公开(公告)号：US06800009B2

公开(公告)日：2004-10-05

申请号：US10231129

申请日：2002-08-30

申请人： Tetsuo Matsuba ,  Shinichiro Ishitsuka ,  Takenori Shibata ,  Takeshi Matsumura

发明人： Tetsuo Matsuba ,  Shinichiro Ishitsuka ,  Takenori Shibata ,  Takeshi Matsumura

IPC分类号： H01J900

CPC分类号： H01J9/34 ,  H01J5/54 ,  H01J5/62 ,  H01J61/327 ,  H01J61/34 ,  H01K1/46

摘要： To provide a bulb-form lamp including a few compartments, which can be easily fitted in a socket of a lighting equipment and reliably carry out electrical contact between a shell and the socket of the lighting equipment. The bulb-form lamp includes a shell surrounding one end of a casing, and the shell is molded integrally with one end of the casing to make contact with an outer surface of the casing leaving substantially no gap.

摘要翻译： 为了提供一种包括几个隔室的灯泡形灯，其可以容易地装配在照明设备的插座中并且可靠地执行壳体和照明设备的插座之间的电接触。 灯泡形灯包括围绕壳体的一端的壳体，壳体与壳体的一端一体地模制，以与壳体的外表面接触，基本上没有间隙。

公开(公告)号：US06717341B1

公开(公告)日：2004-04-06

申请号：US09651590

申请日：2000-08-30

申请人： Tetsuo Matsuba ,  Shinichiro Ishitsuka ,  Takenori Shibata ,  Takeshi Matsumura

发明人： Tetsuo Matsuba ,  Shinichiro Ishitsuka ,  Takenori Shibata ,  Takeshi Matsumura

IPC分类号： H01J548

CPC分类号： H01J5/62 ,  H01J5/54 ,  H01J61/327 ,  H01J61/56

摘要： A bulb-form lamp allows a lighting circuit and an eyelet to be easily and reliably connected together without using any soldering or plasma arc welding or lead wires, prevents a lighting failure caused by an inappropriate contact, and reduces costs while improving productive efficiency. A case having a lighting circuit accommodated inside includes a base formed at an end portion thereof and having an eyelet and a screw-like shell. The lighting circuit and the eyelet are connected together without any lead wire.

摘要翻译： 灯泡形灯可以使照明电路和孔眼轻松可靠地连接在一起，而无需使用任何焊接或等离子电弧焊接或引线，防止由于不恰当的接触引起的照明故障，并降低成本，同时提高生产效率。 具有容纳在内部的照明电路的壳体包括形成在其端部并具有孔眼和螺旋状壳体的基部。 照明电路和孔眼连接在一起，无需任何导线。

公开(公告)号：US06653770B1

公开(公告)日：2003-11-25

申请号：US09619654

申请日：2000-07-19

申请人： Tetsuo Matsuba ,  Takeshi Matsumura ,  Shinichiro Ishitsuka

发明人： Tetsuo Matsuba ,  Takeshi Matsumura ,  Shinichiro Ishitsuka

IPC分类号： H01J548

CPC分类号： H01J5/46 ,  H01J61/327 ,  H01J61/34 ,  H01J61/56

摘要： Without applying soldering or plasma arc welding, a lead wire is brought into connection with an eyelet easily and reliably so that lighting failure due to incomplete contact is prevented and cost saving is achieved. A base (7) has a screw form shell (8) and an eyelet (9). An end portion of the shell (8) is provided with the eyelet (9) via an insulator. A lead wire (11a) supplying power is brought into connection with a portion of the eyelet (9) at other than an outer surface of the eyelet.

摘要翻译： 在不使用焊接或等离子体电弧焊接的情况下，引线容易且可靠地与孔眼连接，从而防止由于不完全接触引起的照明故障，并且实现成本节约。 基座（7）具有螺钉形外壳（8）和孔眼（9）。 壳体（8）的端部通过绝缘体设置有孔眼（9）。 提供动力的引线（11a）与孔眼（9）的除了孔眼的外表面之外的一部分连接。

公开(公告)号：US06525455B1

公开(公告)日：2003-02-25

申请号：US09656764

申请日：2000-09-07

申请人： Tetsuo Matsuba ,  Shinichiro Ishitsuka ,  Takenori Shibata ,  Takeshi Matsumura

发明人： Tetsuo Matsuba ,  Shinichiro Ishitsuka ,  Takenori Shibata ,  Takeshi Matsumura

IPC分类号： H01J548

CPC分类号： H01J9/34 ,  H01J5/54 ,  H01J5/62 ,  H01J61/327 ,  H01J61/34 ,  H01K1/46

摘要： To provide a bulb-form lamp including a few compartments, which can be easily fitted in a socket of a lighting equipment and reliably carry out electrical contact between a shell and the socket of the lighting equipment. The bulb-form lamp includes a shell surrounding one end of a casing, and the shell is molded integrally with one end of the casing to make contact with an outer surface of the casing leaving substantially no gap.

