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1.发明申请RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN-ADHERED METAL FOIL AND HEAT DISSIPATION DEVICE 审中-公开树脂组合物，树脂片，固化树脂片，树脂粘合金属箔和散热装置公开(公告)号：US20140248504A1
公开(公告)日：2014-09-04
申请号：US14343375
申请日：2012-02-17
IPC分类号： H01L23/373
CPC分类号： H01L23/3737 , B32B15/06 , B32B25/02 , B32B25/14 , B32B2264/10 , B32B2264/102 , B32B2307/206 , B32B2307/302 , B32B2307/50 , B32B2307/546 , B32B2457/00 , B32B2457/08 , C08K2003/2227 , C08K2003/382 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition.
摘要翻译： 本发明提供一种树脂组合物，其包括：包含氧化铝颗粒和氮化硼颗粒的填料; 重均分子量为10,000〜100,000的弹性体; 和可固化树脂。 本发明还提供了通过使用该树脂组合物形成的树脂片，固化树脂片，树脂粘附金属箔和散热装置。
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2.发明申请公开(公告)号：US20120244351A1
公开(公告)日：2012-09-27
申请号：US13498583
申请日：2010-09-28
申请人： Hideyuki Katagi , Yoshitaka Takezawa , Tomoo Nishiyama , Naoki Hara , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen , Hiroyuki Takahashi
发明人： Hideyuki Katagi , Yoshitaka Takezawa , Tomoo Nishiyama , Naoki Hara , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen , Hiroyuki Takahashi
IPC分类号： B32B7/10 , B32B37/12 , B29C39/12 , B29C35/08 , C09J179/08 , B32B15/088
CPC分类号： C09J177/00 , B32B7/02 , B32B7/12 , B32B15/088 , B32B15/092 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/34 , B32B27/38 , B32B2250/40 , B32B2264/10 , B32B2264/102 , B32B2307/206 , B32B2307/302 , B32B2307/304 , B32B2307/306 , B32B2457/00 , B32B2457/04 , B32B2457/20 , C08G59/621 , C08G73/14 , C08K3/013 , C08L63/00 , C08L2203/20 , C09J7/25 , C09J179/08 , C09J2461/00 , C09J2463/00 , C09J2463/006 , C09J2477/00 , C09J2479/086 , F21K9/00 , F21Y2115/10 , H01L23/051 , H01L23/145 , H01L23/49822 , H01L23/49833 , H01L24/33 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , Y10T156/10 , Y10T428/28 , Y10T428/2896 , Y10T428/31522 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A multilayer resin sheet is constituted by including a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent and an inorganic filler, and an insulating adhesive layer formed on at least either of the surfaces of the resin layer.A cured multilayer resin sheet originated from the multilayer resin sheet has high thermal conductivity, good insulation and adhesive strength, and, further, superior thermal shock resistance, and is suitable as an electric insulating material to be used for an electric or electronic device.
