摘要:
A three dimensional memory device includes a memory device region containing a plurality of non-volatile memory devices, a peripheral device region containing active driver circuit devices, and a stepped surface region between the peripheral device region and the memory device region containing a plurality of passive driver circuit devices.
摘要:
In a programming operation of a 3D stacked non-volatile memory device, an initial set of memory cells on a selected word line layer, involving fewer than all memory cells on a selected word line layer, are programmed first as a test case to determine optimal conditions for programming the remaining memory cells on the selected word line layer. For example, a number of program-verify iterations or loops which are needed to program the initial set of memory cells an initial amount is determined. This loop count is then stored, e.g., within the initial set of memory cells, within the remaining memory cells, within memory cells on a remaining word line layer, or in a data register, and programming of the initial set of memory cells continues to completion. Subsequently, the loop count is retrieved and used to determine an optimal starting program voltage for programming the remaining memory cells.
摘要:
A vertical, columnar resistor in a semiconductor device is provided, along with techniques for fabricating such a resistor. The resistor may be provided in a peripheral area of a 3D memory device which has a two-tier or other multi-tier stack of memory cells. The structure and fabrication of the resistor can be integrated with the structure and fabrication of the stack of memory cells. The resistor may comprise doped polysilicon. In an example implementation, a polysilicon pillar extends a height of a first tier of the stack and a metal pillar above the polysilicon pillar extends a height of a second tier of the stack.
摘要:
A vertical, columnar resistor in a semiconductor device is provided, along with techniques for fabricating such a resistor. The resistor may be provided in a peripheral area of a 3D memory device which has a two-tier or other multi-tier stack of memory cells. The structure and fabrication of the resistor can be integrated with the structure and fabrication of the stack of memory cells. The resistor may comprise doped polysilicon. In an example implementation, a polysilicon pillar extends a height of a first tier of the stack and a metal pillar above the polysilicon pillar extends a height of a second tier of the stack.
摘要:
A three dimensional memory device includes a memory device region containing a plurality of non-volatile memory devices, a peripheral device region containing active driver circuit devices, and a stepped surface region between the peripheral device region and the memory device region containing a plurality of passive driver circuit devices.
摘要:
When erasing non-volatile storage, a verification process is used between erase operations to determine whether the non-volatile storage has been successfully erased. The verification process includes separately performing verification for different subsets of the non-volatile storage elements.
摘要:
Methods and non-volatile storage systems are provided for detecting defects in word lines. A “broken” word line defect may be detected. Information may be maintained as to which storage elements were intended to be programmed to a tracked state. Then, after programming is complete, the storage elements are read to determine which storage elements have a threshold voltage below a reference voltage level associated with the tracked state. By tracking which storage elements are in the tracked state, elements associated with other states may be filtered out such that an accurate assessment may be made as to which storage elements were under-programmed. From this information, a determination may be made whether the word line is defective. For example, if too many storage elements are under-programmed, this may indicate a broken word line.
摘要:
In a programming operation of a 3D stacked non-volatile memory device, an initial set of memory cells on a selected word line layer, involving fewer than all memory cells on a selected word line layer, are programmed first as a test case to determine optimal conditions for programming the remaining memory cells on the selected word line layer. For example, a number of program-verify iterations or loops which are needed to program the initial set of memory cells an initial amount is determined. This loop count is then stored, e.g., within the initial set of memory cells, within the remaining memory cells, within memory cells on a remaining word line layer, or in a data register, and programming of the initial set of memory cells continues to completion. Subsequently, the loop count is retrieved and used to determine an optimal starting program voltage for programming the remaining memory cells.
摘要:
Word line switches in a word line decoder circuitry for a three-dimensional memory device can be formed as vertical field effect transistors overlying contact via structures to the electrically conductive layers for word lines. Via cavities in a dielectric material portion overlying stepped surfaces of the electrically conductive layers can be filled with a conductive material and recessed to form contact via structures. After forming lower active regions in the recesses, gate electrodes can be formed and patterned to form openings in areas overlying the contact via structures. Gate dielectrics can be formed on the sidewalls of the openings, and transistor channels can be formed inside the openings of the gate electrodes. Upper active regions can be formed over the transistor channels.
摘要:
In a programming operation of a 3D stacked non-volatile memory device, an initial set of memory cells on a selected word line layer, involving fewer than all memory cells on a selected word line layer, are programmed first as a test case to determine optimal conditions for programming the remaining memory cells on the selected word line layer. For example, a number of program-verify iterations or loops which are needed to program the initial set of memory cells an initial amount is determined. This loop count is then stored, e.g., within the initial set of memory cells, within the remaining memory cells, within memory cells on a remaining word line layer, or in a data register, and programming of the initial set of memory cells continues to completion. Subsequently, the loop count is retrieved and used to determine an optimal starting program voltage for programming the remaining memory cells.