公开(公告)号：US20070134471A1

公开(公告)日：2007-06-14

申请号：US11676557

申请日：2007-02-20

Applicant: Rickie Lake ,  Charles Watkins

Inventor： Rickie Lake ,  Charles Watkins

IPC: B32B3/30

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68331 ,  Y10T428/2457 ,  Y10T428/24942

Abstract: Methods and apparatuses for releasably attaching microfeature workpieces to support members are disclosed herein. In one embodiment, a method includes applying a first material to a first region on a first side of a microfeature workpiece. The method then includes releasably attaching the first side of the workpiece to a support member. The method further includes applying a second material to a second region on the first side of the workpiece. The second region includes a perimeter portion of the workpiece. The first material and/or the second material can be an adhesive. The second material is removable from the workpiece relative to the first material. In several embodiments, for example, the first material can have a first solubility in a solution and the second material can have a second solubility in the solution less than the first solubility.

Abstract translation: 本文公开了将微型工件可释放地附接到支撑构件的方法和装置。 在一个实施例中，一种方法包括将第一材料施加到微特征工件的第一侧上的第一区域。 该方法然后包括将工件的第一侧可释放地附接到支撑构件。 该方法还包括将第二材料施加到工件的第一侧上的第二区域。 第二区域包括工件的周边部分。 第一材料和/或第二材料可以是粘合剂。 第二材料相对于第一材料可从工件移除。 在几个实施方案中，例如，第一材料可以在溶液中具有第一溶解度，并且第二材料可以在溶液中具有小于第一溶解度的第二溶解度。

公开(公告)号：US20060162850A1

公开(公告)日：2006-07-27

申请号：US11042749

申请日：2005-01-24

Applicant: Rickie Lake ,  Charles Watkins

Inventor： Rickie Lake ,  Charles Watkins

IPC: H01L21/302 ,  B32B37/00

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68331 ,  Y10T428/2457 ,  Y10T428/24942

Abstract: Methods and apparatuses for releasably attaching microfeature workpieces to support members are disclosed herein. In one embodiment, a method includes applying a first material to a first region on a first side of a microfeature workpiece. The method then includes releasably attaching the first side of the workpiece to a support member. The method further includes applying a second material to a second region on the first side of the workpiece. The second region includes a perimeter portion of the workpiece. The first material and/or the second material can be an adhesive. The second material is removable from the workpiece relative to the first material. In several embodiments, for example, the first material can have a first solubility in a solution and the second material can have a second solubility in the solution less than the first solubility.

Abstract translation: 本文公开了将微型工件可释放地附接到支撑构件的方法和装置。 在一个实施例中，一种方法包括将第一材料施加到微特征工件的第一侧上的第一区域。 该方法然后包括将工件的第一侧可释放地附接到支撑构件。 该方法还包括将第二材料施加到工件的第一侧上的第二区域。 第二区域包括工件的周边部分。 第一材料和/或第二材料可以是粘合剂。 第二材料相对于第一材料可从工件移除。 在几个实施方案中，例如，第一材料可以在溶液中具有第一溶解度，并且第二材料可以在溶液中具有小于第一溶解度的第二溶解度。

公开(公告)号：US20070170350A1

公开(公告)日：2007-07-26

申请号：US11727545

申请日：2007-03-27

Applicant: Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

Inventor： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

IPC: H01L27/00

CPC classification number: H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

Abstract: Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US20070048902A1

公开(公告)日：2007-03-01

申请号：US11218039

申请日：2005-08-31

Applicant: William Hiatt ,  Charles Watkins

Inventor： William Hiatt ,  Charles Watkins

IPC: H01L21/00

CPC classification number: H01L24/06 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/10 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/05655 ,  H01L2224/11 ,  H01L2224/13025 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/163 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Microfeature workpieces, carriers, and associated methods are disclosed. In a particular embodiment, one method for processing a microfeature workpiece can include temporarily attaching the microfeature workpiece to a carrier with a releasable connector, wherein the connector is at least partially metallic. The method can further include performing a manufacturing process on the microfeature workpiece while the microfeature workpiece is attached to the carrier. The method can still further include detaching the microfeature workpiece from the carrier by debonding the connector from at least one of the microfeature workpiece and the carrier. In at least some instances, the at least partially metallic connector can withstand increased processing temperatures, and can allow a wider variety of processes to be performed on the microfeature workpiece while it is attached to the carrier.

