公开(公告)号：US07874067B1

公开(公告)日：2011-01-25

申请号：US12137432

申请日：2008-06-11

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  G06F13/36

CPC分类号： G06F1/1632 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

摘要翻译： 根据本发明的某些实施例，单芯片COB USB制造在具有多个单独的USB PCB基板的PCB面板上使用芯片上（COB）工艺。 这种单芯片COB USB以N×M矩阵阵列布置。 该方法的优点是：1）使用PCBA成型，与传统的SMT工艺相比，在基板上安装所有必要的部件以形成PCBA; 2）更简单的矩形结构，适合任何外部装饰外壳包装附加值; 和3）如果不防水，包装是防潮的。

公开(公告)号：US20080195817A1

公开(公告)日：2008-08-14

申请号：US12106517

申请日：2008-04-21

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  I-Kang Yu ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  I-Kang Yu ,  Abraham C. Ma

IPC分类号： G06F13/00 ,  H05K3/20

CPC分类号： H05K3/284 ,  G06K19/077 ,  G06K19/07732 ,  H01L23/49855 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/023 ,  H05K1/117 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/10159 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y10T29/49128 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.

摘要翻译： 包括PCBA的存储卡（例如，SD或MMC）装置，其中部件安装在包括至少一个刚性PCB部分和至少一个柔性PCB部分的“刚性柔性”PCB上，以及壳体， 模制的上壳体部分和模制壳体。 刚性柔性PCB被安装到上部壳体部分中，使得设置在刚性 - 柔性PCB的上表面上的标准金属触点通过限定上部壳体部分的开口暴露，并且使得柔性柔性PCB的柔性部分 超过形成在上壳体部分的内表面上的任何轮廓。 然后通过在刚性柔性PCB的下表面上沉积热固性塑料形成模制套管。

公开(公告)号：US08240034B1

公开(公告)日：2012-08-14

申请号：US12128502

申请日：2008-05-28

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  G11C16/10 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/50 ,  H01L27/11517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K3/0052 ,  H05K3/0097 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/167 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a flash memory card is manufactured using COB processes on a PCB panel with multiple micro cards PCB substrates. These micro memory cards are laid out in an array of 3×5 matrixes of micro cards PCB substrates. A method of molding over a PCBA is utilized, contrary to a conventional method of having two or more pieces of package components to tape together. This results in a simpler structure without the notch which enables easier singulation process and the package is moisture resistance. The final product is a single piece versus two or three pieces glued up pieces and would not separate from pieces. The final product has high water and moisture resistance, low cost and fast manufacturing throughput, no seam and aesthetically more appeasing, can stack more layers of flash memory die, and be maximized XY spaces to accommodate larger size flash memory die.

摘要翻译： 根据本发明的某些实施例，使用COB处理在具有多个微卡PCB基板的PCB面板上制造闪存卡。 这些微型存储卡被布置在3×5矩阵的微卡PCB基板的阵列中。 利用PCBA上的成型方法，这与将两个或多个包装部件捆绑在一起的传统方法相反。 这导致更简单的结构，没有凹口，这使得更容易的分离过程和封装是防潮性的。 最终产品是单件，而不是两件或三件胶合，不会与件分离。 最终产品具有高耐水和耐湿性，低成本和快速的制造生产能力，无缝和美观上的安抚，可以堆叠多层闪存芯片，并最大化XY空间以适应更大尺寸的闪存芯片。

公开(公告)号：US20080145968A1

公开(公告)日：2008-06-19

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/00 ,  H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用用于将每个PCB连接到PCB面板的连接桥件进行切割，然后使用旋转锯切割。 然后执行前沿倒角处理。

公开(公告)号：US08141240B2

公开(公告)日：2012-03-27

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用旋转锯切割连接的桥接件。 然后执行前沿倒角处理。

公开(公告)号：US08102658B2

公开(公告)日：2012-01-24

申请号：US12649233

申请日：2009-12-29

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H05K7/02

CPC分类号： G06F1/1632 ,  H05K1/117 ,  H05K3/202 ,  H05K3/4092 ,  H05K5/0282 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/49126

摘要： A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.

