公开(公告)号：US20070176302A1

公开(公告)日：2007-08-02

申请号：US11643693

申请日：2006-12-22

申请人： Tae Soo Lee ,  Yun Hwi Park ,  Taek Jung Lee

发明人： Tae Soo Lee ,  Yun Hwi Park ,  Taek Jung Lee

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/49811 ,  H01L23/15 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/341 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

摘要： An LTCC module includes an LTCC substrate and a pad part formed on an undersurface of the LTCC substrate for mounting the LTCC substrate to an external substrate. The pad part includes a metal pad layer formed on an undersurface of the LTCC substrate and a solder layer formed on an undersurface of the metal pad layer.

摘要翻译： LTCC模块包括LTCC基板和形成在LTCC基板的下表面上的焊盘部分，用于将LTCC基板安装到外部基板。 焊盘部分包括形成在LTCC衬底的下表面上的金属焊盘层和形成在金属焊盘层的下表面上的焊料层。

公开(公告)号：US20080303120A1

公开(公告)日：2008-12-11

申请号：US12155867

申请日：2008-06-11

申请人： Tae Soo Lee ,  Yun Hwi Park

发明人： Tae Soo Lee ,  Yun Hwi Park

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor chip package includes a main board; a ceramic substrate having a cavity within which at least one chip is electrically mounted, the cavity being placed at a lower portion of the ceramic substrate facing the main board; and a conductive shielding layer provided with a predetermined thickness on the outside of the ceramic substrate. The ceramic substrate includes: at least one first ground line electrically connecting the conductive shielding layer with the main board; at least one second ground line electrically connecting the conductive shielding layer with the chip; and at least one signal line electrically connecting the chip with the main board. Thus, manufacturing costs are lowered because of the reduced number of components being used, miniaturization in device design can be achieved because of the small volume of the package, and the ground performance can be improved.

摘要翻译： 半导体芯片封装包括主板; 陶瓷基板，其具有至少一个芯片电气安装的空腔，所述空腔设置在所述陶瓷基板的面对所述主板的下部; 以及在陶瓷基板的外侧设置有规定厚度的导电性屏蔽层。 陶瓷基板包括：将导电屏蔽层与主板电连接的至少一个第一接地线; 将所述导电屏蔽层与所述芯片电连接的至少一个第二接地线; 以及将芯片与主板电连接的至少一个信号线。 因此，由于使用的部件数量减少，制造成本降低，因为可以实现小型化的装置设计，因为包装体积小，并且可以提高地面性能。

公开(公告)号：US08043896B2

公开(公告)日：2011-10-25

申请号：US12651234

申请日：2009-12-31

申请人： Tae Soo Lee ,  Yun Hwi Park

发明人： Tae Soo Lee ,  Yun Hwi Park

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/552 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00014

摘要： In a semiconductor chip, a body has a top surface where a pattern is formed, an underside surface opposing the top surface and a plurality of side surfaces. A plurality of electrode pads are formed on the top surface of the body to connect to an external terminal. A shielding conductive film is formed on the surfaces excluding the top surface of the body where the pattern is formed. A conductive via is extended through the body to connect one of the electrode pads with the conductive film.

摘要翻译： 在半导体芯片中，主体具有形成图案的顶表面，与顶表面相对的下表面和多个侧表面。 多个电极焊盘形成在主体的顶表面上以连接到外部端子。 在除了形成图案的主体的顶表面之外的表面上形成屏蔽导电膜。 导电通孔延伸通过本体以将电极焊盘中的一个与导电膜连接。

公开(公告)号：US07872869B2

公开(公告)日：2011-01-18

申请号：US12425111

申请日：2009-04-16

申请人： Tae Soo Lee ,  Yun Hwi Park

发明人： Tae Soo Lee ,  Yun Hwi Park

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/10287 ,  H01L2924/00

摘要： Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.

摘要翻译： 提供一种具有能够提高散热效率的散热器的电子芯片模块。 模块电路板的底面和散热器的上表面通过使用金属线彼此直接接触，使得在安装到模块电路板上的发热装置芯片的操作期间产生的热可以 有效地消散到外面。

公开(公告)号：US07745911B2

公开(公告)日：2010-06-29

申请号：US12155867

申请日：2008-06-11

申请人： Tae Soo Lee ,  Yun Hwi Park

发明人： Tae Soo Lee ,  Yun Hwi Park

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor chip package includes a main board; a ceramic substrate having a cavity within which at least one chip is electrically mounted, the cavity being placed at a lower portion of the ceramic substrate facing the main board; and a conductive shielding layer provided with a predetermined thickness on the outside of the ceramic substrate. The ceramic substrate includes: at least one first ground line electrically connecting the conductive shielding layer with the main board; at least one second ground line electrically connecting the conductive shielding layer with the chip; and at least one signal line electrically connecting the chip with the main board. Thus, manufacturing costs are lowered because of the reduced number of components being used, miniaturization in device design can be achieved because of the small volume of the package, and the ground performance can be improved.