Abstract translation: 公开了微型工件，载体和相关方法。 在特定实施例中，用于处理微特征工件的一种方法可以包括将微特征工件临时附接到具有可释放连接器的载体上，其中连接器至少部分是金属的。 该方法还可以包括在微特征工件附着到载体上时对微特征工件执行制造过程。 该方法还可以包括通过从微特征工件和载体中的至少一个脱离连接器来将微特征工件从载体分离。 在至少一些情况下，至少部分金属连接器可以承受增加的处理温度，并且可以允许在微特征工件附着到载体上时执行更多种类的工艺。

公开(公告)号：US20060243889A1

公开(公告)日：2006-11-02

申请号：US11476015

申请日：2006-06-28

Applicant: Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

Inventor： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

IPC: H01L27/00

CPC classification number: H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

Abstract: Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US20060223298A1

公开(公告)日：2006-10-05

申请号：US11445813

申请日：2006-06-02

Applicant: Charles Watkins

Inventor： Charles Watkins

IPC: H01L21/44

CPC classification number: H01L23/525 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Integrated circuits and methods of redistributing bondpad locations are disclosed. In one implementation, a method of redistributing a bondpad location of an integrated circuit includes providing an integrated circuit comprising an inner lead bondpad. A first insulative passivation layer is formed over the integrated circuit. A bondpad-redistribution line is formed over the first insulative passivation layer and in electrical connection with the inner lead bondpad through the first insulative passivation layer. The bondpad-redistribution line includes an outer lead bondpad area. A second insulative passivation layer is formed over the integrated circuit and the bondpad-redistribution line. The second insulative passivation layer is formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the bondpad-redistribution line. Other aspects and implementations are contemplated.

Abstract translation: 公开了重新分配焊盘位置的集成电路和方法。 在一个实现中，重新分配集成电路的接合板位置的方法包括提供包括内部引线接合板的集成电路。 在集成电路上形成第一绝缘钝化层。 在第一绝缘钝化层上形成键合 - 再分配线，并通过第一绝缘钝化层与内部引线键合电连接。 键盘 - 再分配线包括外部引线键合区域。 第二绝缘钝化层形成在集成电路和键合 - 再分配线上。 第二绝缘钝化层形成为具有侧壁轮廓，其侧面轮廓的至少一部分接近并符合键合 - 再分配线的至少一部分。 考虑了其他方面和实现。

公开(公告)号：US20060186097A1

公开(公告)日：2006-08-24

申请号：US11413289

申请日：2006-04-28

Applicant: Charles Watkins ,  William Hiatt

Inventor： Charles Watkins ,  William Hiatt

IPC: B23K26/38

CPC classification number: B23K26/382 ,  B23K26/03 ,  B23K26/0342 ,  B23K26/361 ,  B23K26/362 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/486 ,  H01L21/76898 ,  H05K3/0026 ,  H05K2203/163 ,  Y10T29/49165

Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

公开(公告)号：US20060177999A1

公开(公告)日：2006-08-10

申请号：US11056211

申请日：2005-02-10

Applicant: David Hembree ,  Charles Watkins ,  Kyle Kirby ,  Steven Oliver ,  Salman Akram ,  Sidney Rigg

Inventor： David Hembree ,  Charles Watkins ,  Kyle Kirby ,  Steven Oliver ,  Salman Akram ,  Sidney Rigg

IPC: H01L21/44

CPC classification number: H01L21/76898

Abstract: Methods for forming interconnects in blind holes and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a method for manufacturing a microelectronic workpiece having microelectronic dies with integrated circuits and terminals electrically coupled to the integrated circuits. In one embodiment, the method includes forming a blind hole in the workpiece. The blind hole extends from a first exterior side of the workpiece to an intermediate depth in the workpiece. The method continues by forming a vent in the workpiece. The vent is in fluid communication with the blind hole. The method further includes constructing an electrically conductive interconnect in at least a portion of the blind hole.