摘要翻译： microSD-SD适配器卡包括具有引线框架结构的基底基板，形成包围引线框架结构的八个microSD接触销的腔室的保护盖，以及形成在保护帽和暴露部分上的热固性塑料外壳 基板为适配卡提供标准的SD卡尺寸。 后开口便于插入标准microSD卡，由此microSD卡上的八个接触垫与室内的八个microSD接触针接触，以使由microSD卡产生的电信号通过以下方式传输到主机系统： 标准SD插座。 夹紧销钉设置在腔室内以与设置在microSD卡上的把手接合部接合。 在模制塑料外壳上设有一个预先模制的开关槽，并在模制后安装插入式写保护开关。

公开(公告)号：US20090190277A1

公开(公告)日：2009-07-30

申请号：US12419187

申请日：2009-04-06

申请人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC分类号： H02H9/00

CPC分类号： G06F1/1632 ,  H01R12/707 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0215 ,  H05K1/0259 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/429 ,  H05K5/0278 ,  H05K9/0067 ,  H05K2201/0311 ,  H05K2201/09318 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/10969

摘要： ESD protection for a portable electronic device is provided by sandwiching a metal ground layer between prepreg (i.e., FR4 or other non-conductive PCB material) layers to form an ESD preventive PCB structure, where the metal ground layer is electrically connected to one or more of the integrated circuit (IC) components (e.g., at least one controller die, a non-volatile memory die, oscillator and passive components) that are mounted on the PCB by way of conductive via structures, and is accessible by way of one or more conductive anchor hole structures to external grounding structures. The one or more conductive anchor hole structures are positioned such that the metal ground layer is automatically electrically connected to the chassis ground of a host system when the portable device is coupled to a plug structure of the host system, e.g., by way of a metal connector jacket.

摘要翻译： 通过在预浸料（即FR4或其他非导电PCB材料）层之间夹住金属接地层，形成ESD防护PCB结构，其中金属接地层电连接到一个或多个 集成电路（IC）组件（例如，至少一个控制器管芯，非易失性存储器管芯，振荡器和无源部件），其通过导电通孔结构安装在PCB上，并且可通过一个或多个 更多的导电锚孔结构到外部接地结构。 一个或多个导电锚定孔结构被定位成使得当便携式设备耦合到主机系统的插头结构时，金属接地层自动地电连接到主机系统的机箱接地，例如通过金属 连接器外套。

公开(公告)号：US07440286B2

公开(公告)日：2008-10-21

申请号：US11927549

申请日：2007-10-29

申请人： Siew S. Hiew ,  Nan Nan ,  Jim Chin-Nan Ni ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Jim Chin-Nan Ni ,  Abraham C. Ma

IPC分类号： H05K7/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07741

摘要： A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.

摘要翻译： 双卡个人读卡器系统使用读卡器和扩展的9针USB插座支持USB和micro-SD设备。 读卡器包括具有四个标准USB金属接触焊盘和设置在上侧的多个扩展目的接触焊盘的PCBA，在下侧由模制壳体覆盖的部件和IC芯片，安装在PCBA上的模制引线框架连接器和 包括五个前向扩展用引脚和八个后面的micro-SD连接器引脚，其通过扩展目的接触焊盘与PCBA通信，以及壳体，其包括用于接收微型SD卡的插槽，使得其与PCBA通信 通过micro-SD连接器引脚。 扩展的9针USB插座包括标准USB触点和扩展使用触点，通过标准USB金属触点和前端扩展目的引脚与PCBA通信。 PCBA包括用于SD / USB通信的双人格电子设备。

公开(公告)号：US08567050B2

公开(公告)日：2013-10-29

申请号：US13274188

申请日：2011-10-14

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H05K3/34

CPC分类号： G06F1/1632 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R12/57 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53209 ,  H01L2224/85 ,  H01L2924/00014

摘要： A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

摘要翻译： 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。 使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯 。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

公开(公告)号：US08102662B2

公开(公告)日：2012-01-24

申请号：US12552250

申请日：2009-09-01

申请人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC分类号： H05K7/12

CPC分类号： G06F1/1632 ,  H05K5/0278

摘要： A USB device including a bistable mechanism that serves to bias a plug connector into one of two stable states, where the first stable state is associated with a retracted position in which the plug connector is fully retracted inside a housing, and the second stable state is associated with a deployed position in which the plug connector extends through the front opening for coupling to a host system. Movement of the plug connector form the retracted to the deployed position is performed by manually applying a force to a handle portion that protrudes through a slot defined in the housing. The bistable mechanism resists the deploying force until an equilibrium point is reach, after which the bistable mechanism releases stored potential energy to complete the deploying process and to maintain the plug connector is the deployed position.

摘要翻译： 一种USB装置，包括用于将插头连接器偏置成两个稳定状态之一的双稳态机构，其中第一稳定状态与插入连接器完全缩回到壳体内的缩回位置相关联，并且第二稳定状态为 与展开位置相关联，其中插头连接器延伸穿过前开口以联接到主机系统。 插头连接器的移动通过手动施加到通过限定在壳体中的狭槽突出的手柄部分来执行。 双稳态机构抵抗展开力直到达到平衡点，然后双稳态机构释放存储的势能以完成部署过程并保持插头连接器处于展开位置。