摘要:
A substrate bias control circuit includes a process voltage temperature (PVT) effect transducer that responds to a PVT effect. A PVT effect quantifier is coupled to the PVT effect transducer. The PVT effect quantifier quantifies the PVT effect to provide an output. The PVT effect quantifier includes at least one counter and a period generator. The period generator provides a time period for the counter. A bias controller that is coupled to PVT effect quantifier is configured to receive the output of the PVT effect quantifier. The bias controller is configured to provide a bias voltage. The bias controller includes a bias voltage comparator.
摘要:
A master-slave retention flip-flop includes a master latch adapted to latch an input data signal and to output a latched master latch data signal based on an input clock signal, a slave latch coupled to an output of the master latch and adapted to output a latched slave latch data signal based on the input clock signal, and a retention latch embedded within one of the master and slave latches adapted to preserve data in a power down mode based on a power down control signal.
摘要:
A flip-flop structure with reduced set-up time is provided. The flip-flop includes the first master latch receiving a function data through the first switch controlled by a clock signal, the second master latch receiving a scan data through the second switch controlled by the clock signal, and a slave latch connected to the first master latch through the third switch controlled by the clock signal. The second master latch is coupled to the first master latch through the fourth switch controlled by the scan enable signal so that the scan enable signal controls whether the function data or the scan data becomes an output from the first master latch to the slave latch, and the slave latch is used to latch and transmit the output from the first master latch.
摘要:
A circuit includes a central processing unit (CPU), which includes a first memory block having a first power domain; and a core block signally connected to the first memory block and having a second power domain disconnected from the first power domain.
摘要:
A circuit includes a central processing unit (CPU), which includes a first memory block having a first power domain; and a core block signally connected to the first memory block and having a second power domain disconnected from the first power domain.
摘要:
A system and method for multi-protocol bus communications between integrated circuits is provided. An electronic system comprises an integrated circuit having an on-chip bus. The integrated circuit includes a master component and a first slave component, both coupled to the on-chip bus and communicate using a first on-chip bus protocol, a slave bus converter coupled to the on-chip bus, and a switch coupled to the slave bus converter and to the on-chip bus. The electronic system further comprising a second slave component coupled to the integrated circuit. The slave bus converter converts bus communications in the first on-chip bus protocol to a second on-chip bus protocol and the switch selectively couples the on-chip bus or the slave bus converter to the second slave component based on a bus select control signal.
摘要:
An integrated circuit system having an interposer and an integrated circuit with first and second bond pads, the integrated circuit die bonded to the interposer using the first bond pads. The integrated circuit having circuit blocks, that operate at different operating voltages and voltage regulator modules die bonded to the second bond pads of the integrated circuit. The voltage regulator modules converting a power supply voltage to the operating voltage of a respective circuit block and supply the respective operating voltage to the circuit block via the second bond pads.
摘要:
A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.
摘要:
A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.
摘要:
A die stack of an integrated circuit includes a plurality of dies. Each die in the die stack includes a phase lock loop (PLL). The PLLs in each of the dies share a loop filter and other corresponding circuits.