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    Preserving Filled Features when Vacuum Wiping
    1.
    发明申请
    Preserving Filled Features when Vacuum Wiping 审中-公开
    真空擦拭时保存填充特性

    公开(公告)号：US20070228608A1

    公开(公告)日：2007-10-04

    申请号：US11694193

    申请日：2007-03-30

    Applicant: Steven Shackleton ,  Pankaj Lad ,  Ian McMackin ,  Frank Xu ,  Sidlgata Sreenivasan

    Inventor： Steven Shackleton ,  Pankaj Lad ,  Ian McMackin ,  Frank Xu ,  Sidlgata Sreenivasan

    IPC: B29C35/08 ,  B29C43/02

    CPC classification number: G03F7/0002 ,  B29C43/003 ,  B29C43/021 ,  B29C43/34 ,  B29C2043/025 ,  B29C2043/142 ,  B29C2043/3438 ,  B29K2105/0002 ,  B82Y10/00 ,  B82Y40/00

    Abstract: A method/process for curing imprint on a template prior to contact with a substrate. A curing process is used to adhere the imprint to a wafer or substrate. Monomer is deposited on a template and then partially cured using a UV exposure. The exposure is controlled so that the imprint is cured past the gel point, but still retains a thin liquid layer of uncured monomer at the surface that will bond with the wafer. Further, this partially cured layer enables the alignment adjustments between the template and the substrate to be performed after contact between the two without pulling any monomer out of the features.

    Abstract translation: 在与基底接触之前在模板上固化印模的方法/方法。 使用固化过程将印记粘附到晶片或基板上。 将单体沉积在模板上，然后使用UV曝光部分固化。 控制曝光使得印迹经过凝胶点固化，但仍然保留在将与晶片结合的表面上的未固化单体的薄液体层。 此外，这种部分固化的层使得能够在两者之间接触之后进行模板和基板之间的对准调整，而不将任何单体拉出特征。

    Method for Imprint Lithography Utilizing an Adhesion Primer Layer
    2.
    发明申请
    Method for Imprint Lithography Utilizing an Adhesion Primer Layer 有权
    使用粘合底漆层的印记平版印刷方法

    公开(公告)号：US20070212494A1

    公开(公告)日：2007-09-13

    申请号：US11734542

    申请日：2007-04-12

    Applicant: Frank Xu ,  Sidlgata Sreenivasan ,  Edward Fletcher

    Inventor： Frank Xu ,  Sidlgata Sreenivasan ,  Edward Fletcher

    IPC: B05D1/00

    CPC classification number: C08L59/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G11B5/855 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31692

    Abstract: The invention provides a method of applying an adhesion primer layer for an imprint lithography process that includes contacting a fluid with a surface of a substrate in a coating process and initiating a chemical reaction that forms a covalent bond between a component in the fluid and the surface of the substrate such that an adhesion primer layer is adhered to the surface of the substrate. A polymeric layer may be adhered to the surface of the substrate coated with the adhesion primer layer. The method allows adhesion primer coating for double-sided imprinting applications including patterned magnetic media.

    Abstract translation: 本发明提供了一种施加用于压印光刻工艺的粘合底漆层的方法，该方法包括在涂布过程中使流体与基材的表面接触并引发在流体和表面之间形成共价键的化学反应 的基底，使得粘合底漆层粘附到基底的表面。 聚合物层可以粘附到涂覆有粘合底漆层的基材的表面上。 该方法允许用于包括图案化磁性介质的双面印刷应用的粘合底漆涂层。

    Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom
    3.
    发明申请
    Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom 有权
    补偿设置在基板上的材料的体积收缩以从其形成基本上平面的结构的方法

    公开(公告)号：US20060068120A1

    公开(公告)日：2006-03-30

    申请号：US10951014

    申请日：2004-09-27

    Applicant: Sidlgata Sreenivasan ,  Frank Xu

    Inventor： Sidlgata Sreenivasan ,  Frank Xu

    IPC: B05D3/00

    CPC classification number: G03F7/0002 ,  B29C43/003 ,  B29C2043/025 ,  H01L21/31051 ,  H01L21/312

    Abstract: The present invention provides a method of planarizing a substrate with a template spaced-apart from the substrate having a liquid disposed therebetween, the method including: contacting the liquid with the template forming a first shape therein; and impinging radiation upon the liquid causing a reduction in volume of the liquid, with the first shape compensating for the reduction in volume such that upon impinging the actinic radiation upon the liquid, the liquid forms a contoured layer having a substantially planar shape.

    Abstract translation: 本发明提供了一种使衬底平面化的方法，该衬底具有与衬底间隔开的具有设置在其间的液体的模板，该方法包括：使液体与在其中形成第一形状的模板接触; 并且将液体的辐射照射在液体上，导致液体的体积减小，第一形状补偿了体积的减小，使得在将光化辐射照射在液体上时，液体形成具有基本上平面形状的轮廓层。

    Positive Tone Bi-Layer Imprint Lithography Method
    4.
    发明申请
    Positive Tone Bi-Layer Imprint Lithography Method 有权
    正音双层印记平版印刷方法

    公开(公告)号：US20070099337A1

    公开(公告)日：2007-05-03

    申请号：US11560928

    申请日：2006-11-17

    Applicant: Sidlgata Sreenivasan

    Inventor： Sidlgata Sreenivasan

    IPC: H01L51/40 ,  H01L21/00

    CPC classification number: B81C1/0046 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/76802

    Abstract: The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.

