公开(公告)号：US4970577A

公开(公告)日：1990-11-13

申请号：US337145

申请日：1989-04-12

申请人： Satoru Ogihara ,  Shunichi Numata ,  Kunio Miyazaki ,  Takashi Yokoyama ,  Ken Takahashi ,  Tasao Soga ,  Kazuji Yamada ,  Hiroichi Shinohara ,  Hideo Suzuki

发明人： Satoru Ogihara ,  Shunichi Numata ,  Kunio Miyazaki ,  Takashi Yokoyama ,  Ken Takahashi ,  Tasao Soga ,  Kazuji Yamada ,  Hiroichi Shinohara ,  Hideo Suzuki

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/64 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L23/642 ,  H01L23/49827 ,  H01L23/49833 ,  H05K1/141 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K1/0306 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K3/3426 ,  H05K3/368

摘要： A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient as that of the semiconductor chip, are also provided. Each such intermediate ceramic substrate has contacts on its front and back faces corresponding to those of the semiconductor chip. These contacts are electrically connected directly in a one-to-one relationship. The contacts on the semiconductor chip and the corresponding ones on the front face of the intermediate ceramic substrates are connected by solder. The contacts on the back face of the intermediate ceramic substrate and the corresponding contacts on the front face of the multi-layered ceramic circuit board are connected by respective conductive pins having a predetermined flexibility and rigidity through a predetermined gap therebetween. With this arrangement, the relative displacement due to a thermal expansion difference between the intermediate ceramic substrate and the multi-layered organic circuit board is permitted without causing substantial stress thereon.

公开(公告)号：US5449948A

公开(公告)日：1995-09-12

申请号：US678852

申请日：1991-04-01

申请人： Hirokazu Inoue ,  Tomoji Oishi ,  Hiroichi Shinohara ,  Ken Takahashi ,  Tetsuo Nakazawa ,  Mitsuo Usami ,  Masaki Fukuoka

发明人： Hirokazu Inoue ,  Tomoji Oishi ,  Hiroichi Shinohara ,  Ken Takahashi ,  Tetsuo Nakazawa ,  Mitsuo Usami ,  Masaki Fukuoka

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/822 ,  H01L23/64 ,  H01L27/02 ,  H01L27/04 ,  H01L27/08

CPC分类号： H01L23/642 ,  H01L22/22 ,  H01L27/0214 ,  H01L27/0805 ,  H01L2224/4847 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025

摘要： Integrated circuit devices, chips and methods of making and operating them are disclosed. The devices are specially adapted for high frequency operation e.g. at or above 1 GHz. Inductive noise caused by switching at these frequencies--and which can interfere with switching--is inhibited by using a large bypass capacitor connected between power and ground connections outside the chip, and a small bypass capacitor connected between the same power and ground connections but formed inside the chip. The smaller capacitor cuts noise attributable to the wiring between the larger capacitor and the chip. The chip can have many of the smaller capacitors, even one or more per gate. In the preferred embodiments, the small capacitors from power and ground bonding pads are formed at the front surface of the chip substrate. Tantalum pentoxide, and other suitable dielectrics having relative dielectric constant of 10 or more at 1 GHz, are used to form the capacitors.

摘要翻译： 公开了集成电路器件，芯片及其制造和操作的方法。 这些器件特别适用于高频操作，例如 1 GHz以上。 通过使用连接在芯片外部的电源和接地连接之间的大型旁路电容以及连接在相同电源和接地连接之间但形成在内部的小旁路电容器来抑制在这些频率处切换并且可能干扰开关的电感噪声 芯片。 较小的电容器可以减小归因于较大电容器和芯片之间的布线的噪声。 该芯片可以具有许多较小的电容器，甚至每个栅极一个或多个。 在优选实施例中，来自电源和接地焊盘的小电容器形成在芯片基板的前表面。 使用五氧化二钽和1GHz下相对介电常数为10以上的其他合适的电介质来形成电容器。

公开(公告)号：US5672826A

公开(公告)日：1997-09-30

申请号：US648747

申请日：1996-05-16

申请人： Hideo Suzuki ,  Ken Takahashi ,  Yukio Takahashi ,  Yoshimi Yamamoto ,  Kenichi Aoki ,  Tomoyuki Tobita

