STANDARD CELL DESIGN SYSTEM, STANDARD CELL DESIGN OPTIMIZATION METHOD THEREOF, AND SEMICONDUCTOR DESIGN SYSTEM

    公开(公告)号:US20200082051A1

    公开(公告)日:2020-03-12

    申请号:US16390087

    申请日:2019-04-22

    Abstract: A standard cell design system is provided. The standard cell design system includes at least one processor configured to implement: a control engine that determines planar parameters and vertical parameters of a target standard cell, a three-dimensional structure generating engine that generates a three-dimensional structure of the target standard cell based on the planar parameters and the vertical parameters, an extraction engine that extracts a standard cell model of the target standard cell from the three-dimensional structure, an assessment engine that performs a plurality of assessment operations based on the standard cell model, and an auto-optimizing engine that adjusts, based on a machine learning algorithm, the planar parameters and the vertical parameters based on results of the plurality of assessment operations.

    Integrated circuit device
    3.
    发明授权

    公开(公告)号:US12261208B2

    公开(公告)日:2025-03-25

    申请号:US18538575

    申请日:2023-12-13

    Abstract: An integrated circuit device includes a fin-type active region disposed on a substrate and extending in a first horizontal direction, a gate line disposed on the fin-type active region and extending in a second horizontal direction intersecting the first horizontal direction, the gate line including, a connection protrusion portion including a protrusion top surface at a first vertical level from the substrate, and a main gate portion including a recess top surface extending in the second horizontal direction from the connection protrusion portion, the recess top surface being at a second vertical level lower than the first vertical level, a gate contact disposed on the gate line and connected to the connection protrusion portion, a source/drain region disposed on the fin-type active region and disposed adjacent to the gate line, and a source/drain contact disposed on the source/drain region.

    FinFET semiconductor device and method of manufacturing the same
    4.
    发明授权
    FinFET semiconductor device and method of manufacturing the same 有权
    FinFET半导体器件及其制造方法

    公开(公告)号:US09130040B2

    公开(公告)日:2015-09-08

    申请号:US14248594

    申请日:2014-04-09

    CPC classification number: H01L29/785 H01L27/092 H01L29/66795 H01L29/7853

    Abstract: Provided are a semiconductor device and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an active fin on a substrate; oxidizing a portion of the active fin to form an insulating pattern between the active fin and the substrate; forming a first gate pattern on the substrate, wherein the first gate pattern crosses the active fin; exposing the substrate on both sides of the first gate pattern; and forming source/drain regions on the exposed substrate.

    Abstract translation: 提供半导体器件及其制造方法。 制造半导体器件的方法包括:在衬底上形成有源散热片; 氧化活性鳍片的一部分以在活性鳍片和衬底之间形成绝缘图案; 在所述衬底上形成第一栅极图案,其中所述第一栅极图案与所述有源鳍片交叉; 在第一栅极图案的两侧上暴露衬底; 以及在暴露的衬底上形成源极/漏极区域。

    Method and apparatus for estimating aging of integrated circuit

    公开(公告)号:US11972185B2

    公开(公告)日:2024-04-30

    申请号:US16919157

    申请日:2020-07-02

    CPC classification number: G06F30/3308 G06F2119/04

    Abstract: A method of estimating aging of an integrated circuit (IC) includes: obtaining a first process design kit (PDK) including a plurality of first device models corresponding to a plurality of devices provided by a process of fabricating the IC; obtaining values of aging parameters of device instances included in a netlist defining the IC, by performing a first circuit simulation based on the netlist and the first PDK; and obtaining aging data of the IC by performing a second circuit simulation based on the values of the aging parameters and the netlist, wherein each of the plurality of first device models includes at least one measurement command to be executed in the first circuit simulation to calculate an aging parameter.

    SEMICONDUCTOR DEVICE
    6.
    发明申请

    公开(公告)号:US20220285511A1

    公开(公告)日:2022-09-08

    申请号:US17455681

    申请日:2021-11-19

    Abstract: A semiconductor device includes active regions extending on a substrate in a first direction, gate structures intersecting the active regions and extending on the substrate in a second direction, source/drain regions in recess regions in which the active regions are recessed, on both sides of each of the gate structures, and contact plugs connected to the source/drain regions, wherein each of the source/drain regions include first and second epitaxial layers sequentially stacked on the active regions in the recess regions in a third direction perpendicular to an upper surface of the substrate, respectively, and wherein ratios of the first epitaxial layer thickness in the third direction to the second epitaxial layer thickness in the third direction are different in different ones of the source/drain regions.

    IMAGE SENSORS HAVING GRATING STRUCTURES THEREIN THAT PROVIDE ENHANCED DIFFRACTION OF INCIDENT LIGHT

    公开(公告)号:US20200075656A1

    公开(公告)日:2020-03-05

    申请号:US16286897

    申请日:2019-02-27

    Abstract: An image sensor may include a semiconductor substrate having a light receiving surface thereon and a plurality of spaced-apart semiconductor photoelectric conversion regions at adjacent locations therein. A grating structure is provided on the light receiving surface. This grating structure extends opposite each of the plurality of spaced-apart photoelectric conversion regions. An optically-transparent layer is provided on the grating structure. This grating structure includes a plurality of spaced-apart grating patterns, which can have the same height and the same width. In addition, the grating patterns may be spaced apart from each other by a uniform distance. The grating structure is configured to selectively produce ±1 or higher order diffraction lights to the photoelectric conversion regions, in response to light incident thereon.

    SEMICONDUCTOR DEVICE
    10.
    发明申请

    公开(公告)号:US20250098224A1

    公开(公告)日:2025-03-20

    申请号:US18967518

    申请日:2024-12-03

    Abstract: A semiconductor device includes active regions extending on a substrate in a first direction, gate structures intersecting the active regions and extending on the substrate in a second direction, source/drain regions in recess regions in which the active regions are recessed, on both sides of each of the gate structures, and contact plugs connected to the source/drain regions, wherein each of the source/drain regions include first and second epitaxial layers sequentially stacked on the active regions in the recess regions in a third direction perpendicular to an upper surface of the substrate, respectively, and wherein ratios of the first epitaxial layer thickness in the third direction to the second epitaxial layer thickness in the third direction are different in different ones of the source/drain regions.

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