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公开(公告)号:US11086345B2
公开(公告)日:2021-08-10
申请号:US16935610
申请日:2020-07-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seok-won Lee , Nam-seog Kim
IPC: G05F1/575
Abstract: An integrated circuit including: an oscillator configured to generate an oscillating voltage with a predetermined oscillation frequency in an oscillation period; a voltage regulator configured to generate an output voltage for driving the oscillator and provide the output voltage to the oscillator; and a current injection circuit configured to provide an oscillation current to the oscillator, in response to an oscillation enable signal in the oscillation period.
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公开(公告)号:US20190253060A1
公开(公告)日:2019-08-15
申请号:US16397204
申请日:2019-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam-seog Kim , Sang-soo Ko , Byoung-joong Kang
CPC classification number: H03L7/24 , H03B27/00 , H03B2200/0074 , H03K5/1565 , H03K21/026 , H03K21/10 , H03K21/17 , H03L5/02 , H03L7/00 , H03L7/0992 , H03L7/101 , H04B1/403
Abstract: A local oscillator generator (LO generator) may be configured to transmit an LO signal to a mixer. The LO generator may include an input buffer configured to generate a first internal oscillator signal based on the input oscillator signal. The LO generator may include a frequency dividing circuit configured to generate a second internal oscillator signal based on dividing a frequency of the first internal oscillator signal. The LO generator may include an output buffer configured to generate the LO signal based on the second internal oscillator signal. The input buffer and the frequency dividing circuit may each be configured to receive a power voltage independently of the output buffer.
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公开(公告)号:US09245827B2
公开(公告)日:2016-01-26
申请号:US14262693
申请日:2014-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Uk-song Kang , Dong-hyeon Jang , Seong-jin Jang , Hoon Lee , Jin-ho Kim , Nam-seog Kim , Byung-sik Moon , Woo-dong Lee
CPC classification number: H01L23/481 , G11C5/06 , G11C8/18 , H01L22/32 , H01L24/05 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/0557 , H01L2224/05572 , H01L2224/16145 , H01L2224/16146 , H01L2224/17051 , H01L2224/17515 , H01L2224/73204 , H01L2224/94 , H01L2225/06513 , H01L2225/06544 , H01L2225/06596 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00
Abstract: A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked.
Abstract translation: 三维(3D)半导体器件可以包括一堆芯片,包括主芯片和一个或多个从芯片。 从芯片的I / O连接不需要连接到主板上的通道,只有主芯片的电极焊盘可以连接到通道。 只有主芯片可以为通道提供负载。 可以在堆叠相同类型的半导体芯片的半导体器件的数据输入路径,数据输出路径,地址/命令路径和/或时钟路径上设置贯穿衬底通孔(TSV)边界。
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公开(公告)号:US20140233292A1
公开(公告)日:2014-08-21
申请号:US14262693
申请日:2014-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Uk-song Kang , Dong-hyeon Jang , Seong-jin Jang , Hoon Lee , Jin-ho Kim , Nam-seog Kim , Byung-sik Moon , Woo-dong Lee
CPC classification number: H01L23/481 , G11C5/06 , G11C8/18 , H01L22/32 , H01L24/05 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/0557 , H01L2224/05572 , H01L2224/16145 , H01L2224/16146 , H01L2224/17051 , H01L2224/17515 , H01L2224/73204 , H01L2224/94 , H01L2225/06513 , H01L2225/06544 , H01L2225/06596 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00
Abstract: A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked.
Abstract translation: 三维(3D)半导体器件可以包括一堆芯片,包括主芯片和一个或多个从芯片。 从芯片的I / O连接不需要连接到主板上的通道,只有主芯片的电极焊盘可以连接到通道。 只有主芯片可以为通道提供负载。 可以在堆叠相同类型的半导体芯片的半导体器件的数据输入路径,数据输出路径,地址/命令路径和/或时钟路径上设置贯穿衬底通孔(TSV)边界。
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公开(公告)号:US10747250B2
公开(公告)日:2020-08-18
申请号:US16453149
申请日:2019-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seok-won Lee , Nam-seog Kim
IPC: G05F1/575
Abstract: An integrated circuit including: an oscillator configured to generate an oscillating voltage with a predetermined oscillation frequency in an oscillation period; a voltage regulator configured to generate an output voltage for driving the oscillator and provide the output voltage to the oscillator; and a current injection circuit configured to provide an oscillation current to the oscillator, in response to an oscillation enable signal in the oscillation period.
