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公开(公告)号：US20150163921A1
公开(公告)日：2015-06-11
申请号：US14102676
申请日：2013-12-11
申请人： Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
发明人： Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
CPC分类号： H05K1/189 , G06F1/163 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/181 , H01L2924/18162 , H05K1/0393 , H05K1/181 , H05K1/185 , H05K13/0469 , H05K2201/0137 , H05K2203/1469 , Y10T29/49146 , H01L2924/00
摘要： This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.
摘要翻译： 本公开一般涉及用于制造柔性微电子组件的装置，系统和方法。 在一个实例中，聚合物模制在微电子部件上，聚合物模具在模制之后呈现基本刚性的状态。 相对于微电子部件和聚合物模具形成布线层，布线层包括电耦合到微电子部件的迹线。 输入被施加到聚合物模具，聚合物模具在施加输入时从基本刚性状态转变到基本上柔性的状态。
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公开(公告)号：US20170094749A1
公开(公告)日：2017-03-30
申请号：US14866625
申请日：2015-09-25
申请人： Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
发明人： Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
CPC分类号： H05B33/28 , A41B1/08 , A41D1/002 , A42B1/004 , A42B1/242 , F21V33/0008 , H05B33/04 , H05B33/06
摘要： Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.
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公开(公告)号：US20170086510A1
公开(公告)日：2017-03-30
申请号：US14865440
申请日：2015-09-25
申请人： Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
发明人： Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
CPC分类号： A41D1/002 , G06F1/163 , H05K1/0283 , H05K1/0296 , H05K1/038 , H05K2201/0133 , H05K2201/09263 , H05K2201/10098 , H05K2201/10151
摘要： Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.
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公开(公告)号：US20190003854A1
公开(公告)日：2019-01-03
申请号：US15636599
申请日：2017-06-28
IPC分类号： G01C25/00 , G01C19/5656
CPC分类号： G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
摘要： An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.
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公开(公告)号：US20180084643A1
公开(公告)日：2018-03-22
申请号：US15267872
申请日：2016-09-16
申请人： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
发明人： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
CPC分类号： H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
摘要： A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
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公开(公告)号：US20170172421A1
公开(公告)日：2017-06-22
申请号：US14971800
申请日：2015-12-16
申请人： Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
发明人： Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
IPC分类号： A61B5/0205 , G06F3/01 , A61B5/00
CPC分类号： A61B5/0205 , A61B5/024 , A61B5/08 , A61B5/11 , A61B5/113 , A61B5/6804 , A61B2562/0219 , A61B2562/12 , G06F3/011 , G06F3/014 , G06F3/017
摘要： A sensor assembly configured to monitor one or more physiological characteristics includes a deformable substrate. The deformable substrate includes a body side interface. Substrate conductive traces are coupled with the deformable substrate. Two or more physiological sensor elements are coupled with the deformable substrate. The two or more physiological sensor elements include at least first and second sensor elements. The first sensor element includes a first piezo element in a first orientation along the deformable substrate, the first sensor element is electrically coupled with the substrate conductive traces. The second sensor element includes a second piezo element in a second orientation along the deformable substrate different than the first orientation, the second sensor element is electrically coupled with the substrate conductive traces.
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公开(公告)号：US20140000377A1
公开(公告)日：2014-01-02
申请号：US13536210
申请日：2012-06-28
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译： 描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。 例如，半导体封装包括多个堆积层。 空腔设置在一个或多个堆积层中。 空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。 还描述了制造具有气密密封区域的半导体封装的各种方法。
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公开(公告)号：US20140169800A1
公开(公告)日：2014-06-19
申请号：US13717185
申请日：2012-12-17
申请人： Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Feras Eid , Johanna Swan , Weng Hong Teh
CPC分类号： H01S5/02272 , H01L21/568 , H01L24/18 , H01L24/19 , H01L25/167 , H01L2224/04105 , H01L2224/16145 , H01L2924/12042 , H01S5/02248 , H01S5/02276 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/183 , H01S5/18305 , H01L2924/00
摘要： This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.
摘要翻译： 本公开一般涉及一种电子封装，其可以包括至少部分地包封管芯的管芯和电介质层。 电互连可以电耦合到管芯并且至少部分地通过电介质层。 光发射器可以用电互连的第一个电耦合到管芯，并且被配置为从电子封装的第一主表面发射光。 焊料凸块可以用电互连的第二个电耦合到管芯，并且位于电子封装的不同于第一主表面的第二主表面上。
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公开(公告)号：US09297824B2
公开(公告)日：2016-03-29
申请号：US13618003
申请日：2012-09-14
申请人： Qing Ma , Valluri Rao , Feras Eid , Kevin Lin , Weng Hong Teh , Johanna Swan , Robert Sankman
发明人： Qing Ma , Valluri Rao , Feras Eid , Kevin Lin , Weng Hong Teh , Johanna Swan , Robert Sankman
IPC分类号： G01P15/105 , G01P15/08 , G01P15/097 , G01P15/18
CPC分类号： G01P15/097 , G01P15/105 , G01P15/18
摘要： An accelerometer includes a mass, suspended by a beam, and associated conductive paths. Each conductive path is subjected to a magnetic field, such that, when a time varying signal is applied to the conductive paths, a characteristic resonant frequency is produced, and when the mass experiences an acceleration, a respective change in the resonant frequency is produced that may be interpreted as acceleration data. Embodiments include methods of manufacturing an accelerometer and systems and devices incorporating the accelerometer.
摘要翻译： 加速度计包括由梁悬挂的质量块和相关联的导电路径。 每个导电路径受到磁场的影响，使得当对导电路径施加时变信号时，产生特性谐振频率，并且当质量经历加速度时，产生谐振频率的相应变化， 可以解释为加速度数据。 实施例包括制造加速度计的方法和结合有加速度计的系统和装置。
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公开(公告)号：US20160076961A1
公开(公告)日：2016-03-17
申请号：US14951422
申请日：2015-11-24
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译： 描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。 例如，半导体封装包括多个堆积层。 空腔设置在一个或多个堆积层中。 空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。 还描述了制造具有气密密封区域的半导体封装的各种方法。
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