Abstract:
It is an object to provide a semiconductor device in which power consumption can be reduced. It is another object to provide a highly reliable semiconductor device using a programming cell, such as a programmable logic device (PLD). In accordance with a change in a configuration of connections between basic blocks, power supply voltage furnishing to the basic blocks is changed. That is, when the structure of connections between the basic blocks is such that a basic block does not contribute to a circuit, the supply of the power supply voltage to this basic block is stopped. Further, the supply of the power supply voltage to the basic blocks is controlled using a programming cell formed using a field effect transistor whose channel formation region is formed using an oxide semiconductor, the field effect transistor having extremely low off-state current or extremely low leakage current.
Abstract:
Provided is a field-effect transistor (FET) having small off-state current, which is used in a miniaturized semiconductor integrated circuit. The field-effect transistor includes a thin oxide semiconductor which is formed substantially perpendicular to an insulating surface, a gate insulating film formed to cover the oxide semiconductor, and a gate electrode which is formed to cover the gate insulating film. The gate electrode partly overlaps a source electrode and a drain electrode. The source electrode and the drain electrode are in contact with at least a top surface of the oxide semiconductor. In this structure, three surfaces of the thin oxide semiconductor are covered with the gate electrode, so that electrons injected from the source electrode or the drain electrode can be effectively removed, and most of the space between the source electrode and the drain electrode can be a depletion region; thus, off-state current can be reduced.
Abstract:
In a conventional DRAM, when the capacitance of a capacitor is reduced, an error of reading data easily occurs. A plurality of cells are connected to one bit line MBL_m. Each cell includes a sub bit line SBL_n_m and 4 to 64 memory cells (a memory cell CL_n_m_1 or the like). Further, each cell includes selection transistors STr1_n_m and STr2_n_m and an amplifier circuit AMP_n_m that is a complementary inverter or the like is connected to the selection transistor STr2_n_m. Since parasitic capacitance of the sub bit line SBL_n_m is sufficiently small, potential change due to electric charge in a capacitor of each memory cell can be amplified by the amplifier circuit AMP_n_m without an error, and can be output to the bit line.
Abstract:
A semiconductor device which stores data by using a transistor whose leakage current between source and drain in an off state is small as a writing transistor. In a matrix including a plurality of memory cells in which a drain of the writing transistor is connected to a gate of a reading transistor and the drain of the writing transistor is connected to one electrode of a capacitor, a gate of the writing transistor is connected to a writing word line; a source of the writing transistor is connected to a writing bit line; and a source and a drain of the reading transistor are connected to a reading bit line and a bias line. In order to reduce the number of wirings, the writing bit line or the bias line is substituted for the reading bit line in another column.
Abstract:
A semiconductor memory device in which capacitance of a capacitor is lower and integration degree is higher. A plurality of memory blocks is connected to one bit line BL_m. A memory block MB_n_m includes a sub bit line SBL_n_m, a write switch, and a plurality of memory cells. A sub bit line SBL_n+1_m adjacent to the sub bit line SBL_n_m is connected to an amplifier circuit AMP_n/n+1_m including two inverters and two selection switches. A circuit configuration of the amplifier circuit can be changed with the selection switches. The amplifier circuit is connected to the bit line BL_m through a read switch. Because of a sufficiently low capacitance of the sub bit line SBL_n_m, potential change due to electric charges of the capacitor in each memory cell can be amplified by the amplifier circuit AMP_n/n+1_m without an error, and the amplified data can be output to the bit line BL_m.
Abstract translation:一种半导体存储器件,其中电容器的电容较低并且集成度较高。 多个存储块连接到一个位线BL_m。 存储块MB_n_m包括子位线SBL_n_m,写入开关和多个存储器单元。 与子位线SBL_n_m相邻的子位线SBL_n + 1_m连接到包括两个反相器和两个选择开关的放大器电路AMP_n / n + 1_m。 可以通过选择开关来改变放大器电路的电路配置。 放大器电路通过读开关连接到位线BL_m。 由于子位线SBL_n_m的足够低的电容,可以通过放大器电路AMP_n / n + 1_m放大每个存储单元中的电荷引起的电位变化,并且将放大的数据输出到 位线BL_m。
Abstract:
A memory element capable of operating at high speed and reducing power consumption and a signal processing circuit including the memory element are provided. As a writing transistor, a transistor which is formed using an oxide semiconductor and has significantly high off-state resistance is used. In a memory element in which a source of the writing transistor is connected to an input terminal of an inverter, a control terminal of a transfer gate, or the like, the threshold voltage of the writing transistor is lower than a low-level potential. The highest potential of a gate of the writing transistor can be a high-level potential. When the potential of data is the high-level potential, there is no potential difference between a channel and the gate; thus, even when the writing transistor is subsequently turned off, a potential on the source side hardly changes.
Abstract:
A level shifter converting a binary signal having a first potential and a second potential into a signal having the first potential and a third potential, and a signal processing circuit using the level shifter are provided. The first potential is higher than the second potential. The second potential is higher than the third potential. The potential difference between the first potential and the third potential may be more than or equal to 3 V and less than 4 V. The level shifter includes a current control circuit which generates a second signal for operating an amplifier circuit for a certain period in accordance with the potential change of the first signal which is input to the amplifier circuit. The output of level shifter is input to a gate of an N-channel transistor whose threshold voltage is lower than 0 V.
Abstract:
To optimize the arrangement of configuration data stored in a configuration memory. A lookup table includes a memory configured to store configuration data, a plurality of multiplexers each configured to select one signal from a plurality of input signals in accordance with the configuration data supplied from the memory and output the one signal, and an inverter. The plurality of multiplexers are connected in a binary tree with multiple levels. The inverter is provided between one of input terminals of a multiplexer in an uppermost level and an output terminal of a multiplexer in one level lower than the uppermost level. Signal selection is performed in each of the multiplexers so that the multiplexer in the uppermost level outputs, as an output signal, one signal of all input signals of the multiplexers in a lowermost level.
Abstract:
An object is to increase the conductivity of an electrode including active material particles and the like, which is used for a battery. Two-dimensional carbon including 1 to 10 graphenes is used as a conduction auxiliary agent, instead of a conventionally used conduction auxiliary agent extending only one-dimensionally at most, such as graphite particles, acetylene black, or carbon fibers. A conduction auxiliary agent extending two-dimensionally has higher probability of being in contact with active material particles or other conduction auxiliary agents, so that the conductivity can be improved.
Abstract:
Provided is a field-effect transistor (FET) having small off-state current, which is used in a miniaturized semiconductor integrated circuit. The field-effect transistor includes a thin oxide semiconductor which is formed substantially perpendicular to an insulating surface and has a thickness of greater than or equal to 1 nm and less than or equal to 30 nm, a gate insulating film formed to cover the oxide semiconductor, and a strip-like gate which is formed to cover the gate insulating film and has a width of greater than or equal to 10 nm and less than or equal to 100 nm. In this structure, three surfaces of the thin oxide semiconductor are covered with the gate, so that electrons injected from a source or a drain can be effectively removed, and most of the space between the source and the drain can be a depletion region; thus, off-state current can be reduced.