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公开(公告)号:US10547315B2
公开(公告)日:2020-01-28
申请号:US16202172
申请日:2018-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jae-won Choi , Nam-seog Kim
Abstract: A frequency divider may include: a core circuit including a first flip-flop loop and a second flip-flop loop, wherein each of the first flip-flop loop and the second flip-flop loop divides a frequency of a clock signal received via a control terminal of a flip-flop, wherein the core circuit is configured to: output a frequency-divided signal, based on a first signal output by the first flip-flop loop and a second signal output by the second flip-flop loop, the first and second signals having same frequency-division ratios and different phases, and feed back the frequency-divided signal via an input terminal of each of the first and second flip-flop loops; a duty correction circuit that receives the frequency-divided signal and outputs a differential output signal that is generated by correcting a duty ratio of the frequency-divided signal; and an output circuit that outputs a first output signal, which is a signal amplified from the differential output signal, and a second output signal that is a quadrature signal of the first output signal.
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公开(公告)号:US10326460B2
公开(公告)日:2019-06-18
申请号:US15869437
申请日:2018-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam-seog Kim , Sang-soo Ko , Byoung-joong Kang
IPC: H03L5/02 , H03L7/00 , H03B27/00 , H03K21/17 , H03L7/099 , H03L7/24 , H03K21/02 , H03K5/156 , H03K21/10 , H03L7/10
Abstract: A local oscillator generator (LO generator) may be configured to transmit an LO signal to a mixer. The LO generator may include an input buffer configured to generate a first internal oscillator signal based on the input oscillator signal. The LO generator may include a frequency dividing circuit configured to generate a second internal oscillator signal based on dividing a frequency of the first internal oscillator signal. The LO generator may include an output buffer configured to generate the LO signal based on the second internal oscillator signal. The input buffer and the frequency dividing circuit may each be configured to receive a power voltage independently of the output buffer.
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公开(公告)号:US10715159B2
公开(公告)日:2020-07-14
申请号:US16397204
申请日:2019-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam-seog Kim , Sang-soo Ko , Byoung-joong Kang
IPC: H03L7/24 , H03L7/00 , H03L7/099 , H03B27/00 , H03L5/02 , H04B1/403 , H03K5/156 , H03K21/02 , H03K21/10 , H03L7/10 , H03K21/17
Abstract: A local oscillator generator (LO generator) may be configured to transmit an LO signal to a mixer. The LO generator may include an input buffer configured to generate a first internal oscillator signal based on the input oscillator signal. The LO generator may include a frequency dividing circuit configured to generate a second internal oscillator signal based on dividing a frequency of the first internal oscillator signal. The LO generator may include an output buffer configured to generate the LO signal based on the second internal oscillator signal. The input buffer and the frequency dividing circuit may each be configured to receive a power voltage independently of the output buffer.
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公开(公告)号:US20190165790A1
公开(公告)日:2019-05-30
申请号:US16202172
申请日:2018-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jae-won Choi , Nam-seog Kim
Abstract: A frequency divider may include: a core circuit including a first flip-flop loop and a second flip-flop loop, wherein each of the first flip-flop loop and the second flip-flop loop divides a frequency of a clock signal received via a control terminal of a flip-flop, wherein the core circuit is configured to: output a frequency-divided signal, based on a first signal output by the first flip-flop loop and a second signal output by the second flip-flop loop, the first and second signals having same frequency-division ratios and different phases, and feed back the frequency-divided signal via an input terminal of each of the first and second flip-flop loops; a duty correction circuit that receives the frequency-divided signal and outputs a differential output signal that is generated by correcting a duty ratio of the frequency-divided signal; and an output circuit that outputs a first output signal, which is a signal amplified from the differential output signal, and a second output signal that is a quadrature signal of the first output signal.
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公开(公告)号:US10122378B2
公开(公告)日:2018-11-06
申请号:US15869854
申请日:2018-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam-seog Kim
Abstract: A digital-to-time converter includes: a digital-to-analog converter configured to generate a precharge voltage corresponding to a value of a digital code; a ramp generator configured to precharge a capacitor connected to a first node based on the precharge voltage, and to charge or discharge the capacitor based on a reference current provided from a current source in response to a transition of an input clock signal to generate a ramp voltage in the first node; and a comparator configured to generate an output clock signal based on the ramp voltage, wherein the ramp generator includes: a first switching circuit configured to provide a first current path between a second node connected to the current source and the first node; and a second switching circuit configured to provide a second current path from a power supply voltage source to the second node.
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