摘要翻译： 多层树脂片通过包括含有介晶骨架的环氧树脂的树脂层，固化剂和无机填料以及形成在树脂层的至少任一表面上的绝缘粘合剂层构成。 来自多层树脂片的固化多层树脂片具有高导热性，良好的绝缘性和粘合强度，并且还具有优异的耐热冲击性，并且适合用作电气或电子器件的电绝缘材料。
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3.发明申请RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME 审中-公开树脂组合物，树脂片和固化树脂材料及其制造方法公开(公告)号：US20120251830A1
公开(公告)日：2012-10-04
申请号：US13498278
申请日：2010-09-28
申请人： Tomoo Nishiyama , Haruaki Sue , Hideyuki Katagi , Naoki Hara , Hiroyuki Takahashi , Yasuo Miyazaki , Yoshitaka Takezawa , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen
发明人： Tomoo Nishiyama , Haruaki Sue , Hideyuki Katagi , Naoki Hara , Hiroyuki Takahashi , Yasuo Miyazaki , Yoshitaka Takezawa , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen
IPC分类号： C08L63/00 , B32B37/06 , B32B37/14 , C08K3/22 , B32B15/092
CPC分类号： C08L63/08 , B32B15/08 , B32B27/26 , B32B27/38 , C08G59/621 , C08K3/22 , C08K2003/2227 , C08L61/06 , C08L61/12 , C08L63/00 , Y10T156/10 , Y10T428/31529 , C08L2666/22 , C08L2666/16
摘要： A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing.In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
摘要翻译： 含有具有介晶结构的环氧树脂单体，含有具有下述通式（I）表示的结构单元的化合物的酚醛清漆树脂）和无机填料的树脂组合物在固化前的保存稳定性优异，可以达到 固化后导热性好。 在下列通式（I）中，R 1，R 2和R 3独立地表示氢原子，烷基，芳基或芳烷基。 m表示0〜2的整数。 n为1〜7的整数。
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4.发明申请MULTILAYER RESIN SHEET AND PROCESS FOR PRODUCTION THEREOF, RESIN SHEET LAMINATE AND PROCESS FOR PRODUCTION THEREOF, CURED MULTILAYER RESIN SHEET, METAL-FOIL-CLADDED MULTILAYER RESIN SHEET, AND SEMICONDUCTOR DEVICE 审中-公开多层树脂片及其制造方法，树脂片层压板及其生产方法，固化多层树脂片，金属箔层压多层树脂片和半导体器件公开(公告)号：US20130189514A1
公开(公告)日：2013-07-25
申请号：US13878033
申请日：2011-10-06
申请人： Tomoo Nishiyama , Yoshitaka Takezawa , Hideyuki Katagi , Naoki Hara , Yasuo Miyazaki , Kensuke Yoshihara
发明人： Tomoo Nishiyama , Yoshitaka Takezawa , Hideyuki Katagi , Naoki Hara , Yasuo Miyazaki , Kensuke Yoshihara
IPC分类号： H01B7/42 , B32B15/08 , H01L23/373
CPC分类号： H01B7/42 , B32B15/08 , H01L23/145 , H01L23/3735 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L24/33 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/181 , Y10T156/10 , Y10T428/25 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multilayer resin sheet including: a resin layer that includes an epoxy resin monomer, a curing agent, and a filler; and an adhesive layer positioned on at least one face of the resin layer, the filler having peaks in ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, respectively, in terms of particle size distribution as measured by laser diffractometry, and the filler having a particle size of from 10 μm to 100 μm including a boron nitride filler.
摘要翻译： 一种多层树脂片，包括：包含环氧树脂单体，固化剂和填料的树脂层; 以及位于树脂层的至少一个面上的粘合剂层，填料分别具有0.01μm至小于1μm，1μm至小于10μm，10μm至100μm的峰值， 在通过激光衍射法测量的粒度分布方面，以及包含氮化硼填料的粒径为10〜100μm的填料。
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5.发明申请公开(公告)号：US20120315487A1
公开(公告)日：2012-12-13
申请号：US13579413
申请日：2011-02-17
申请人： Yoshitaka Takezawa , Fusao Hojo , Shingo Tanaka , Hiroyuki Kagawa
发明人： Yoshitaka Takezawa , Fusao Hojo , Shingo Tanaka , Hiroyuki Kagawa
CPC分类号： C08L63/00 , C01P2004/61 , C08K3/10 , C08K7/00 , C08K9/00 , C09C1/40 , C09D7/62 , C09K5/14 , Y10T428/31529
摘要： A composite particle is constituted to include: an aluminum nitride particle; a first coating layer that contains α-alumina and coats at least a part of a region of a surface of the aluminum nitride particle; and a second coating layer that contains organic matter and coats a region other than the first coating layer of the surface of the aluminum nitride particle.
摘要翻译： 复合颗粒被构造成包括：氮化铝颗粒; 含有α-氧化铝的第一涂层，并涂覆氮化铝颗粒表面的至少一部分区域; 以及第二涂层，其含有有机物并涂覆除了氮化铝颗粒表面的第一涂层以外的区域。
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6.发明授权公开(公告)号：US07691473B2
公开(公告)日：2010-04-06
申请号：US12250778
申请日：2008-10-14
申请人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： B32B27/38
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.