发明人： Hideo Suzuki ,  Ken Takahashi ,  Yukio Takahashi ,  Yoshimi Yamamoto ,  Kenichi Aoki ,  Tomoyuki Tobita

IPC分类号： G01L13/06 ,  G01L9/00 ,  G01L9/04 ,  G01L19/00

CPC分类号： G01L19/147 ,  G01L19/0038 ,  G01L19/0645 ,  G01L19/148 ,  G01L9/0054

摘要： The present invention provides a semiconductor pressure sensor having a glass base and a metal base bonded together satisfactorily so that a silicon diaphragm may not be affected by residual strain, and an intelligent differential pressure and pressure transmitting device employing the semiconductor pressure sensor. The semiconductor pressure sensor comprises a silicon diaphragm (1) provided with a strain-sensitive element, a glass or ceramic base (2) bonded to the silicon diaphragm (1), and a metal base (4) bonded to the glass or ceramic base (2) with a bonding glass (3). The thermal expansion coefficient of the metal base (4) at a temperature corresponding to the strain point of the bonding glass (3) is not greater than that of the glass or ceramic base (2).

摘要翻译： 本发明提供一种半导体压力传感器，其具有玻璃基座和金属基座，令人满意地结合在一起，使得硅膜片不会受到残余应变的影响，并且采用半导体压力传感器的智能差压和压力传递装置。 半导体压力传感器包括设置有应变敏感元件的硅隔膜（1），接合到硅隔膜（1）的玻璃或陶瓷基体（2），以及接合到玻璃或陶瓷基底的金属基底（4） （2）用粘合玻璃（3）。 在与玻璃（3）的应变点对应的温度下，金属基体（4）的热膨胀系数不大于玻璃或陶瓷基体（2）的热膨胀系数。

公开(公告)号：US08653380B2

公开(公告)日：2014-02-18

申请号：US12659172

申请日：2010-02-26

申请人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

发明人： Hajime Nishi ,  Ken Takahashi ,  Hiromitsu Kuroda ,  Hiroshi Okikawa ,  Kuniaki Kimoto ,  Hiroyuki Akutsu ,  Yukio Ito ,  Iku Higashidani

IPC分类号： H05K1/16

CPC分类号： H01L31/0508 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

摘要翻译： 太阳能电池引线包括其表面涂覆有焊料电镀的带状导电材料。 涂覆的焊料镀层在其表面上包括凹凸部分，通过拉伸试验包括不大于90MPa的0.2％屈服应力。 涂覆的焊料镀层包括通过在带状导电材料的表面上提供熔融焊料而形成的热浸焊料镀层。 将电镀温度设定为不高于所使用焊料的液相线温度加上120℃，并且将热浸焊料镀层的表面上的氧化膜设定为不大于7nm 厚度。

公开(公告)号：US20130208733A1

公开(公告)日：2013-08-15

申请号：US13879618

申请日：2011-10-25

申请人： Takeshi Sugiyama ,  Tadashi Matsumoto ,  Ken Takahashi

发明人： Takeshi Sugiyama ,  Tadashi Matsumoto ,  Ken Takahashi

IPC分类号： H04L12/43

CPC分类号： H04L47/60 ,  H04B3/544

摘要： The communication system includes: first terminal devices connected to a transmission path and having terminal information; a second terminal device connected to the path and sending an information request requesting the information from the first terminal device; a first superimposing apparatus interposed between the first terminal device and the path; and a second superimposing apparatus interposed between the second terminal device and the path and receiving the request from the second terminal device. The first superimposing apparatus acquires the information from the connected first terminal device at predetermined timings and stores it. Upon receiving the request, the second superimposing apparatus sends the request to the first superimposing apparatus using a superimposed signal superimposed on a transmission signal transmitted via the path. Upon receiving the request, the first superimposing apparatus sends the information to the second superimposing apparatus using the superimposed signal. Upon receiving the information, the second superimposing apparatus provides the information to the second terminal device.