Abstract translation: 在这里公开了在盲孔中形成互连件的方法和具有这种互连的微电子工件的方法。 本发明的一个方面涉及一种用于制造微电子工件的方法，所述微电子工件具有集成电路和与集成电路电连接的端子的微电子管芯。 在一个实施例中，该方法包括在工件中形成盲孔。 盲孔从工件的第一外侧延伸到工件的中间深度。 该方法通过在工件中形成通气来继续。 排气口与盲孔流体连通。 该方法还包括在盲孔的至少一部分中构造导电互连。

公开(公告)号：US20060137171A1

公开(公告)日：2006-06-29

申请号：US11336538

申请日：2006-01-20

Applicant: Charles Watkins ,  Kyle Kirby

Inventor： Charles Watkins ,  Kyle Kirby

IPC: G01R31/28 ,  H01R43/00

CPC classification number: G01R1/07357 ,  G01R1/06711 ,  G01R1/0735 ,  G01R31/2831 ,  G01R31/2887 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T29/49169 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the substrate and at least another portion integral with the fixed portion, laterally unsupported within a thickness of the substrate and extending beyond a side thereof. Dual-sided compliant contact structures, methods of forming compliant contact structures, a method of testing a semiconductor device and a testing system are also disclosed.

Abstract translation: 用于与要测试的半导体器件可操作地耦合的柔性接触结构和接触器卡包括在其中形成有柔性接触件的基本上平面的基板。 柔性接触结构包括固定在基底内的部分和与固定部分成一体的至少另一部分，横向地不支撑在基底的厚度内并延伸超过其一侧。 还公开了双面柔性接触结构，形成柔性接触结构的方法，测试半导体器件和测试系统的方法。

公开(公告)号：US20050064695A1

公开(公告)日：2005-03-24

申请号：US10980554

申请日：2004-11-03

Applicant: William Hiatt ,  Warren Farnworth ,  Charles Watkins ,  Nishant Sinha

Inventor： William Hiatt ,  Warren Farnworth ,  Charles Watkins ,  Nishant Sinha

IPC: H01L21/68 ,  H01L23/31 ,  H01L21/44 ,  G01R31/02

CPC classification number: H01L23/48 ,  B33Y80/00 ,  H01L21/44 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor component includes a die having a pattern of die contacts, and interconnect contacts bonded to the die contacts and encapsulated in an insulating layer. The component also includes terminal contacts formed on tip portions of the interconnect contacts. Alternately the component can include conductors and bonding pads in electrical communication with the interconnect contacts configured to redistribute the pattern of the die contacts. A method for fabricating the component includes the steps of forming the interconnect contacts on the die contacts, and forming the insulating layer on the interconnect contacts while leaving the tip portions exposed. The method also includes the step of forming the terminal contacts on the interconnect contacts, or alternately forming the conductors and bonding pads in electrical communication with the interconnect contacts and then forming the terminal contacts on the bonding pads.

Abstract translation: 半导体部件包括具有芯片触点图案的芯片，以及接合到芯片触点并且封装在绝缘层中的互连触点。 该部件还包括形成在互连触点的尖端部分上的端子触头。 或者，该部件可以包括导体和与构造成重新分布芯片触点的图案的互连触点电连通的焊盘。 一种用于制造该部件的方法包括以下步骤：在裸片触点上形成互连触点，并在互连触点上形成绝缘层，同时使尖端部分露出。 该方法还包括在互连触点上形成端子触点的步骤，或者交替地形成与互连触点电连通的导体和焊盘，然后在焊盘上形成端子触点。