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1.发明申请METHOD AND DEVICE FOR TRANSMITTING AND RECEIVING SIGNAL BY USING MULTIPLE BEAMS IN WIRELESS COMMUNICATION SYSTEM 审中-公开通过在无线通信系统中使用多个信元发送和接收信号的方法和装置公开(公告)号：US20160285164A1
公开(公告)日：2016-09-29
申请号：US15035201
申请日：2014-11-06
Inventor： Sang-Hyouk Choi , Yong-Hoon Kim , Hee-Seong Yang , Joo-Hwan Chun
IPC: H01Q3/38
CPC classification number: H01Q3/38 , G01S19/36 , H01Q3/26 , H01Q3/36 , H04B7/0408
Abstract: A method for receiving a signal by using M multiple beams in a multi-antenna system including N antenna elements, is provided in and embodiment of the present application. The method includes setting, by M beams, a beam direction for the M beams and a modulation frequency for frequency modulation of a beam response and generating the M beams according to the beam direction and the modulation frequency set by the beams. M beam responses are generated for a receiving signal by using the generated M beams and the generated M beam responses are frequency modulated by using the modulation frequency set by the beams. The frequency-modulated M beam responses are band-pass filtered so as to separate the M beam responses and the separated M beam responses are respectively demodulated.
Abstract translation: 在本申请的实施例中提供了一种在包括N个天线元件的多天线系统中使用M个多波束来接收信号的方法。 该方法包括通过M个波束设置M个波束的波束方向和用于波束响应的频率调制的调制频率，并根据波束方向和由波束设置的调制频率来生成M个波束。 通过使用所生成的M个波束对接收信号生成M个波束响应，并且通过使用由波束设置的调制频率对生成的M个波束响应进行频率调制。 对频率调制的M波束响应进行带通滤波，以分离M波束响应，分离的M波束响应分别被解调。
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2.发明申请SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP 审中-公开半导体芯片和具有包装（POP）结构的封装的半导体封装，包括半导体芯片公开(公告)号：US20160126229A1
公开(公告)日：2016-05-05
申请号：US14992174
申请日：2016-01-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong-Hoon Kim , Hyo-Soon Kang , Hee-Seok Lee , Jang-Ho Cho
IPC: H01L25/18 , H01L23/50 , H01L23/31 , H01L25/065 , H01L23/00
CPC classification number: H01L25/18 , G11C5/025 , H01L21/563 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L24/17 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.
Abstract translation: 一种半导体芯片，包括衬底，布置在衬底上的第一数据焊盘和布置在衬底上的第一控制/寻址焊盘，其中第一数据焊盘布置在衬底的边缘区域中，并且第一控制/地址焊盘 布置在基板的中心区域中。
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3.发明授权Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer 有权堆叠封装结构和形成包括电磁屏蔽层的封装封装器件的方法公开(公告)号：US09520387B2
公开(公告)日：2016-12-13
申请号：US14504972
申请日：2014-10-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong-Hoon Kim , Hee-Seok Lee , Seong-Ho Shin , Se-Ho You , Yun-Hee Lee
IPC: H01L21/00 , H01L25/00 , H01L23/31 , H01L23/552 , H01L25/10 , H01L25/16 , H01L23/522 , H01L23/00
CPC classification number: H01L25/50 , H01L23/3128 , H01L23/5226 , H01L23/552 , H01L24/11 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/06568 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01012 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/1436 , H01L2924/1438 , H01L2924/15311 , H01L2924/15321 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.