摘要翻译： 半导体芯片封装包括主板; 陶瓷基板，其具有至少一个芯片电气安装的空腔，所述空腔设置在所述陶瓷基板的面对所述主板的下部; 以及在陶瓷基板的外侧设置有规定厚度的导电性屏蔽层。 陶瓷基板包括：将导电屏蔽层与主板电连接的至少一个第一接地线; 将所述导电屏蔽层与所述芯片电连接的至少一个第二接地线; 以及将芯片与主板电连接的至少一个信号线。 因此，由于使用的部件数量减少，制造成本降低，因为可以实现小型化的装置设计，因为包装体积小，并且可以提高地面性能。

公开(公告)号：US20070267725A1

公开(公告)日：2007-11-22

申请号：US11702131

申请日：2007-02-05

申请人： Tae Soo Lee ,  Yun Hwi Park

发明人： Tae Soo Lee ,  Yun Hwi Park

IPC分类号： H01L23/48 ,  H01L21/4763 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00014

摘要： In a semiconductor chip, a body has a top surface where a pattern is formed, an underside surface opposing the top surface and a plurality of side surfaces. A plurality of electrode pads are formed on the top surface of the body to connect to an external terminal. A shielding conductive film is formed on the surfaces excluding the top surface of the body where the pattern is formed. A conductive via is extended through the body to connect one of the electrode pads with the conductive film.

摘要翻译： 在半导体芯片中，主体具有形成图案的顶表面，与顶表面相对的下表面和多个侧表面。 多个电极焊盘形成在主体的顶表面上以连接到外部端子。 在除了形成图案的主体的顶表面之外的表面上形成屏蔽导电膜。 导电通孔延伸通过本体以将电极焊盘中的一个与导电膜连接。

公开(公告)号：US08349053B2

公开(公告)日：2013-01-08

申请号：US12701916

申请日：2010-02-08

申请人： Tae Soo Lee ,  Yoon Sun Choi ,  Seung Kwon Oh ,  Shin Kyu Han

发明人： Tae Soo Lee ,  Yoon Sun Choi ,  Seung Kwon Oh ,  Shin Kyu Han

IPC分类号： B01D53/02

CPC分类号： B01D53/053 ,  B01D2256/12 ,  B01D2257/102 ,  B01D2259/40073

摘要： A high efficiency gas concentrating apparatus includes an air compressor for supplying high pressure air, first and second adsorption towers that are disposed above the air compressor and communicating with the air compressor to adsorb nitrogen and concentrate oxygen as the high pressure air is alternately supplied thereto, first and second concentrating passages that are disposed above the respective first and second adsorption towers to discharge the concentrated oxygen, and a cleaning tank that is disposed between the first and second concentrating passages to receive a portion of the concentrated oxygen from one of the first and second adsorption towers, temporarily store the received concentrated oxygen therein, and alternately remove adsorbed nitrogen by supplying the temporarily concentrated oxygen to the other of the first and second adsorption towers.

摘要翻译： 高效率气体浓缩装置包括：空气压缩机，其供给高压空气;第一吸附塔和第二吸附塔，其配置在空气压缩机的上方，与空气压缩机连通，以在高压空气交替供给时吸附氮气并浓缩氧气， 第一和第二浓缩通道，其设置在相应的第一和第二吸附塔上方以排出浓缩的氧气;以及清洗槽，设置在第一和第二浓缩通道之间，以从第一和第二浓缩通道之一接收一部分浓缩氧， 第二吸附塔临时存储所接收的浓缩氧，并且通过将暂时浓缩的氧气供应到第一和第二吸附塔中的另一个来交替地去除吸附的氮。

公开(公告)号：US20070246825A1

公开(公告)日：2007-10-25

申请号：US11736201

申请日：2007-04-17

申请人： Kwang Jae Oh ,  Je Hong Sung ,  Yoon Hyuck Choi ,  Tae Soo Lee

发明人： Kwang Jae Oh ,  Je Hong Sung ,  Yoon Hyuck Choi ,  Tae Soo Lee

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L23/552 ,  H01L23/66 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K9/003 ,  H05K9/0032 ,  H01L2924/00

摘要： A high frequency module and a manufacturing method thereof In the module, a substrate has a ground. A plurality of surface mounted devices are mounted on the substrate. A metal wall is connected to the ground of the substrate. A resin molding hermetically seals the surface mounted devices and the metal wall, the resin molding formed to expose a top surface of the metal wall. Also, a metal film is formed on the resin molding to contact the top surface of the exposed metal wall.