    Abstract translation: 本发明提供一种通过在衬底上形成具有突起和凹陷的图案化层来形成特征为产生多层结构的衬底的方法。 形成在图案层上的是保形层，多层结构具有背离衬底的表冠表面。 去除多层结构的部分以暴露与突起叠加的衬底的区域，同时在与凹部重叠的冠表面的区域中形成硬掩模。

    Method of planarizing a semiconductor substrate
    8.
    发明申请
    Method of planarizing a semiconductor substrate 有权
    平面化半导体衬底的方法

    公开(公告)号：US20060035464A1

    公开(公告)日：2006-02-16

    申请号：US10917563

    申请日：2004-08-13

    Applicant: Sidlgata Sreenivasan

    Inventor： Sidlgata Sreenivasan

    IPC: H01L21/302

    CPC classification number: B29C43/003 ,  B29C2043/025 ,  H01L21/0334 ,  H01L21/30604 ,  H01L21/31051 ,  H01L21/32115

    Abstract: The present invention provides a method of planarizing a substrate, the method including, forming, on the substrate, a patterned layer having a first shape associated therewith; and processing the patterned layer, with the first shape compensating for variations in the processing such that upon processing the patterned layer, the patterned layer comprises a substantially planar shape.

    Abstract translation: 本发明提供一种平面化基板的方法，所述方法包括在基板上形成与其相关联的具有第一形状的图案化层; 并且处理图案化层，其中第一形状补偿了处理中的变化，使得在处理图案化层时，图案化层包括基本上平面的形状。

    Compliant device for nano-scale manufacturing
    9.
    发明申请
    Compliant device for nano-scale manufacturing 有权
    符合纳米级制造的器件

    公开(公告)号：US20050275251A1

    公开(公告)日：2005-12-15

    申请号：US11142838

    申请日：2005-06-01

    Applicant: Byung-Jin Choi ,  Sidlgata Sreenivasan

    Inventor： Byung-Jin Choi ,  Sidlgata Sreenivasan

    IPC: A47C1/024 ,  A47C1/0355 ,  A47C3/00 ,  A47D1/02 ,  B60N2/02 ,  G03F7/00 ,  A47C1/038

    CPC classification number: G03F7/0002 ,  B29C43/021 ,  B29C2043/025 ,  B29C2043/5858 ,  B82Y10/00 ,  B82Y40/00 ,  Y10S977/887

    Abstract: The present invention is directed to a compliant device comprising a support body, a floating body, and a plurality of flexure arms. Each of the plurality of flexure arms is connected between the support body and the floating body to transfer a load therebetween in parallel. To that end, the flexure arms have first and second sets of flexure joints. The first set of flexure joints facilitate rotational movement of said flexure arm about a first axis extending along a first direction. The second set of flexure joints are arranged to facilitate rotational movement of the flexure arm about a second axis, extending along a second direction that is transverse to the first direction. The flexure joints are revolute joints.

    Abstract translation: 本发明涉及一种包括支撑体，浮体和多个弯曲臂的柔性装置。 多个挠曲臂中的每一个连接在支撑体和浮体之间，以在它们之间平行地传送负载。 为此，弯曲臂具有第一组和第二组挠曲接头。 第一组弯曲接头便于围绕围绕第一方向延伸的第一轴线的所述弯曲臂的旋转运动。 第二组弯曲接头被布置成便于弯曲臂围绕第二轴线的旋转运动，第二轴线沿着横向于第一方向的第二方向延伸。 挠性接头是旋转接头。

    Adaptive shape substrate support method
    10.
    发明申请
    Adaptive shape substrate support method 失效
    自适应形状衬底支持方法

    公开(公告)号：US20050263077A1

    公开(公告)日：2005-12-01

    申请号：US11136892

    申请日：2005-05-25

    Applicant: Mahadevan GanapathiSubramanian ,  Sidlgata Sreenivasan

    Inventor： Mahadevan GanapathiSubramanian ,  Sidlgata Sreenivasan

    IPC: G03F7/00 ,  G03F7/20 ,  H01L21/302 ,  H01L41/08

    CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/707

    Abstract: The present method features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the method includes creating a point contact on the first surface to generate a change in shape of the second surface to obtain a desired shape of the second surface. The desired shape may be smooth, if not substantially planar or any other shape desired within the operational parameters of the chuck and the substrate. For example, the method may compensate for non-planarity due to particulate matter on the first surface and substrate topography. These and other embodiments are discussed more fully below.

    Abstract translation: 本发明的方法具有主动柔性销卡盘以保持具有相对的第一和第二表面的基板，并且补偿基板的一个表面中的非平面性。 为此，该方法包括在第一表面上产生点接触以产生第二表面的形状变化以获得第二表面的期望形状。 所需的形状可以是平滑的，如果不是基本平坦的或在卡盘和基底的操作参数内所需的任何其它形状。 例如，该方法可以补偿由于第一表面上的颗粒物质和基底形貌引起的非平面性。 以下将更全面地讨论这些和其它实施例。

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