Abstract:
A temperature measurement device includes a light emitting part including a first light source configured to output measurement light with a first wavelength and a second light source configured to output reference light with a second wavelength, a light receiving part configured to receive reflected light of the measurement light and reflected light of the reference light that have passed through a temperature sensing device that changes light transmission characteristics with changes in temperature, a control part configured to measure a temperature detected by the temperature sensing device based on an amount of light of the received reflected light of the measurement light and an amount of light of the received reflected light of the reference light, and a temperature adjustment part configured to separately adjust the temperature of the first light source and the temperature of the second light source.
Abstract:
An analysis apparatus, a substrate processing system, a substrate processing apparatus, an analysis method, and an analysis program improve adjustment accuracy in adjusting the temperature of a substrate. The analysis apparatus includes circuitry that performs training to generate a trained model using setting parameters for temperature adjustment elements in regions divided from a substrate support in a process space in a first vacuum environment and using a first temperature data set that is data of temperatures at positions on a substrate supported by the substrate support, and that calculates setting parameters for the temperature adjustment elements corresponding to a target temperature of the substrate using the trained model.
Abstract:
A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.
Abstract:
A plasma processing method includes (a) acquiring emission intensity of radicals generated by ionization of a processing gas within a chamber by a sensor that detects emission intensity within the chamber, in a plasma processing in which supplying of the processing gas to the chamber and exhausting of inside of the chamber are periodically repeated; (b) acquiring a target setting value of the emission intensity; and (c) calculating a processing condition of the plasma processing which brings the emission intensity closer to the setting value, based on the emission intensity acquired by (a) and the setting value acquired by (b).
Abstract:
Provided is an optical temperature sensor including a temperature sensing element having light transmission characteristics that vary with temperature, a hollow holding member that holds the temperature sensing element, and an optical fiber that is arranged inside the holding member, the optical fiber including a tip face that is disposed to face the temperature sensing element at a position separated from the temperature sensing element by a predetermined distance. The temperature sensing element allows light emitted from the tip face of the optical fiber to be incident thereon, allows the incident light to be transmitted therethrough, and allows reflected light of the transmitted light that has been reflected by a measuring object to be transmitted therethrough.
Abstract:
A substrate processing apparatus includes: a chamber having a processing space; a base arranged inside the processing space and having an internal space; an electrostatic chuck arranged on the base and including a dielectric member having a support surface, at least one heater electrode layer arranged inside the dielectric member and formed of a first material, and at least one resistive layer arranged inside the dielectric member and formed of a second material, wherein a resistance temperature coefficient of the second material is equal to or greater than that of the first material; a control circuit arranged inside the internal space and configured to control power to be applied to the at least one heater electrode layer; and a detection circuit arranged inside the internal space and configured to detect a voltage applied to the at least one resistive layer.
Abstract:
Disclosed is a substrate processing system including a substrate processing apparatus; and a control device that controls the substrate processing apparatus. The substrate processing apparatus includes: a chamber; a placing table provided within the chamber; and heaters embedded in the placing table corresponding to division regions, respectively. The control device includes: a holding unit that holds a table for each of the division regions; a measuring unit that measures the resistance value of each of the heaters embedded in the placing table for each of the division regions; and a controller that estimates a temperature of each of the division regions corresponding to the resistance value of each of the heaters measured by the measuring unit with reference to the table for each of the division regions, and controls an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature.
Abstract:
A temperature sensor includes a sensing member, a retention member configured to secure the sensing member, an optical fiber configured to irradiate the sensing member with light and guide the light reflected from the sensing member, and a cylindrical sleeve configured to accommodate the optical fiber. The retention member is a plate-shaped component and has a cut-out portion formed on at least one of a peripheral portion of a non-retention surface of the retention member opposite to a retention surface to which the sensing member is secured and a side surface of the retention member. The retention member is secured to a tip of the sleeve so that the non-retention surface is exposed to the outside, and the tip of the sleeve is engaged with the cut-out portion.
Abstract:
An optical temperature sensor includes an light-emitting-side measurement unit to measure a first light intensity of a measuring beam and a second light intensity of a reference beam, and a light-receiving-side measurement unit to measure a third light intensity of a first reflected beam of the measuring beam and a fourth light intensity of a second reflected beam of the reference beam. The optical temperature sensor further includes a control unit to adjust at least one of a first control target value of the first light intensity and a second control target value of the second light intensity based on at least one of the third light intensity and the fourth light intensity. The control unit controls at least one of the first light intensity and the second light intensity based on the adjusted at least one of the first and second control target values.