Abstract translation: 提供堆叠的包装结构。 堆叠封装结构包括：堆叠封装，包括下半导体封装，设置在下半导体封装上并与下半导体封装隔开预定距离的上半导体封装;电连接下半导体封装和 上部半导体封装，同时支撑它们之间的空间，以及绝缘层，其至少设置在所述封装间连接部分的外部并填充所述下部半导体封装和所述上部半导体封装之间的空间，以及围绕所述下部半导体封装的横向和顶部表面的电磁屏蔽层 堆叠包装。
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公开(公告)号：US10389023B2
公开(公告)日：2019-08-20
申请号：US15035201
申请日：2014-11-06
Inventor： Sang-Hyouk Choi , Yong-Hoon Kim , Hee-Seong Yang , Joo-Hwan Chun
Abstract: A method for receiving a signal by using M multiple beams in a multi-antenna system including N antenna elements, is provided in and embodiment of the present application. The method includes setting, by M beams, a beam direction for the M beams and a modulation frequency for frequency modulation of a beam response and generating the M beams according to the beam direction and the modulation frequency set by the beams. M beam responses are generated for a receiving signal by using the generated M beams and the generated M beam responses are frequency modulated by using the modulation frequency set by the beams. The frequency-modulated M beam responses are band-pass filtered so as to separate the M beam responses and the separated M beam responses are respectively demodulated.
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公开(公告)号：US08970042B2
公开(公告)日：2015-03-03
申请号：US13674331
申请日：2012-11-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bok-Sik Myung , Chul-Woo Kim , Kyung-Tae Na , Young-Bae Kim , Yong-Hoon Kim , Hee-Seok Lee
CPC classification number: H05K1/0298 , H01L23/28 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/105 , H01L2224/131 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H05K1/02 , H05K3/4602 , H05K3/4644 , H05K2201/0191 , H05K2201/09136 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
Abstract: A circuit board is provided including a core insulation film having a thickness and including a first surface and an opposite second surface, an upper stack structure and a lower stack structure. The upper stack structure has a thickness and has an upper conductive pattern having a thickness and an overlying upper insulation film stacked on the first surface of the core insulation film. The lower stack structure has a thickness and has a lower conductive pattern having a thickness and an overlying lower insulation film stacked on the second surface of the core insulation film. A ratio P of a sum of the thicknesses of the upper conductive pattern and the lower conductive pattern to a sum of the thicknesses of the core insulation film, the upper stack structure and the lower stack structure is in a range from about 0.05 to about 0.2.
Abstract translation: 提供一种电路板，包括具有厚度并包括第一表面和相对的第二表面的芯绝缘膜，上堆叠结构和下堆叠结构。 上堆叠结构具有厚度并且具有层叠在芯绝缘膜的第一表面上的厚度的上导电图案和覆盖的上绝缘膜。 下堆叠结构具有厚度并且具有厚度较低的导电图案和堆叠在芯绝缘膜的第二表面上的覆盖的下绝缘膜。 上导电图案和下导电图案的厚度之和与芯绝缘膜，上堆叠结构和下堆叠结构的厚度之和的比率P在约0.05至约0.2的范围内 。
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Patent Agency Ranking
6.发明授权Semiconductor package having EMI shielding function and heat dissipation function 有权具有EMI屏蔽功能和散热功能的半导体封装公开(公告)号：US08921993B2
公开(公告)日：2014-12-30
申请号：US14153327
申请日：2014-01-13
Applicant: Samsung Electronics Co., Ltd
Inventor： In-Ho Choi , Yong-Hoon Kim , Seong-Ho Shin
IPC: H01L23/52 , H01L23/552
CPC classification number: H01L23/552 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/131 , H01L2224/16225 , H01L2224/2929 , H01L2224/29339 , H01L2224/29387 , H01L2224/29388 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15192 , H01L2924/15311 , H01L2924/1615 , H01L2924/16251 , H01L2924/16724 , H01L2924/16747 , H01L2924/00012 , H01L2924/014 , H01L2924/00
Abstract: A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.