摘要翻译： 通信系统包括：连接到传输路径并具有终端信息的第一终端设备; 连接到所述路径并发送从所述第一终端设备请求所述信息的信息请求的第二终端设备; 插入在所述第一终端装置和所述路径之间的第一重叠装置; 以及插入在第二终端设备和路径之间并且接收来自第二终端设备的请求的第二叠加设备。 第一重叠装置以预定的定时从连接的第一终端装置获取信息并存储。 在接收到请求时，第二叠加装置使用叠加在经由该路径发送的发送信号上的叠加信号将该请求发送给第一叠加装置。 在接收到请求时，第一叠加装置使用叠加信号将信息发送到第二叠加装置。 在接收到该信息时，第二重叠装置向第二终端装置提供信息。

公开(公告)号：US08447727B2

公开(公告)日：2013-05-21

申请号：US13075729

申请日：2011-03-30

申请人： Ken Takahashi

发明人： Ken Takahashi

IPC分类号： G06F17/30

CPC分类号： G06Q10/06

摘要： A distributed processing device includes receiving unit receives a plurality of process requests to records stored on a database, an acquiring unit acquires execution frequency of each processes responsive to the plurality of process requests related to a record identified by an attribute name, on a per attribute name basis of a plurality of attribute names, each attribute name identifying each of the plurality of records, sorting unit sorts the plurality of process requests into a first set and a second set in accordance with the acquired execution frequency of each process on each of the plurality of attribute names, a determining unit determines a first node, serving as an allocation destination of the process request sorted in the first set, from among a plurality of nodes, each node having the database, and an allocating unit allocates the process request sorted in the first set to the first node.

摘要翻译： 一种分布式处理装置，包括接收单元，接收对数据库中存储的记录的多个处理请求，获取单元响应于与由属性名称识别的记录有关的多个处理请求，针对每个属性获取每个进程的执行频率 多个属性名称的名称基础，每个属性名称标识多个记录中的每一个，排序单元根据所获取的每个进程的执行频率，将多个处理请求分类为第一集合和第二集合 多个属性名称，确定单元从多个节点中确定用作第一组中排序的处理请求的分配目的地的第一节点，每个节点具有数据库，并且分配单元分配处理请求分类 在第一个设置到第一个节点。

公开(公告)号：US20120329671A1

公开(公告)日：2012-12-27

申请号：US13587791

申请日：2012-08-16

申请人： Kyoji Yamaguchi ,  Hisataka Yasuda ,  Nobuaki Nakagawa ,  Nobuyuki Shima ,  Masahiko Kinosaki ,  Eisuke Tsuda ,  Masaaki Goto ,  Kazuki Yano ,  Akihiro Tomoyasu ,  Fumie Kobayashi ,  Naohiro Washida ,  Ken Takahashi ,  Tomonori Morinaga ,  Kanji Higashio

发明人： Kyoji Yamaguchi ,  Hisataka Yasuda ,  Nobuaki Nakagawa ,  Nobuyuki Shima ,  Masahiko Kinosaki ,  Eisuke Tsuda ,  Masaaki Goto ,  Kazuki Yano ,  Akihiro Tomoyasu ,  Fumie Kobayashi ,  Naohiro Washida ,  Ken Takahashi ,  Tomonori Morinaga ,  Kanji Higashio

IPC分类号： G01N33/53 ,  G01N23/00 ,  G01N33/577 ,  C40B30/04

CPC分类号： C07K16/2875 ,  A61K38/00 ,  A61K2039/505 ,  C07K14/525 ,  C07K14/705 ,  C07K14/70578 ,  C07K16/28 ,  C07K16/2878 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/00 ,  G01N33/566 ,  G01N2333/525 ,  G01N2333/70578 ,  G01N2800/108

摘要： Novel proteins and polypeptides binding to osteoclastogenesis inhibitory factor (OCIF) (OCIF-binding molecules, OBMs) and nucleic acids encoding these proteins and polypeptides are provided. Processes for producing these proteins, polypeptides, and nucleic acid molecules by genetic engineering are provided. Medicinal compounds are provided which comprise proteins and nucleic acids according to the invention, as well as proteins which bind to OBM, including anti-OBM antibodies. These compounds may be used for the treatment of bone disease.

