公开(公告)号：US07864892B2

公开(公告)日：2011-01-04

申请号：US11606067

申请日：2006-11-30

Applicant: Tadashi Ikeuchi ,  Naoki Kuwata ,  Toru Katagiri

Inventor： Tadashi Ikeuchi ,  Naoki Kuwata ,  Toru Katagiri

IPC: H04L27/22

CPC classification number: H04L27/2096 ,  H04B10/677

Abstract: A receiving/processing unit receives signals parallelized by a parallelizing unit, and executes a frame process including frame synchronization process on the signals. A phase comparing circuit and a phase judging circuit judge whether a bit delay is present based on a phase difference between a phase of a clock signal at a clock/data recovering unit and a phase of a clock signal at the parallelizing unit. The receiving/processing unit includes a logic processing circuit that executes a bit delay process based on a result of judgment by the phase comparing circuit and the phase judging circuit.

Abstract translation: 接收/处理单元接收由并行化单元并行化的信号，并对信号执行包括帧同步处理的帧处理。 相位比较电路和相位判断电路基于时钟/数据恢复单元的时钟信号的相位与并行化单元中的时钟信号的相位之间的相位差来判断是否存在位延迟。 接收/处理单元包括基于相位比较电路和相位判断电路的判断结果执行位延迟处理的逻辑处理电路。

公开(公告)号：US07443279B2

公开(公告)日：2008-10-28

申请号：US11366625

申请日：2006-03-03

Applicant: Takatoshi Yagisawa ,  Tadashi Ikeuchi ,  Yasuhide Kuroda ,  Tszshing Cheung

Inventor： Takatoshi Yagisawa ,  Tadashi Ikeuchi ,  Yasuhide Kuroda ,  Tszshing Cheung

IPC: H01F27/28 ,  H03H7/00

CPC classification number: H01F5/00 ,  H01F27/027 ,  H01F2005/006 ,  H01Q1/36 ,  H01Q19/09 ,  H05K1/0243

Abstract: A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.

Abstract translation: 一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。 锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。 线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续， 通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极 线圈的大直径侧到电介质基板上的电极。

公开(公告)号：US06282216B1

公开(公告)日：2001-08-28

申请号：US09471370

申请日：1999-12-23

Applicant: Tadashi Ikeuchi ,  Tadao Inoue ,  Toru Matsuyama ,  Toshiyuki Takauji ,  Norio Ueno

Inventor： Tadashi Ikeuchi ,  Tadao Inoue ,  Toru Matsuyama ,  Toshiyuki Takauji ,  Norio Ueno

IPC: H01S313

CPC classification number: H04B10/564 ,  H04B10/504

Abstract: A burst mode optical transmitter circuit comprises a semiconductor laser, a photodiode for monitoring the light output from the semiconductor laser, a current-voltage converting circuit for converting the current detected by the photodiode into a voltage, an APC amplifier, a holding circuit for holding, as a current control signal, the output signal from the APC amplifier, a driving circuit for supplying a driving current to the semiconductor laser according the current control signal from the holding circuit and the the data input in the burst mode, and a data interruption detecting circuit for detecting an interrupt period of the data input to the driving circuit to reset the holding circuit, in which the current control signal held in the hold circuit is reset by the reset signal, whereby a stable burst optical transmission can be performed stably with a simple construction.

Abstract translation: 突发模式光发射机电路包括半导体激光器，用于监测来自半导体激光器的光输出的光电二极管，用于将由光电二极管检测的电流转换为电压的电流 - 电压转换电路，APC放大器，用于保持的保持电路 作为电流控制信号，来自APC放大器的输出信号，用于根据来自保持电路的电流控制信号和在突发模式中输入的数据向半导体激光器提供驱动电流的驱动电路和数据中断 检测电路，用于检测输入到驱动电路的数据的中断周期以复位保持电路，其中保持在保持电路中的电流控制信号由复位信号复位，从而可以稳定地执行稳定的突发光传输， 一个简单的施工。

公开(公告)号：US20120286904A1

公开(公告)日：2012-11-15

申请号：US13561138

申请日：2012-07-30

Applicant: Tadashi Ikeuchi ,  Takatoshi Yagisawa

Inventor： Tadashi Ikeuchi ,  Takatoshi Yagisawa

IPC: H01P5/08 ,  H01R12/79 ,  H01R12/71

CPC classification number: H01R12/62 ,  H01R12/57

Abstract: A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.

Abstract translation: 引线端子包括信号引脚引脚和GND引脚引脚。 信号引线引脚将柔性基板上的一个信号图案和刚性基板上的另一个信号图案连接起来。 GND引脚将柔性基板上的一个GND图案和刚性基板中的另一个GND图案连接起来。 保持构件具有绝缘性能并且保持一定距离的信号引线引脚和GND引脚引脚。 信号引脚的一个主要部分和GND引脚的另一个主要部分形成微带线结构。

公开(公告)号：US08178788B2

公开(公告)日：2012-05-15

申请号：US12222115

申请日：2008-08-01

Applicant: Takatoshi Yagisawa ,  Tadashi Ikeuchi

Inventor： Takatoshi Yagisawa ,  Tadashi Ikeuchi

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H01L23/4985 ,  G02B6/4201 ,  H01L23/057 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1903 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/189 ,  H01L2224/0401

Abstract: An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.

