ELECTRICALLY CONDUCTIVE ADHESIVE
    10.
    发明申请
    ELECTRICALLY CONDUCTIVE ADHESIVE 有权
    电导电胶

    公开(公告)号:US20090114885A1

    公开(公告)日:2009-05-07

    申请号:US12092453

    申请日:2006-10-31

    IPC分类号: H01B1/12

    摘要: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

    摘要翻译: 本发明提供一种导电粘合剂,其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒,可以使用包含Ag合金和至少一种选自Sn,Cu,In,Bi和Ni的金属的组成的金属填料颗粒,将这种金属填料 颗粒和Ag填料颗粒,以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。