公开(公告)号：US20140185242A1

公开(公告)日：2014-07-03

申请号：US13789030

申请日：2013-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Tae Hyun KIM ,  Bum Seok SUH ,  In Wha JEONG ,  Young Ki LEE

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H01L23/367 ,  H01L23/49833 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48229 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15159 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.

Abstract translation: 提供了功率半导体模块，其中由于加热而可能难以集成的功率半导体元件被模块化。 功率半导体模块包括：电连接到公共连接端子的散热基板; 以及设置在所述散热基板上的多个电子元件，其中，所述电子元件之间具有不同的间隔。

公开(公告)号：US20140175631A1

公开(公告)日：2014-06-26

申请号：US13779502

申请日：2013-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki LEE ,  Kwang Soo KIM ,  Young Hoon KWAK ,  Sun Woo YUN

IPC: H01L23/34 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/24 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

Abstract translation: 提供一种能够容易地制造的半导体模块及其制造方法，该半导体模块包括其上安装有至少一个电子元件的模块基板，至少一个固定到模块基板的外部连接端子和形成的壳体 通过联接第一壳体和第二壳体，其中第一壳体和第二壳体在模块衬底的两端容纳模块衬底并且彼此耦合。

公开(公告)号：US20140239344A1

公开(公告)日：2014-08-28

申请号：US13890680

申请日：2013-05-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jaehoon PARK ,  In Hyuk SONG ,  Dong Soo SEO ,  Kwang Soo KIM ,  Kee Ju UM

IPC: H01L29/739 ,  H01L29/66

CPC classification number: H01L29/66348 ,  H01L27/0817 ,  H01L27/088 ,  H01L27/0921 ,  H01L29/0847 ,  H01L29/1033 ,  H01L29/1079 ,  H01L29/41733 ,  H01L29/4232 ,  H01L29/66325 ,  H01L29/66333 ,  H01L29/66477 ,  H01L29/66484 ,  H01L29/66954 ,  H01L29/7393 ,  H01L29/7397 ,  H01L29/768 ,  H01L29/78 ,  H01L31/111 ,  H01L31/1113 ,  H01L51/0512

Abstract: There is provided a power semiconductor device, including a first conductive type drift layer; a second conductive type body layer formed on the drift layer, a second conductive type collector layer formed below the drift layer; a first gate formed by penetrating through the body layer and a portion of the drift layer, a first conductive type emitter layer formed in the body layer and formed to be spaced apart from the first gate, a second gate covering upper portions of the body layer and the emitter layer and formed as a flat type gate on the first gate, and a segregation stop layer formed between contact surfaces of the first and second gates with the body layer, the emitter layer, and the drift layer.

Abstract translation: 提供了一种功率半导体器件，包括第一导电型漂移层; 形成在漂移层上的第二导电型体层，形成在漂移层下面的第二导电型集电极层; 通过贯穿本体层和漂移层的一部分而形成的第一栅极，形成在主体层中并形成为与第一栅极间隔开的第一导电型发射极层，覆盖主体层的上部的第二栅极 和发射极层，并且在第一栅极上形成为平面型栅极，以及在第一和第二栅极的接触表面之间形成的偏析阻挡层，其具有主体层，发射极层和漂移层。

公开(公告)号：US20140117524A1

公开(公告)日：2014-05-01

申请号：US13735603

申请日：2013-01-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Young Ho SOHN ,  Bum Seok SUH ,  Min Gyu PARK ,  Young Ki LEE

IPC: H01L23/00

CPC classification number: H01L24/25 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/82 ,  H01L25/162 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/2501 ,  H01L2224/25105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity.

Abstract translation: 提供功率半导体模块及其制造方法，功率半导体模块包括：引线框架; 基底基板，包括形成在其绝缘层上的电路布线; 设置成接触所述电路布线的多个功率半导体器件; 以及通过使用形成在其中并具有导电性的连接线将堆叠多个基板并将功率半导体器件和引线框架彼此电连接而形成的多层基板。

公开(公告)号：US20150270217A1

公开(公告)日：2015-09-24

申请号：US14661844

申请日：2015-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Young Hoon KWAK ,  Chang Seob HONG ,  Joon Seok CHAE ,  Kee Ju UM

IPC: H01L23/522 ,  H01L25/065 ,  H01L23/367

CPC classification number: H01L25/0655 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014

Abstract: There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.

Abstract translation: 提供了一个电源模块封装。 功率模块封装包括：具有图案的基底基板; 散热器，其通过堆叠在所述基底基板的上表面上而形成; 以及安装在散热器的上表面上的至少一个第一半导体器件，其中散热器的外圆周表面设置有线圈。

公开(公告)号：US20150214199A1

公开(公告)日：2015-07-30

申请号：US14452524

申请日：2014-08-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kwang Soo KIM ,  Joon Seok CHAE ,  Young Hoon KWAK

IPC: H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/373

CPC classification number: H01L25/165 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/85 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader.

