摘要:
The present invention provides a photosensitive resin composition capable of forming an insulating film, which is superior in both a roughening property and an adhesiveness, and a via-hole, which is highly reliable in connection, and a multilayer printed circuit board. The present invention provides a photosensitive resin composition containing a first resin, which is an epoxy resin, and a second resin having a N-substituted carbamic acid ester atomic group and a radical polymeric unsaturated bond in its side chain. The second resin is desirably an oligomer having a repeating unit expressed by the following general formula (chem. 1) or (chem. 3) by 3-10 units. Where, X is H or CH3, Y and Z is H or an alkyl group of carbon number 1-4, n is 0 or 1, a part of R1 is an atomic group expressed by the following general formula (chem. 2), the residual R1 is a hydroxyl group, and R2 is an alkylene group of carbon number 1-4.
摘要:
A multilayer circuit board having a resolution in the range of 25-80 &mgr;m, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220° C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
摘要:
A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
摘要:
A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.
摘要:
A process is provided for the formation of a conductive circuit pattern on a base metal formed on a substrate. On the base metal, a plating resist is first provided in a pattern corresponding to the circuit to be formed and a circuit pattern is then formed by plating. The plating resist is treated with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction. The base metal is treated with an etchant for the base metal, whereby any resist residue still remaining after the treatment with the stripping residue remover is removed and the base metal are etched at areas which were covered by the plating resist.
摘要:
A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
摘要:
In a client 20, an operation accepting section 22 obtains a primary address entered in an address entry field, and a transmitting section 21 sends the primary address to a mail server 10. In the mail server 10, a receiving section 19 receives the primary address; a message generating section 13 generates a message including out-of-office information corresponding to the primary address; and a transmitting section 11 sends the message to the client 20. In the client 20, a receiving section 29 receives the message, and a display section 24 displays an out-of-office message that a user corresponding to the primary address is away, and thereafter displays detailed information including buttons for setting an alternative address according to a click operation on a specific portion. An address updating section 26a displays an alternative address in the address entry field according to a button click operation.
摘要:
A testing apparatus including a plurality of testing module slots to which different types of testing modules for testing a device under test are optionally mounted, includes an operation order holding unit for holding information indicating that a test operation by a first testing module should be performed before a test operation by a second testing module, a trigger return signal receiving unit for receiving a trigger return signal from the first testing module, the trigger return signal indicating that the first testing module has completed the test operation thereof, when the test operation of the first testing module has been completed, and a trigger signal supplying unit for supplying a trigger signal to the second testing module, the trigger signal indicating that the second testing module should start the test operation thereof, when the trigger return signal receiving unit receives the trigger return signal.
摘要:
A testing apparatus including a plurality of testing module slots to which different types of testing modules for testing a device under test are optionally mounted, includes operation order holding means for holding information indicating that a test operation by a first testing module among the plurality of testing modules should be performed before a test operation by a second testing module among the plurality of testing modules, trigger return signal receiving means for receiving a trigger return signal from the first testing module, the trigger return signal indicating that the first testing module has completed the test operation thereof, when the test operation of the first testing module has been completed, and trigger signal supplying means for supplying a trigger signal to the second testing module, the trigger signal indicating that the second testing module should start the test operation thereof, when the trigger return signal receiving means receives the trigger return signal.
摘要:
An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.