摘要翻译： 提供了与破骨细胞发生抑制因子（OCIF）（OCIF结合分子，OBM）结合的新型蛋白质和多肽以及编码这些蛋白质和多肽的核酸。 提供了通过遗传工程制备这些蛋白质，多肽和核酸分子的方法。 提供了包含根据本发明的蛋白质和核酸以及结合OBM的蛋白质（包括抗OBM抗体）的药用化合物。 这些化合物可用于治疗骨病。

公开(公告)号：US08288277B2

公开(公告)日：2012-10-16

申请号：US13108423

申请日：2011-05-16

申请人： Ken Takahashi ,  Trifon M. Liakopoulos

发明人： Ken Takahashi ,  Trifon M. Liakopoulos

IPC分类号： H01L21/44

CPC分类号： H01F41/046 ,  H01F3/14 ,  H01F17/0033 ,  H01F41/34 ,  H05K1/0306 ,  H05K3/0011 ,  H05K3/108 ,  H05K2203/1121 ,  Y10S438/909

摘要： A method of processing a substrate with a conductive film formed thereover and method of forming a micromagnetic device. In one embodiment, the method of processing the substrate includes reducing a temperature of the substrate to a stress-compensating temperature, and maintaining the temperature of the substrate at the stress-compensating temperature for a period of time. The method also includes increasing the temperature of the substrate above the stress-compensating temperature.

摘要翻译： 一种用其上形成的导电膜处理衬底的方法和形成微磁性器件的方法。 在一个实施例中，处理衬底的方法包括将衬底的温度降低到应力补偿温度，并将衬底的温度保持在应力补偿温度一段时间。 该方法还包括将基板的温度升高到应力补偿温度以上。

公开(公告)号：US07883814B2

公开(公告)日：2011-02-08

申请号：US12012456

申请日：2008-02-01

申请人： Yasuhiro Watanabe ,  Masaaki Sakano ,  Shuji Sato ,  Shigeru Inai ,  Teruyuki Ohtani ,  Ken Takahashi

发明人： Yasuhiro Watanabe ,  Masaaki Sakano ,  Shuji Sato ,  Shigeru Inai ,  Teruyuki Ohtani ,  Ken Takahashi

IPC分类号： H01M8/24 ,  H01M2/38 ,  H01M2/40 ,  H01M2/20 ,  H01M2/08 ,  H01M2/14

CPC分类号： H01M8/0273 ,  H01M8/0206 ,  H01M8/0247 ,  H01M8/0258 ,  H01M8/0267 ,  H01M8/0276 ,  H01M8/241 ,  H01M8/2457 ,  H01M8/2483 ,  H01M2008/1095

摘要： A first metal separator of a fuel cell comprises a metal plate, and a first seal member is formed integrally on both surfaces of an outer edge of the metal plate. A first rib having a frame shape is provided around an oxygen-containing gas supply passage or the like of the metal plate. The first rib has a rib surface spaced away from an inner end surface of the metal plate around the oxygen-containing gas supply passage or the like, toward the oxygen-containing gas supply passage or the like.

摘要翻译： 燃料电池的第一金属隔板包括金属板，并且第一密封构件一体地形成在金属板的外边缘的两个表面上。 在金属板的含氧气体供给路径等的周围设置具有框状的第一肋。 第一肋具有与含氧气体供给路径等的周围的金属板的内端面朝向含氧气体供给路径等隔开的肋面。

公开(公告)号：US20090087773A1

公开(公告)日：2009-04-02

申请号：US12236813

申请日：2008-09-24

申请人： Yasushi Shinjiyo ,  Masahiro Hosoya ,  Koichi Ishii ,  Mitsunaga Saito ,  Yoshihiro Tajima ,  Ken Takahashi

发明人： Yasushi Shinjiyo ,  Masahiro Hosoya ,  Koichi Ishii ,  Mitsunaga Saito ,  Yoshihiro Tajima ,  Ken Takahashi

IPC分类号： G03G9/125 ,  G03G5/00

CPC分类号： G03G9/125 ,  G03G9/0825 ,  G03G9/08782 ,  G03G9/12 ,  G03G9/13 ,  G03G9/135

摘要： A liquid developing agent includes a toner particle having a nuclear particle and a covering layer containing a wax, provided on the surface of the nuclear particle in which the wax has at least one of polar groups and aromatic substituent groups, is substantially insoluble in an electric insulation solvent at room temperature, has a melting point below a boiling point of the electric insulation solvent, and is dissolved in the insulation solvent at a temperature higher than the melting point.

摘要翻译： 液体显影剂包括具有核颗粒的调色剂颗粒和包含蜡的覆盖层，其设置在蜡具有极性基团和芳族取代基中的至少一个的核粒子的表面上，其基本上不溶于电 绝缘溶剂在室温下具有低于电绝缘溶剂沸点的熔点，并且在高于熔点的温度下溶解在绝缘溶剂中。