摘要:
An apparatus and method for detecting a defective array of NVRAM cells. A counter is provided which times an erase time interval for the NVRAM cells during a regular erase function. The computed erase interval is compared with a maximum erase interval to determine at least a first characteristic which indicates the block of NVRAMs is at the end of its useful life. A second characteristic is determined by computing the slope in the erase time function versus the number of simulated erase functions. When the slope of the erase function exceeds a maximum slope, the NVRAM array is determined to be at the end of its useful life.
摘要:
Breakdown and latch-up of field effect transistors integrated with non-volatile semiconductor memory cells requiring voltages higher than logic level voltages for write and erase operations is avoided while limiting process complexity and constraints and increasing potential integration density by using thin film transistors for high voltage switching and isolating the thin film transistors from the substrate by forming the thin film transistors on isolation structures extending between or over elements formed at a surface of a substrate or semiconductor layer. Geometry and doping levels of the thin film transistors is thus made independent of geometry and doping levels of the non-volatile semiconductor memory cells and other field effect transistors operating at lower logic-level voltages. In particular, the thickness of a doped semiconductor layer in which an impurity well may be formed can be determined in a manner to optimize performance of transistors operating at logic level voltages rather than the breakdown voltage which must be withstood by transistors used for controlling write and erase operations of the non-volatile memory cells.
摘要:
A nonvolatile memory cell comprises a conductive cantilever beam having a free end in a first charge state, a first FET having a conductive gate in a second charge state and a pull-in electrode adapted to bring the cantilever beam into electrical contact with the gate to effect a charge state change in the gate. A pull-in electrode input is connected to the electrode, a cantilever input is connected to the cantilever, a column select input is connected to the first FET and a row select input is connected to the first FET. The nonvolatile memory cell is selected by signals applied to the row select input and the column select input. The cell also includes a second FET connected between the cantilever beam and the cantilever input for controlling the passage of signals from the cantilever input to the cantilever beam and a third FET connected between the pull-in electrode and the pull-in electrode input for controlling the passage of signals from the pull-in electrode input to the electrode. The second FET and third FET have gates connected to the row select input. The row select input turns on the second FET and the third FET to allow the passage of signals from the pull-in electrode input to the pull-in electrode and from the cantilever input to the cantilever beam when the nonvolatile memory cell is selected.
摘要:
The disclosure relates generally to a metal-oxide-semiconductor field effect transistor (MOSFET) structures and methods of forming the same. The MOSFET structure includes at least one semiconductor body on a substrate; a dielectric cap on a top surface of the at least one semiconductor body, wherein a width of the at least one semiconductor body is less than a width of the dielectric cap; a gate dielectric layer conformally coating the at least one semiconductor body; and at least one electrically conductive gate on the gate dielectric layer.
摘要:
A method and structure for a computer model of a device has a performance parameter. The performance parameter includes a first bounded range and a second bounded range. The first bounded range has performance parameter variations within a single manufacturing process, and the second bounded range has performance parameter variations of different device designs.
摘要:
A method of manufacture and device for a dual-gate CMOS structure. The structure includes a first plate in an insulating layer and a second plate above the insulating layer electrically corresponding to the first plate. An isolation structure is between the first plate and the second plate.
摘要:
An eFuse begins with a single crystal silicon-on-insulator (SOI) structure that has a single crystal silicon layer on a first insulator layer. The single crystal silicon layer is patterned into a strip. Before or after the patterning, the single crystal silicon layer is doped with one or more impurities. At least an upper portion of the single crystal silicon layer is then silicided to form a silicided strip. In one embodiment the entire single crystal silicon strip is silicided to create a silicide strip. Second insulator(s) is/are formed on the silicide strip, so as to isolate the silicided strip from surrounding structures. Before or after forming the second insulators, the method forms electrical contacts through the second insulators to ends of the silicided strip. By utilizing a single crystal silicon strip, any form of semiconductor, such as a diode, conductor, insulator, transistor, etc. can form the underlying portion of the fuse structure. The overlying silicide material allows the fuse to act as a conductor in its unprogrammed state. However, contrary to metal or polysilicon based eFuses which only comprise an insulator in the programmed state, when the inventive eFuse is programmed (and the silicide is moved or broken) the underlying semiconductor structure operates as an active semiconductor device.
摘要:
A chip-in-slot interconnect for three-dimensional semiconductor chip stacks, and particularly having the ability of forming edge connections on semiconductor chips, wherein the semiconductor chips are mounted in one or more chip carriers which are capable of being equipped with embedded circuitry. Moreover, provision is made for unique methods for producing the edge connections on the semiconductor chips, for creating a semiconductor chip carrier, and for producing a novel semiconductor and combined chip carrier structure.
摘要:
A method of forming a transistor patterns a semiconductor fin on a substrate, such that the fin extends from the substrate. Then, the method forms a gate conductor over a central portion of the fin, leaving end portions of the fin exposed. Next, the end portions of the fin are doped with at least one impurity to leave the central portion of the fin as a semiconductor and form the end portions of the fin as conductors. The end portions of the fin are undercut to disconnect the end portions of the fin from the substrate, such that the fin is connected to the substrate along a central portion and is disconnected from the substrate along the end portions and that the end portions are free to move and the central portion is not free to move. A straining layer is formed on a first side of the fin and the straining layer imparts physical pressure on the fin such that the end portions are permanently moved away from a straight-line orientation with the central portion after the forming of the straining layer. Thus, the undercutting in combination with the forming of the straining layer curves the fin such that, when viewed from a top of the substrate, the fin is bowed and has a curved shape.
摘要:
System and method for compact model algorithms to accurately account for effects of layout-induced changes in nitride liner stress in semiconductor devices. The layout-sensitive compact model algorithms account for the impact of large layout variation on circuits by implementing algorithms for obtaining the correct stress response approximations and layout extraction algorithms for obtaining the correct geometric parameters that drive the stress response. In particular, these algorithms include specific information from search “buckets” that are directionally-oriented and include directionally-specific distance measurements for analyzing in detail the specific shape neighborhood of the semiconductor device. The algorithms are additionally adapted to enable the modeling and stress impact determination of a device having single stress liner film and dual-stress liners (two different liner films that abut at an interface).