid relight aid
    1.
    发明授权
    HID lamp with rapid relight aid 失效
    HID灯具快速重力辅助

    公开(公告)号：US07663318B2

    公开(公告)日：2010-02-16

    申请号：US11901532

    申请日：2007-09-18

    申请人： William D Koenigsberg ,  Adam Scotch ,  Walter P Lapatovich ,  Victor Perez

    发明人： William D Koenigsberg ,  Adam Scotch ,  Walter P Lapatovich ,  Victor Perez

    IPC分类号： H01J61/54 ,  H01J17/30

    CPC分类号： H01J61/545 ,  H01J61/82

    摘要： The restrike time for re-light up of an arc discharge lamp may be decreased by including at least one refractory bimetallic start up electrode that provides a shorter arc path intermediate the main arc path in a cool state, but when heated withdraws to have a relatively longer arc path. The longer arc path in the hot state results in a relatively higher path impedance that can be used by itself or in combination with a supplemental impedance device to extinguish the starting arc in favor of the main arc. The withdrawn bimetallic starting electrode then does not interfere with the main arc function.

    摘要翻译： 可以通过包括至少一个难熔双金属启动电极来降低电弧放电灯重新点亮的重启时间，该耐火双金属启动电极在冷却状态下在主电弧路径之间提供较短的电弧路径，但是当加热时， 较长的弧径。 在热状态下的较长的电弧路径导致相对较高的路径阻抗，其可以自身使用或与补充阻抗装置组合以消除起弧电弧以有利于主电弧。 撤出的双金属起始电极不会干扰主电弧功能。

    Hid lamp with rapid relight aid
    2.
    发明申请
    Hid lamp with rapid relight aid 失效
    隐藏灯具快速重新援助

    公开(公告)号：US20090072740A1

    公开(公告)日：2009-03-19

    申请号：US11901532

    申请日：2007-09-18

    申请人： William D. Koenigsberg ,  Adam Scotch ,  Walter P. Lapatovich ,  Victor Perez

    发明人： William D. Koenigsberg ,  Adam Scotch ,  Walter P. Lapatovich ,  Victor Perez

    IPC分类号： H01J61/54

    CPC分类号： H01J61/545 ,  H01J61/82

    摘要： The restrike time for re-light up of an arc discharge lamp may be decreased by including at least one refractory bimetallic start up electrode that provides a shorter arc path intermediate the main arc path in a cool state, but when heated withdraws to have a relatively longer arc path. The longer arc path in the hot state results in a relatively higher path impedance that can be used by itself or in combination with a supplemental impedance device to extinguish the starting arc in favor of the main arc. The withdrawn bimetallic starting electrode then does not interfere with the main arc function.

    摘要翻译： 可以通过包括至少一个难熔双金属启动电极来降低电弧放电灯重新点亮的重启时间，该耐火双金属启动电极在冷却状态下在主电弧路径之间提供较短的电弧路径，但是当加热时， 较长的弧径。 在热状态下的较长的电弧路径导致相对较高的路径阻抗，其可以自身使用或与补充阻抗装置组合以消除起弧电弧以有利于主电弧。 撤出的双金属起始电极不会干扰主电弧功能。

    Ceramic Wavelength Converter Having a High Reflectivity Reflector
    4.
    发明申请
    Ceramic Wavelength Converter Having a High Reflectivity Reflector 审中-公开

    公开(公告)号：US20200012022A1

    公开(公告)日：2020-01-09

    申请号：US16572402

    申请日：2019-09-16

    申请人： Alan Lenef ,  James Avallon ,  Adam Scotch

    发明人： Alan Lenef ,  James Avallon ,  Adam Scotch

    IPC分类号： G02B5/08 ,  C04B37/02 ,  C09K11/08 ,  C09K11/77 ,  G02B7/18 ,  H01L33/60 ,  H01L33/50

    摘要： There is herein described a ceramic wavelength converter having a high reflectivity reflector. The ceramic wavelength converter is capable of converting a primary light into a secondary light and the reflector comprises a reflective metal layer and a dielectric buffer layer between the ceramic wavelength converter and the reflective metal layer. The buffer layer is non-absorbing with respect to the secondary light and has an index of refraction that is less than an index of refraction of the ceramic wavelength converter. Preferably the reflectivity of the reflector is at least 80%, more preferably at least 85% and even more preferably at least 95% with respect to the secondary light emitted by the converter.

