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公开(公告)号：US08482931B2
公开(公告)日：2013-07-09
申请号：US12632270
申请日：2009-12-07
CPC分类号： H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10515 , H05K2201/2036
摘要： A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.
摘要翻译： 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。
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公开(公告)号：US20100159719A1
公开(公告)日：2010-06-24
申请号：US12632270
申请日：2009-12-07
IPC分类号： H01R12/00
CPC分类号： H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10515 , H05K2201/2036
摘要： A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.
摘要翻译： 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。
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公开(公告)号：US08410377B2
公开(公告)日：2013-04-02
申请号：US12260219
申请日：2008-10-29
IPC分类号： H01L23/28
CPC分类号： H05K3/3484 , B23K35/264 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/321 , H05K3/3463 , H01L2924/3512 , H01L2924/00
摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.
摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。
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公开(公告)号：US20100224398A1
公开(公告)日：2010-09-09
申请号：US12738430
申请日：2008-10-16
IPC分类号： H05K1/18
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。
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公开(公告)号：US20090116205A1
公开(公告)日：2009-05-07
申请号：US12260219
申请日：2008-10-29
IPC分类号： H05K7/00
CPC分类号： H05K3/3484 , B23K35/264 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/321 , H05K3/3463 , H01L2924/3512 , H01L2924/00
摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.
摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。
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6.发明授权公开(公告)号：US08345444B2
公开(公告)日：2013-01-01
申请号：US12675080
申请日：2008-10-21
IPC分类号： H05K1/11
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。
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公开(公告)号：US08179686B2
公开(公告)日：2012-05-15
申请号：US12259661
申请日：2008-10-28
IPC分类号： H05K7/00
CPC分类号： H05K3/305 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/15151 , H05K2201/09063 , H05K2201/09781 , H05K2201/10674 , H05K2201/10689 , H05K2201/10719 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , H01L2924/00
摘要： Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.
摘要翻译： 包括具有至少安装在第一表面上的电子部件的布线板，至少施加在电子部件和布线板之间的树脂，以及设置在与电子部件的安装位置对应的区域中的通孔 在布线基板上，至少与电子部件重叠，在与电子部件的安装位置对应的区域上形成突起。
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公开(公告)号：US20090120675A1
公开(公告)日：2009-05-14
申请号：US12259661
申请日：2008-10-28
CPC分类号： H05K3/305 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/15151 , H05K2201/09063 , H05K2201/09781 , H05K2201/10674 , H05K2201/10689 , H05K2201/10719 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , H01L2924/00
摘要： Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.
摘要翻译： 包括具有至少安装在第一表面上的电子部件的布线板，至少施加在电子部件和布线板之间的树脂，以及设置在与电子部件的安装位置对应的区域中的通孔 在布线基板上，至少与电子部件重叠，在与电子部件的安装位置对应的区域上形成突起。
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公开(公告)号：US20090114885A1
公开(公告)日：2009-05-07
申请号：US12092453
申请日：2006-10-31
IPC分类号： H01B1/12
CPC分类号： C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0272 , H05K2203/0425
摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
摘要翻译： 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。
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公开(公告)号：US08378472B2
公开(公告)日：2013-02-19
申请号：US12738430
申请日：2008-10-16
IPC分类号： H01L23/22
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。
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