Abstract:
A method of fabricating a semiconductor memory device includes forming a mold stack on a substrate and the mold stack including first sacrificial layers and second sacrificial layers alternately stacked on the substrate. The method also includes forming a plurality of vertical channels that penetrate the mold stack and that contact the substrate, patterning the mold stack to form word line cuts between the vertical channels, the word line cuts exposing the substrate, removing one of the first and second sacrificial layers to form recessed regions in the mold stack, forming a data storage layer, at least a portion of the data storage layer being formed between the vertical channels and the gates, forming gates in the recessed regions, forming air gaps between the gates by removing the other of the first and second sacrificial layers, and forming an insulation layer pattern in the word line cuts.
Abstract:
A semiconductor device includes a substrate having a first region and a second region, a first MOS transistor including a first fin structure and a first gate electrode in the first region, the first fin structure having a first buffer pattern, a second buffer pattern, and a first channel pattern which are sequentially stacked on the substrate, and a second MOS transistor including a second fin structure and a second gate electrode in the second region, the second fin structure having a third buffer pattern and a second channel pattern which are sequentially stacked on the substrate. Related fabrication methods are also discussed.
Abstract:
A nonvolatile memory device is provided. The device may include a plurality of cell strings that are configured to share a bit line, word lines, and selection lines. Each of the cell strings may include a plurality of memory cells connected in series to each other and a string selection device controlling connections between the memory cells and the bit line, and the string selection device may include a first string selection element with a first threshold voltage and a second string selection element connected in series to the first string selection element and having a second threshold voltage different from the first threshold voltage. At least one of the first and second string selection elements may include a plurality of switching elements connected in series to each other.
Abstract:
An erase method of a resistive random access memory which includes a plurality of cell strings, each having a plurality of memory cells and a string selection transistor, includes applying a first voltage to bit lines connected with string selection transistors of the plurality of cell strings, applying a turn-on voltage to at least one string selection line selected from string selection lines connected with the string selection transistors, applying a turn-off voltage to unselected string selection lines of the string selection lines, applying a second voltage to at least one word line selected from word lines connected with memory cells of the plurality of cell strings, and floating unselected word lines of the word lines.
Abstract:
A read method of a vertical resistance memory device including resistance memory cells arranged in a three-dimensional array includes selecting a block from a plurality of blocks, applying a read voltage to a word line selected from word lines of the block, applying a sensing reference voltage to bit lines sharing the plurality of blocks, applying a string selection voltage to a string selection transistor through a string selection line selected from a plurality of string selection lines of the block, wherein the string selection line is connected to a gate of the string selection transistor; and determining a memory state of a memory cell selected from the plurality of resistance memory cells by the word line and the string selection line based on a current flowing through the memory cell, wherein the word line is connected through a corresponding horizontal electrode to the memory cell.
Abstract:
Integrated circuit memory devices include a plurality of vertically-stacked strings of nonvolatile memory cells having respective vertically-arranged channel regions therein electrically coupled to an underlying substrate. A control circuit is provided, which is configured to drive the vertical channel regions with an erase voltage that is ramped from a first voltage level to a higher second voltage level during an erase time interval. This ramping of the erase voltage promotes time efficient erasure of vertically stacked nonvolatile memory cells with reduced susceptibility to inadvertent programming of ground and string selection transistors (GST, SST).
Abstract:
A method of programming a vertical resistance memory device including a plurality of resistance memory cells arranged in a plurality of blocks includes a step of selecting a block from the plurality of blocks, a step of applying a set voltage to a word line selected from word lines, wherein the selected word line is connected through a corresponding horizontal electrode to a resistance memory cell to be programmed, a step of applying a set-inhibition voltage to unselected word lines of the word lines, a step of applying a bit voltage to a bit line selected from bit lines, wherein the selected bit line is electrically connected to the resistance memory cell via a string selection transistor selected from string selection transistors; and a step of applying a bit-inhibition voltage to unselected bit lines of the bit lines.
Abstract:
A semiconductor device includes a substrate having a first region and a second region, a first MOS transistor including a first fin structure and a first gate electrode in the first region, the first fin structure having a first buffer pattern, a second buffer pattern, and a first channel pattern which are sequentially stacked on the substrate, and a second MOS transistor including a second fin structure and a second gate electrode in the second region, the second fin structure having a third buffer pattern and a second channel pattern which are sequentially stacked on the substrate. Related fabrication methods are also discussed.
Abstract:
A nonvolatile memory device and method of manufacturing the same are provided. In the nonvolatile memory device, a blocking insulation layer is provided between a trap insulation layer and a gate electrode. A fixed charge layer spaced apart from the gate electrode is provided in the blocking insulation layer. Accordingly, the reliability of the nonvolatile memory device is improved.
Abstract:
A semiconductor memory device is provided including first and second cell strings formed on a substrate, the first and second cell strings jointly connected to a bit line, wherein each of the first and second cell strings includes a ground selection unit, a memory cell, and first and second string selection units sequentially formed on the substrate to be connected to each other, wherein the ground selection unit is connected to a ground selection line, the memory cell is connected to a word line, the first string selection unit is connected to a first string selection line, and the second string selection unit is connected to a second string selection line, and wherein the second string selection unit of the first cell string has a channel dopant region.