    LED with light transmissive heat sink
    7.
    发明申请
    LED with light transmissive heat sink 有权
    LED带透光散热器

    公开(公告)号：US20070080362A1

    公开(公告)日：2007-04-12

    申请号：US11543863

    申请日：2006-10-06

    申请人： Adam Scotch ,  George Wei

    发明人： Adam Scotch ,  George Wei

    IPC分类号： H01L33/00

    CPC分类号： H01L33/641 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.

    摘要翻译： 可以从具有第一表面的大功率LED芯片和第二表面形成更有效或更高亮度的LED组件，第一表面安装到基板; 第二表面与导热率大于30瓦每米开尔文的透光散热器紧密地热接触。 LED芯片否则与至少第一电连接和用于为LED芯片供电的第二电连接电接触。 提供透光散热器可以使来自LED芯片的热传导加倍，从而增加寿命或效率或亮度或三者之间的平衡。

    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME
    8.
    发明申请
    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME 审中-公开
    包括底片的电子组件及其制造方法

    公开(公告)号：US20140335635A1

    公开(公告)日：2014-11-13

    申请号：US13891637

    申请日：2013-05-10

    申请人： Sridharan Venk ,  Adam Scotch ,  David Hamby

    发明人： Sridharan Venk ,  Adam Scotch ,  David Hamby

    IPC分类号： H01L23/00 ,  H01L33/48

    CPC分类号： H01L24/80 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K1/141 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10106 ,  H01L2924/00

    摘要： Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

    摘要翻译： 这里描述的是包括子组件膜的电子组件及其制造方法。 在一些实施例中，通过将电子管芯放置在子组件膜上的管芯放置位置来形成第一子组件。 第二子组件可以通过将第一子组件放置在基底层上的子组件放置位置而形成，使得第一膜上的电接触/迹线与基底层上的子组件连接点处的电触点/迹线重叠。 可以使用具有大于将第一子组件放置在基层上所需的放置精度的自动放置机械来执行模具在子组件薄膜上的放置。 结果，可以避免成本高且耗时的针头放置的手动检查。

    ELECTROSTATIC DISCHARGE PROTECTION FOR ELECTRICAL COMPONENTS, DEVICES INCLUDING SUCH PROTECTION AND METHODS FOR MAKING THE SAME
    9.
    发明申请
    ELECTROSTATIC DISCHARGE PROTECTION FOR ELECTRICAL COMPONENTS, DEVICES INCLUDING SUCH PROTECTION AND METHODS FOR MAKING THE SAME 有权
    电气元件的静电放电保护，包括这种保护的装置及其制造方法

    公开(公告)号：US20130114174A1

    公开(公告)日：2013-05-09

    申请号：US13724713

    申请日：2012-12-21

    申请人： David Hamby ,  Adam Scotch

    发明人： David Hamby ,  Adam Scotch

    IPC分类号： H02H3/20

    CPC分类号： H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

    摘要： Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

    摘要翻译： 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

    Lighting module
    10.
    发明授权
    Lighting module 有权
    照明模组

    公开(公告)号：US08183585B2

    公开(公告)日：2012-05-22

    申请号：US12211351

    申请日：2008-09-16

    申请人： Adam Scotch ,  John Selverian ,  David Hamby

    发明人： Adam Scotch ,  John Selverian ,  David Hamby

    IPC分类号： H01S5/00

    CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

    摘要翻译： 一种照明模块，包括基板和直接附接到基板的多个发光二极管（LED）芯片。 LED芯片与基板上的导电迹线电连通，其向LED芯片传送电流。 还提供了这个一般描述的照明模块的各种实施例。 另外，提出了制备这种照明模块的方法以及照明模块的系统组件。