摘要翻译： 高频模块及其制造方法在该模块中，基板具有接地。 多个表面安装的装置安装在基板上。 金属壁连接到基板的地面。 树脂模制气密地密封表面安装的装置和金属壁，形成为暴露金属壁的顶表面的树脂模制件。 另外，在树脂成形体上形成金属膜，与露出的金属壁的顶面接触。

公开(公告)号：US20110154986A1

公开(公告)日：2011-06-30

申请号：US12701916

申请日：2010-02-08

申请人： Tae Soo Lee ,  Yoon Sun Choi ,  Seung Kwon Oh ,  Shin Kyu Han

发明人： Tae Soo Lee ,  Yoon Sun Choi ,  Seung Kwon Oh ,  Shin Kyu Han

IPC分类号： B01D53/02 ,  B01D53/04

CPC分类号： B01D53/053 ,  B01D2256/12 ,  B01D2257/102 ,  B01D2259/40073

摘要： A high efficiency gas concentrating apparatus includes an air compressor for supplying high pressure air, first and second adsorption towers that are disposed above the air compressor and communicating with the air compressor to adsorb nitrogen and concentrate oxygen as the high pressure air is alternately supplied thereto, first and second concentrating passages that are disposed above the respective first and second adsorption towers to discharge the concentrated oxygen, and a cleaning tank that is disposed between the first and second concentrating passages to receive a portion of the concentrated oxygen from one of the first and second adsorption towers, temporarily store the received concentrated oxygen therein, and alternately remove adsorbed nitrogen by supplying the temporarily concentrated oxygen to the other of the first and second adsorption towers.

摘要翻译： 高效率气体浓缩装置包括：空气压缩机，其供给高压空气;第一吸附塔和第二吸附塔，其配置在空气压缩机的上方，与空气压缩机连通，以在高压空气交替供给时吸附氮气并浓缩氧气， 第一和第二浓缩通道，其设置在相应的第一和第二吸附塔上方以排出浓缩的氧气;以及清洗槽，设置在第一和第二浓缩通道之间，以从第一和第二浓缩通道之一接收一部分浓缩氧， 第二吸附塔临时存储所接收的浓缩氧，并且通过将暂时浓缩的氧气供应到第一和第二吸附塔中的另一个来交替地去除吸附的氮。

公开(公告)号：US07533872B2

公开(公告)日：2009-05-19

申请号：US11851610

申请日：2007-09-07

申请人： Tae Soo Lee ,  Yoon Sun Choi ,  Young Duck Kim

发明人： Tae Soo Lee ,  Yoon Sun Choi ,  Young Duck Kim

IPC分类号： B01F3/04

CPC分类号： C01B13/027 ,  C01B2210/0046 ,  Y10S261/65

摘要： An oxygen generator including: a humidifier tank moves up and down according to a horizontal movement of an adjustment knob so that the humidifier tank can be readily detachable, and thus a user can securely and conveniently use the oxygen generator without any water leakage from the humidifier tank during an operation of the oxygen generator. Also, it is possible to reduce noise due to driving of a compressor, noise due to the nitrogen exhaustion, and noise due to driving of a fan portion when the oxygen generator operates, to display purity information about the discharged oxygen, sensed by an oxygen sensor, as a digitalized numerical value on a display portion so that a user may readily recognize a current oxygen purity, and to drive the compressor at a low power consumption based on a discharge flow rate of oxygen and thereby reduce the power consumption.

摘要翻译： 一种氧气发生器，包括：加湿箱根据调节旋钮的水平运动而上下移动，使得加湿器罐能够容易地拆卸，从而使用者可以可靠地方便地使用氧气发生器，而不会从加湿器中漏水 在氧气发生器的操作期间的罐。 此外，可以降低由于压缩机的驱动引起的噪音，由于氮气排出引起的噪音，以及当氧气发生器运行时由于风扇部分的驱动引起的噪声，以显示由氧气感测的关于排出的氧气的纯度信息 传感器，作为显示部分上的数字化数值，使得用户可以容易地识别当前的氧气纯度，并且基于氧气的排放流量以低功耗驱动压缩机，从而降低功耗。