Abstract translation: 电子部件封装包括安装电子部件的薄膜基板和安装在薄膜基板上以覆盖薄膜基板的表面的盖部。 电子部件设置在由薄膜基板和盖部形成的空腔中，电子部件与形成在薄膜基板上的信号布线导体连接。

公开(公告)号：US20090029570A1

公开(公告)日：2009-01-29

申请号：US12010878

申请日：2008-01-30

Applicant: Tadashi Ikeuchi ,  Takatoshi Yagisawa ,  Tszshing Cheung

Inventor： Tadashi Ikeuchi ,  Takatoshi Yagisawa ,  Tszshing Cheung

IPC: H01R12/12

CPC classification number: H01P1/047 ,  H01L24/73 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0219 ,  H05K1/117 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/10121 ,  H05K2201/10446 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.

Abstract translation: 根据实施例的一个方面，用于连接电路板的基板包括：具有彼此面对的第一表面和第二表面的基板构件和彼此面对的第一端和第二端; 形成在第一端的第一表面上的第一信号线; 形成在第二端的第二表面上的第二信号线; 连接所述第一信号线与所述第二信号线的第三信号线; 布置在第一表面上并围绕第一信号线的第一接地平面; 以及形成在第一接地上的第二信号线的一部分，该部分包括比第二信号线的另一部分窄的部分。

公开(公告)号：US07436056B2

公开(公告)日：2008-10-14

申请号：US11456870

申请日：2006-07-12

Applicant: Tszshing Cheung ,  Tadashi Ikeuchi ,  Takatoshi Yagisawa

Inventor： Tszshing Cheung ,  Tadashi Ikeuchi ,  Takatoshi Yagisawa

IPC: H01L23/04 ,  H01L23/12

CPC classification number: H01L23/50 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6616 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/19051 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.

Abstract translation: 电子部件封装包括电介质基板，其具有电子部件被密封的第一表面。 连接到电子部件的第一信号线和第一接地导体形成在电介质基板的第一表面上。 连接到外部连接电极和第二接地导体的第二信号线形成在电介质基板的第二表面上。 第一接地导体和第二接地导体通过多个接地导体通孔连接。 连接到第一信号线和第二信号线的衬底埋入信号线设置在电介质衬底的内部，以便放置在第一接地导体和第二接地导体之间和之下并且在接地导体通孔之间 在右边和左边。

公开(公告)号：US20070286612A1

公开(公告)日：2007-12-13

申请号：US11590749

申请日：2006-11-01

Applicant: Naoki Kuwata ,  Tadashi Ikeuchi ,  Takatoshi Yagisawa

Inventor： Naoki Kuwata ,  Tadashi Ikeuchi ,  Takatoshi Yagisawa

IPC: H04B10/06

CPC classification number: H04J14/02 ,  H04B10/6971

Abstract: In a receiver, a skew detector detects a skew between two synchronization symbols having different wavelengths among synchronization symbols included in received signals. A skew rough adjustment calculator calculates a delay compensation amount for each received signal based on the skew and a signal delay characteristic in a transmission path. A variable delay processor deskews the received signals based on the delay compensation amount.

Abstract translation: 在接收机中，偏斜检测器检测包括在接收信号中的同步符号之间具有不同波长的两个同步符号之间的偏差。 偏斜粗略调整计算器基于偏斜和传输路径中的信号延迟特性来计算每个接收信号的延迟补偿量。 可变延迟处理器根据延迟补偿量对接收的信号进行偏移。

公开(公告)号：US20070241447A1

公开(公告)日：2007-10-18

申请号：US11456870

申请日：2006-07-12

Applicant: Tszshing Cheung ,  Tadashi Ikeuchi ,  Takatoshi Yagisawa

Inventor： Tszshing Cheung ,  Tadashi Ikeuchi ,  Takatoshi Yagisawa

IPC: H01L23/12

CPC classification number: H01L23/50 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6616 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/19051 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.

Abstract translation: 电子部件封装包括电介质基板，其具有电子部件被密封的第一表面。 连接到电子部件的第一信号线和第一接地导体形成在电介质基板的第一表面上。 连接到外部连接电极和第二接地导体的第二信号线形成在电介质基板的第二表面上。 第一接地导体和第二接地导体通过多个接地导体通孔连接。 连接到第一信号线和第二信号线的衬底埋入信号线设置在电介质衬底的内部，以便放置在第一接地导体和第二接地导体之间和之下并且在接地导体通孔之间 在右边和左边。

公开(公告)号：US07266308B2

公开(公告)日：2007-09-04

申请号：US11203544

申请日：2005-08-15

Applicant: Tadao Inoue ,  Tadashi Ikeuchi ,  Hiroyuki Rokugawa ,  Masaaki Kawai ,  Norio Ueno ,  Norio Murakami ,  Toru Matsuyama ,  Makoto Miki ,  Toshiyuki Takauji

Inventor： Tadao Inoue ,  Tadashi Ikeuchi ,  Hiroyuki Rokugawa ,  Masaaki Kawai ,  Norio Ueno ,  Norio Murakami ,  Toru Matsuyama ,  Makoto Miki ,  Toshiyuki Takauji

IPC: H04B10/04 ,  H04B10/12 ,  H01S3/13

CPC classification number: H01S5/0683 ,  H01S5/06825

Abstract: Using a switching signal from a coarse/fine switching and operation mode switching circuit, the width of change of a counter control value during power up is increased, and the width of change is reduced once a steady state is reached. In the steady state, the frequency of updating is limited by a control signal from an update permit control circuit. In the steady state, the frequency band of a current source in an LD driving circuit is reduced in width.

Abstract translation: 使用来自粗/精切换和动作模式切换电路的切换信号，上电期间的计数器控制值的变化幅度增大，一旦达到稳定状态，则变化幅度减小。 在稳定状态下，更新频率受来自更新许可控制电路的控制信号的限制。 在稳态中，LD驱动电路中的电流源的频带宽度减小。