公开(公告)号：US20100109141A1

公开(公告)日：2010-05-06

申请号：US12558814

申请日：2009-09-14

申请人： Taku NISHIYAMA ,  Naohisa OKUMURA ,  Kiyokazu OKADA

发明人： Taku NISHIYAMA ,  Naohisa OKUMURA ,  Kiyokazu OKADA

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/115 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor memory card includes a wiring board which has a first pad region along a first long side and a second pad region along a second long side. First memory chips which configure a first chip group are stacked in a step-like shape on the wiring board. Second memory chips which configure a second chip group are stacked in a step-like shape on the first chip group with the direction reversed. The electrode pads of the first memory chips are electrically connected to the connection pads arranged on the first pad region, and the electrode pads of the second memory chips are electrically connected to the connection pads arranged on the second pad region.

摘要翻译： 半导体存储卡包括具有沿着第一长边的第一焊盘区域和沿着第二长边的第二焊盘区域的布线板。 配置第一芯片组的第一存储芯片在布线板上以阶梯状形式堆叠。 构成第二芯片组的第二存储芯片在第一芯片组上以阶梯状形状堆叠，其方向颠倒。 第一存储器芯片的电极焊盘电连接到布置在第一焊盘区域上的连接焊盘，并且第二存储器芯片的电极焊盘电连接到布置在第二焊盘区域上的连接焊盘。

公开(公告)号：US20100187690A1

公开(公告)日：2010-07-29

申请号：US12696513

申请日：2010-01-29

申请人： Kiyokazu OKADA ,  Taku NISHIYAMA

发明人： Kiyokazu OKADA ,  Taku NISHIYAMA

IPC分类号： H01L23/488 ,  H01L25/065

CPC分类号： H01L24/48 ,  H01L23/50 ,  H01L24/28 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19105 ,  H01L2224/85186 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20758 ,  H01L2924/01006 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes a wiring substrate having connection pads. A first semiconductor chip is mounted on the wiring substrate. A second semiconductor chip is stacked on the first semiconductor chip in a step-like shape. Electrode pads of the first semiconductor chip are electrically connected to the connection pads of the wiring substrate via first metal wires. Electrode pads of the second semiconductor chip are electrically connected to the electrode pads of the first semiconductor chip via second metal wires. One end of the second metal wire is connected from above metal bump formed on the first electrode pad.

摘要翻译： 半导体器件包括具有连接焊盘的布线基板。 第一半导体芯片安装在布线基板上。 第二半导体芯片以阶梯状形式堆叠在第一半导体芯片上。 第一半导体芯片的电极焊盘经由第一金属线电连接到布线基板的连接焊盘。 第二半导体芯片的电极焊盘经由第二金属线电连接到第一半导体芯片的电极焊盘。 第二金属线的一端从形成在第一电极焊盘上的金属凸块连接起来。

公开(公告)号：US20100200976A1

公开(公告)日：2010-08-12

申请号：US12762401

申请日：2010-04-19

申请人： Taku NISHIYAMA ,  Tetsuya YAMAMOTO ,  Kiyokazu OKADA

发明人： Taku NISHIYAMA ,  Tetsuya YAMAMOTO ,  Kiyokazu OKADA

IPC分类号： H01L25/065 ,  H01L23/52

CPC分类号： H01L25/18 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A plurality of semiconductor elements configuring a first element group are stacked in a step-like shape on a wiring board. A plurality of semiconductor elements configuring a second element group are stacked in a step-like shape on the first element group toward a direction opposite to the stepped direction of the first element group. The semiconductor elements are electrically connected to connection pads of the wiring board through metallic wires. Among the plurality of semiconductor elements configuring the second element group, the lowermost semiconductor element has a thickness larger than those of the other semiconductor elements.

摘要翻译： 构成第一元件组的多个半导体元件在布线板上以阶梯状形式堆叠。 构成第二元件组的多个半导体元件朝向与第一元件组的阶梯方向相反的方向在第一元件组上以阶梯状形状堆叠。 半导体元件通过金属线电连接到布线板的连接焊盘。 在构成第二元件组的多个半导体元件中，最下半导体元件的厚度大于其它半导体元件的厚度。

公开(公告)号：US20100120203A1

公开(公告)日：2010-05-13

申请号：US12693096

申请日：2010-01-25

申请人： Takashi OKADA ,  Kiyokazu OKADA ,  Akinori ONO ,  Taku NISHIYAMA

发明人： Takashi OKADA ,  Kiyokazu OKADA ,  Akinori ONO ,  Taku NISHIYAMA

IPC分类号： H01L21/50 ,  H01L21/56

CPC分类号： H05K1/0256 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0761 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2203/0228 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

摘要翻译： 电路板具有设置在其外部形状的至少一侧的弯曲部分。 外部连接端子设置在电路板的第一主表面上。 半导体元件安装在电路板的第二主表面上。 第一布线网络设置在除了第一主表面上的端子区域之外的区域中。 第二配线网络设置在第二主表面上。 从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离 至少一个对方到第二布线网络。

公开(公告)号：US20130253810A1

公开(公告)日：2013-09-26

申请号：US13789044

申请日：2013-03-07

申请人： Takayuki MIYAJIMA ,  Satoshi HIRANO ,  Kiyokazu OKADA

发明人： Takayuki MIYAJIMA ,  Satoshi HIRANO ,  Kiyokazu OKADA

IPC分类号： G08G1/00

CPC分类号： G08G1/00 ,  G08G1/0112 ,  G08G1/0133

摘要： Devices, methods, and programs determine whether a vehicle has exited a link based on map information. If so, the devices, methods, and programs acquire a travel traffic congestion level of the exited link based on travel information within the exited link, and determine whether the travel traffic congestion level of the exited link coincides with a distributed traffic congestion level at a time when the vehicle exited. If not, the devices, methods, and programs determine whether the traffic information has been updated and the distributed traffic congestion level has been changed within the exited link, and if so, acquire a distribution time rate of each distributed traffic congestion level within the exited link. The devices, methods, and programs determine a traffic congestion level of the exited link based on the distribution time rate of each acquired distributed traffic congestion level and the travel traffic congestion level of the exited link.

摘要翻译： 设备，方法和程序确定车辆是否已经基于地图信息退出链接。 如果是这样，设备，方法和程序基于退出的链路中的旅行信息获取退出的链路的旅行交通拥堵级别，并且确定退出链路的旅行业务拥塞级别是否与 车辆退出时间。 如果不是，设备，方法和程序确定流量信息是否已经被更新，并且分配的流量拥塞水平已经在退出的链路内被改变，并且如果是，则获取退出的每个分布的流量拥塞级别的分配时间速率 链接。 设备，方法和程序基于每个获取的分布式业务拥塞级别的分布时间速率和退出链路的旅行业务拥塞级别来确定退出链路的业务拥塞级别。