摘要翻译： 纤维增强复合材料及其制造方法技术领域本发明涉及纤维增强复合材料及其制造方法，还涉及透明多层片材，电路基板和光波导。
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7.发明授权公开(公告)号：US07538166B2
公开(公告)日：2009-05-26
申请号：US10584307
申请日：2004-12-22
CPC分类号： C08G59/22 , C07D303/27 , C08G59/04 , C08G59/5033 , C08J5/24 , C08J2363/00 , H05K1/0326 , Y10T428/24994 , Y10T428/31511
摘要： Novel epoxy compounds represented by the general formula (1) wherein Ar1, Ar2 and Ar3 are each optionally substituted phenylene, cyclohexanyl or the like, R1, R2, R3, R4, R5 and R6 are each hydrogen or alkyl of 1 to 18 carbon atoms, and Q1 and Q2 are each alkylene of 1 to 9 carbon atoms or the like, which are useful as the raw material of cured epoxy resins exhibiting liquid crystallinity; a process for the production thereof; and compositions containing the compounds.
摘要翻译： 由通式（1）表示的新型环氧化合物，其中Ar 1，Ar 2和Ar 3各自为任意取代的亚苯基，环己烷基等，R 1，R 2，R 3，R 4，R 5和R 6各自为氢或1至18个碳原子的烷基 Q1和Q2分别为1〜9个碳原子的亚烷基等，可用作具有液晶性的固化环氧树脂的原料; 一种生产过程; 和含有这些化合物的组合物。
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8.发明申请公开(公告)号：US20090123726A1
公开(公告)日：2009-05-14
申请号：US12250778
申请日：2008-10-14
申请人： Hiroyuki YANO , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki YANO , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： D04H13/00
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.
摘要翻译： 纤维增强复合材料及其制造方法技术领域本发明涉及纤维增强复合材料及其制造方法，还涉及透明多层片材，电路基板和光波导。
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公开(公告)号：US07279574B2
公开(公告)日：2007-10-09
申请号：US10560891
申请日：2004-06-18
IPC分类号： C07D401/00 , C07D237/00 , C07D405/00 , C07D211/00 , C07D303/12 , C08G59/14 , C08F283/00 , C08L63/00
CPC分类号： C07D405/14 , C08G59/26 , C08G59/5033 , H05K1/0326 , Y10T428/24994 , Y10T428/31511
摘要： The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.
摘要翻译： 本发明提供一种新颖的环氧化合物，其可以通过用固化剂固化而转化成具有液晶性质的固化环氧树脂产物。 由于本发明的固化环氧树脂产品具有良好的导热性，因此也可用作需要高散热性的绝缘材料，例如印刷电路基板等。
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公开(公告)号：US07167247B2
公开(公告)日：2007-01-23
申请号：US10417266
申请日：2003-04-17
CPC分类号： G07D7/1205
摘要： The technique of the present invention enhances the stability of paper material identification of sheets. To achieve the above purpose, both short-wavelength light in the range of 370 nm and long-wavelength light in the range of 420 to 1000 nm are irradiated to paper to be identified in identifying the paper material. The identification is carried out, based on the difference in absorbance of the paper, which is obtained for each irradiated light. The absorbance of the paper varies according to the paper material, thereby enabling the identification of the paper material free from influence, which are caused by differences in manufacturing process, such as shading patterns. In addition, the simultaneous use of the short-wavelength light and the long-wavelength light declines influence on the absorbance, which are caused by environmental factors, such as humidity and deterioration of sheets, thereby resulting in stable identification of the paper material.
摘要翻译： 本发明的技术提高了纸张材料识别的稳定性。 为了实现上述目的，将在370nm范围内的短波长光和420-1000nm范围内的长波长光照射在识别纸材时要识别的纸上。 基于对于每个照射的光获得的纸的吸光度差进行识别。 纸张的吸光度根据纸张材料而变化，从而能够识别由于制造过程中的差异（如阴影图案）而引起的纸张材料的影响。 此外，短波长光和长波长光的同时使用对由诸如湿度和片材劣化等环境因素引起的吸光度的影响降低，从而导致纸材的稳定识别。
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