Abstract translation: 半导体封装包括衬底，位于衬底的顶表面上的半导体芯片，形成在衬底的顶表面上并被配置为允许不同类型的信号从其输入/输出的信号线，形成的接地线单元 在基板的顶表面上，并且将信号线分成信号线，以使相同类型的信号被输入/输出为彼此隔离的信号线，被配置为接触地线单元的阻挡壁和热量 设置在半导体芯片上的散热单元，其中接地线单元包括位于半导体芯片周围的基板的对角线方向的对角线，而散热单元包括位于半导体芯片顶表面上的热界面材料（TIM） 芯片，以及配置成覆盖TIM和基板的散热板。
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公开(公告)号：US08884421B2
公开(公告)日：2014-11-11
申请号：US14143178
申请日：2013-12-30
Applicant: Samsung Electronics Co., Ltd
Inventor： Un-Byoung Kang , Jong-Joo Lee , Yong-Hoon Kim , Tae-Hong Min
IPC: H01L23/02 , H01L23/367 , H01L25/00 , H01L23/498 , H01L25/065 , H01L23/31
CPC classification number: H01L23/49827 , H01L23/3128 , H01L23/367 , H01L23/3677 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/06181 , H01L2224/13025 , H01L2224/16146 , H01L2224/16235 , H01L2224/16245 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/15311
Abstract: A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.
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公开(公告)号：US09812789B2
公开(公告)日：2017-11-07
申请号：US14916990
申请日：2014-09-03
Inventor： Won-Seok Lee , Seung-Tae Khang , Yong-Hoon Kim , Kyoung-Sub Oh , Jong-Won Yu
CPC classification number: H01Q21/20 , H01Q21/061
Abstract: The present invention relates to an array antenna apparatus, comprising: a first antenna element arranged in the center of the outermost concentric circle having a radius determined according to the beam width of a beam to transmit; and antenna element sets arranged on the circumference of each of concentric circles arranged to have a predetermined interval within the outermost concentric circle, wherein each of the antenna element sets comprises an odd number of second antenna elements, and only one antenna element exists on a straight line corresponding to the radius.
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公开(公告)号：US09634750B2
公开(公告)日：2017-04-25
申请号：US14671105
申请日：2015-03-27
Inventor： Se-Min Kwak , Yong-Hoon Kim , Hee-Seong Yang , Sang-Hyouk Choi , Joo-Hwan Chun
CPC classification number: H04B7/0617 , H04B7/0695
Abstract: A beamforming method is provided. The beamforming method includes determining different beams for pieces of user equipment based on channel information fed back from the pieces of user equipment, predicting beam qualities of the pieces of user equipment for the beams, determining whether the beam qualities satisfy Quality of Service (QoS) for the pieces of user equipment, generating a wide nulling beam by applying wide nulling to a second beam having a side lobe acting as interference against one first beam, when the beam quality of the first beam does not satisfy the QoS; predicting beam qualities for the beams including the wide nulling beam instead of the second beam, and simultaneously communicating with the user equipment through the beams including the wide nulling beam instead of the second beam, when the beam qualities for the beams including the wide nulling beam instead of the second beam satisfy the QoS.
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10.发明申请ARRAY ANTENNA APPARATUS FOR IMPLEMENTING PREDETERMINED BEAM WIDTH USING PREDETERMINED NUMBER OF ANTENNA ELEMENTS 有权使用预定数量的天线元件实现预测光束宽度的阵列天线装置公开(公告)号：US20160218440A1
公开(公告)日：2016-07-28
申请号：US14916990
申请日：2014-09-03
Inventor： Won-Seok Lee , Seung-Tae Khang , Yong-Hoon Kim , Kyoung-Sub Oh , Jong-Won Yu
CPC classification number: H01Q21/20 , H01Q21/061
Abstract: The present invention relates to an array antenna apparatus, comprising: a first antenna element arranged in the center of the outermost concentric circle having a radius determined according to the beam width of a beam to transmit; and antenna element sets arranged on the circumference of each of concentric circles arranged to have a predetermined interval within the outermost concentric circle, wherein each of the antenna element sets comprises an odd number of second antenna elements, and only one antenna element exists on a straight line corresponding to the radius.
Abstract translation: 阵列天线装置技术领域本发明涉及一种阵列天线装置，包括：第一天线元件，布置在最外同心圆的中心，具有根据要发射的波束的波束宽度确定的半径; 以及布置在每个同心圆的圆周上的天线元件组，其布置成在最外同心圆内具有预定间隔，其中每个天线元件组包括奇数个第二天线元件，并且在直线上仅存在一个天线元件 线对应的半径。
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