公开(公告)号：US07517722B2

公开(公告)日：2009-04-14

申请号：US11491746

申请日：2006-07-24

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/00013 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099

摘要： An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

摘要翻译： 电子部件和坯件具有第一和第二塑料层的塑料包埋化合物。 半导体芯片以这样的方式嵌入第一塑料层中，使得它们的边缘被珠子包围。 第二塑料层补偿第一塑料层的上边界的不均匀性。

公开(公告)号：US06683374B2

公开(公告)日：2004-01-27

申请号：US10232172

申请日：2002-08-30

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

摘要翻译： 电子部件具有至少第一半导体芯片模块，第二半导体芯片模块和用于容纳半导体芯片模块的基板。 在这种情况下，两个半导体芯片模块的有源芯片表面均具有中心接触区域，这些中心接触区域彼此相对配置。 形成在中心接触区域上并彼此对应的各个焊接区域彼此相对并且彼此对准并且导电连接。

公开(公告)号：US07045881B2

公开(公告)日：2006-05-16

申请号：US09993266

申请日：2001-11-19

申请人： Robert-Christian Hagen ,  Gerald Ofner

发明人： Robert-Christian Hagen ,  Gerald Ofner

IPC分类号： H01L23/552

CPC分类号： H05K1/0218 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/3436 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.

公开(公告)号：US07566968B2

公开(公告)日：2009-07-28

申请号：US11196497

申请日：2005-08-04

申请人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

发明人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

摘要翻译： 具有智能卡结构的生物传感器包括：半导体芯片，包括生物活性结构和布置在半导体芯片的第一面上的接触区域;以及重新布线基板，包括接触焊盘，外部接触区域和将接触焊盘电连接到 外部接触区域。 再配线基板覆盖半导体芯片的第一侧的一部分而不覆盖生物活性结构，使得重新布线基板与半导体芯片和接触焊盘的接触区域重叠，并且接触区域彼此对准并电连接 。 此外，测量装置被配置为接收生物传感器并进行传送到测量装置中的流体介质的测量。

公开(公告)号：US20060183306A1

公开(公告)日：2006-08-17

申请号：US11387403

申请日：2006-03-23

申请人： Robert-Christian Hagen ,  Gerald Ofner

发明人： Robert-Christian Hagen ,  Gerald Ofner

IPC分类号： H01L21/425

CPC分类号： H05K1/0218 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/3436 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.

摘要翻译： 描述了具有屏蔽的电子部件。 该部件具有带半导体衬底的半导体芯片。 在半导体基板的后侧的区域中设置有导电性埋层。 掩埋层通过设置在半导体衬底内的接地引线连接到接触区域和外部接地电位。 此外，本发明涉及这种类型的电子部件的制造方法。

公开(公告)号：US20060027905A1

公开(公告)日：2006-02-09

申请号：US11196497

申请日：2005-08-04

申请人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

发明人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L29/82 ,  G01N33/48

CPC分类号： G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

公开(公告)号：US06867471B2

公开(公告)日：2005-03-15

申请号：US10652362

申请日：2003-08-29

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L21/04 ,  H01L21/4763 ,  H01L29/72

CPC分类号： H01L23/498 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.

摘要翻译： 电子元件具有带芯片触点的半导体芯片。 芯片触点机械地固定在布线结构上并与布线结构电连接。 布线结构形成为结构化金属板的区域或者作为金属包覆基板的结构化金属层的区域。 理想地，具有多个分量位置的面板被提供用于接收多个这样的电子部件。

公开(公告)号：US20060258046A1

公开(公告)日：2006-11-16

申请号：US11491746

申请日：2006-07-24

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Worner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Worner

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/00013 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099

摘要： An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

公开(公告)号：US06953992B2

公开(公告)日：2005-10-11

申请号：US10247966

申请日：2002-09-20

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/49 ,  H01L23/48 ,  H01L23/495 ,  H01L25/52

CPC分类号： H01L24/80 ,  H01L23/3128 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012

摘要： The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

摘要翻译： 本发明涉及一种具有至少一个半导体芯片和分配给该半导体芯片的平坦芯片载体的电子部件。 在半导体芯片的有源芯片表面上的接触区域和芯片载体的上侧上的接触端子区域之间的电连接由能够经历微结构并且具有导电涂层的材料条形成。 本发明还涉及一种电子部件的制造方法。

公开(公告)号：US06710455B2

公开(公告)日：2004-03-23

申请号：US10231881

申请日：2002-08-30

申请人： Bernd Goller ,  Gerald Ofner ,  Josef Thumbs ,  Holger Wörner ,  Robert-Christian Hagen ,  Christian Stümpfl ,  Stefan Wein

发明人： Bernd Goller ,  Gerald Ofner ,  Josef Thumbs ,  Holger Wörner ,  Robert-Christian Hagen ,  Christian Stümpfl ,  Stefan Wein

IPC分类号： H01L2348

CPC分类号： H01L24/29 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012

摘要： An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

摘要翻译： 电子部件形成有至少两个设置在载体基板上的半导体芯片。 半导体芯片的有源芯片表面包括形成相对的焊料接触表面的中心接触表面。 这些导体连接到设置在半导体芯片之间并产生从它们到载体衬底的重新布置的中间载体。 还描述了用于制造该部件的方法。