Abstract translation: 这里公开了功率模块封装及其制造方法。 根据本发明的优选实施例，功率模块封装包括：引线框，其上安装有电连接到功率器件并控制功率器件的功率器件和控制IC; 以及热敏片，其结合到引线框架的一个表面，其中所述热敏片包括包含导热无机填料的第一和第二树脂层，并加入苯基缩水甘油醚（PGE）和烷基缩水甘油醚（烷基（ C12〜C14）缩水甘油醚）和设置在形成在第一和第二树脂层之间的键合界面处的金属材料的散热器。 因此，能够通过散热器的散热效果容易地提高功率组件封装的热性能。

公开(公告)号：US20140152271A1

公开(公告)日：2014-06-05

申请号：US13862131

申请日：2013-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： In Wha JEONG ,  Bum Seok SUH ,  Kwang Soo KIM

IPC: H02M7/06

CPC classification number: H02M7/066 ,  H02M1/4225 ,  H02M3/158 ,  H02M3/1584 ,  Y02B70/126

Abstract: There are provided a power factor correction device and a method for controlling power factor correction using the same. The power factor correction device includes a power factor correction circuit and a control circuit. The power factor correction circuit includes first and second inductors connected to an input power source stage and first and second main switches performing a switching operation on the first and second inductors, respectively. The control circuit may provide control signals to the first and second main switches, respectively, and when phase currents flowing in the respective first and second inductors are unbalanced, the control circuit may change a phase of at least one of the first and second main switches to correct an imbalance of the phases.

Abstract translation: 提供了功率因数校正装置和使用其进行功率因数校正的方法。 功率因数校正装置包括功率因数校正电路和控制电路。 功率因数校正电路包括连接到输入电源级的第一和第二电感器以及分别对第一和第二电感器执行开关操作的第一和第二主开关。 控制电路可以分别向第一和第二主开关提供控制信号，并且当在相应的第一和第二电感器中流动的相电流不平衡时，控制电路可以改变第一和第二主开关中的至少一个的相位 纠正阶段的不平衡。

公开(公告)号：US20140118956A1

公开(公告)日：2014-05-01

申请号：US13830122

申请日：2013-03-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kwang Soo KIM ,  Si Joong Yang ,  Bum Seok Suh ,  Young Hoon Kwak ,  Job Ha

IPC: H05K1/18

CPC classification number: H01L23/043 ,  H01L23/049 ,  H01L23/14 ,  H01L23/3735 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is an all-in-one power semiconductor module including a plurality of first semiconductor devices formed on a substrate; a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices; and a plurality of lead members integrally formed with the housing and electrically connecting the plurality of first semiconductor devices and the substrate.According to the present invention, reliability can be improved by increasing bonding areas and bonding strength of semiconductor devices as well as processibilty can be enhanced and failure is reduced by adjusting a step difference with respect to an arrangement and height of the semiconductor devices. Further, a processing time resulting from an omission of a wire bonding process is reduced.

Abstract translation: 这里公开了一种一体化功率半导体模块，其包括形成在基板上的多个第一半导体器件; 模制并形成为包括形成在多个第一半导体器件的上部的桥的壳体; 以及多个引线部件，与所述壳体一体地形成并且电连接所述多个第一半导体器件和所述基板。 根据本发明，通过增加接合面积和半导体器件的接合强度可以提高可靠性，并且通过调节相对于半导体器件的布置和高度的台阶差，可以提高加工性并降低故障。 此外，减少了由于省略引线键合处理而产生的处理时间。

公开(公告)号：US20150349230A1

公开(公告)日：2015-12-03

申请号：US14602725

申请日：2015-01-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kwang Soo KIM ,  Young Hoon KWAK ,  Joon Seok CHAE

IPC: H01L33/64 ,  B32B15/08

CPC classification number: H01L33/641 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2457/14 ,  Y10T428/252

Abstract: A heat radiation sheet for a board including: composite fillers including metal particles and ceramic particles disposed on surfaces of the metal particles; and a base resin, and a manufacturing method of a heat radiation sheet for a board may include: preparing metal particles and ceramic particles; disposing the ceramic particles on surfaces of the metal particles by mixing the metal particles and the ceramic particles with each other; forming oxidized layers on exposed surfaces of the metal particles; and forming a prepreg by mixing composite fillers including the metal particles and the ceramic particles and a base resin with each other.

Abstract translation: 一种用于板的散热片，包括：包含设置在金属颗粒表面上的金属颗粒和陶瓷颗粒的复合填料; 和基础树脂，并且用于基板的散热片的制造方法可以包括：制备金属颗粒和陶瓷颗粒; 通过将金属颗粒和陶瓷颗粒彼此混合来将陶瓷颗粒设置在金属颗粒的表面上; 在金属颗粒的暴露表面上形成氧化层; 以及通过将包括金属颗粒和陶瓷颗粒的复合填料和基础树脂彼此混合来形成预浸料。

公开(公告)号：US20150270207A1

公开(公告)日：2015-09-24

申请号：US14499181

申请日：2014-09-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Joon Seok Chae ,  Suk Ho Lee

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L21/768 ,  H01L23/538

CPC classification number: H01L23/49575 ,  H01L23/4334 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/5384 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/26135 ,  H01L2224/26145 ,  H01L2224/27312 ,  H01L2224/27334 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/32257 ,  H01L2224/35847 ,  H01L2224/37005 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40105 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/40499 ,  H01L2224/40991 ,  H01L2224/40993 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83007 ,  H01L2224/831 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/84007 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84815 ,  H01L2224/92157 ,  H01L2224/92165 ,  H01L2224/92166 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2224/83 ,  H01L2224/84

Abstract: There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.

Abstract translation: 提供了一种半导体模块封装，包括：通过在其上安装一个或多个第一半导体器件而形成的基底基板; 引线框架，形成在所述第一半导体器件的顶表面上，并且具有形成为用于注入焊膏的入口; 以及插入在第一半导体器件和引线框架之间的空间以形成分离空​​间，其中焊膏填充在分离空间中。