公开(公告)号：US09177425B2

公开(公告)日：2015-11-03

申请号：US14005838

申请日：2012-03-19

申请人： Hideaki Suganuma ,  Takeshi Matsumura ,  Toshiro Hikita

发明人： Hideaki Suganuma ,  Takeshi Matsumura ,  Toshiro Hikita

IPC分类号： G07C5/00 ,  G06F15/00 ,  G05B23/02

CPC分类号： G07C5/00 ,  G05B23/0221 ,  G06F15/00

摘要： A vehicle data analysis apparatus analyzes vehicle data that indicates chronological change of a vehicle state. The vehicle data analysis apparatus is provided with a computing unit and a recognition unit. The computing unit is configured to make obvious data fluctuation accompanying the development, in the vehicle data, of mechanical or control-related fault in a vehicle control system. The recognition unit is configured to recognize the vehicle data to be considered during vehicle fault diagnosis on the basis of a result of computation by the computing unit.

摘要翻译： 车辆数据分析装置分析指示车辆状态的时间变化的车辆数据。 车辆数据分析装置具有计算单元和识别单元。 计算单元被配置为伴随车辆控制系统中的机械或控制相关故障的车辆数据的开发中的明显的数据波动。 识别单元被配置为基于计算单元的计算结果来识别在车辆故障诊断期间要考虑的车辆数据。

公开(公告)号：US09154487B2

公开(公告)日：2015-10-06

申请号：US13883233

申请日：2010-11-05

申请人： Shingo Murakami ,  Johan Hjelm ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

发明人： Shingo Murakami ,  Johan Hjelm ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

IPC分类号： H04L29/06

CPC分类号： H04L63/08 ,  H04L63/0281 ,  H04L63/062 ,  H04L63/0807 ,  H04W12/04

摘要： The present invention relates to auto-provisioning of authentication data for client devices. A registration server includes a gateway determination unit, which is configured to determine a gateway apparatus transferring a request signal from a device, and a processing unit. The processing unit is configured to transmit a first signal including a token and first access information of the gateway apparatus to the device if an identifier of the gateway apparatus is stored on the server, and to transmit a second signal indicating a positive response to the gateway apparatus when it obtains the token and the identifier based on a third signal received in response to the first signal. The gateway apparatus sends the secret value to the device when it receives the second signal.

摘要翻译： 本发明涉及自动提供客户端设备的认证数据。 注册服务器包括网关确定单元，其被配置为确定从设备传送请求信号的网关装置和处理单元。 处理单元被配置为如果网关装置的标识符存储在服务器上，则将包括令牌的第一信号和网关装置的第一访问信息发送到设备，并且向网关发送指示肯定响应的第二信号 当其基于响应于第一信号接收的第三信号获得令牌和标识符时的装置。 当接收到第二信号时，网关装置向设备发送秘密值。

公开(公告)号：US09153556B2

公开(公告)日：2015-10-06

申请号：US12759470

申请日：2010-04-13

申请人： Takeshi Matsumura ,  Sadahito Misumi ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

发明人： Takeshi Matsumura ,  Sadahito Misumi ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/98 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/3011 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.

摘要翻译： 用于制造半导体器件的粘合片是用于制造半导体器件的粘合片，当将半导体元件粘合到被粘物并且半导体元件被引线接合时使用，并且是可剥离的粘合片，其中180度剥离粘合强度 相对于硅晶片为5（N / 25mm宽）或更小。

公开(公告)号：US08845538B2

公开(公告)日：2014-09-30

申请号：US12989546

申请日：2009-04-14

申请人： Takeshi Matsumura

发明人： Takeshi Matsumura

IPC分类号： A61B8/00 ,  A61B5/00 ,  A61B8/08 ,  A61B8/13 ,  A61B8/06

CPC分类号： A61B8/485 ,  A61B5/6843 ,  A61B8/06 ,  A61B8/13 ,  A61B8/4281 ,  A61B8/488

摘要： The invention was made to simplify the operation relating to the detection of an absolute pressure applied to a test body by an ultrasonic probe and thereby to enhance usability. The fact that an elastic coupler has been attached to the ultrasonic wave transmitter/receiver surface and the fact that the elastic coupler is in an initial state with no pressure are detected (S2, S3), an initial thickness of the elastic coupler in the initial state is obtained (S6), the fact that the elastic coupler is in the pressurized state is detected based on the disappearance of a multiple echo which is included in an RF signal and caused due to the elastic coupler, the thickness of the elastic coupler in the pressurized state is obtained by detecting the boundary between the test body and the elastic coupler in the pressurized state, the thickness change is obtained based on the thickness in the pressurized state and the initial thickness (S7), and the absolute pressure applied to the test object is evaluated based on the thickness change and the pre-set elasticity property of the elastic coupler (S8).

摘要翻译： 本发明是为了简化与通过超声波探头对被检体施加的绝对压力的检测相关的操作，从而提高了可用性。 检测到弹性耦合器已经附着到超声波发射器/接收器表面以及弹性耦合器处于初始状态而没有压力的事实（S2，S3），初始的弹性耦合器的初始厚度 获得状态（S6），弹性耦合器处于加压状态的事实是基于包含在RF信号中并由弹性耦合器引起的多重回波的消失，弹性耦合器的厚度 通过在加压状态下检测试验体与弹性联轴器之间的边界来获得加压状态，基于加压状态下的厚度和初始厚度（S7）获得厚度变化，并且施加到 基于弹性联轴器的厚度变化和预设弹性特性来评价试验对象（S8）。

公开(公告)号：US08704382B2

公开(公告)日：2014-04-22

申请号：US12975893

申请日：2010-12-22

申请人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

发明人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/6836 ,  H01L21/561 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/3025 ,  Y10T428/28 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.

摘要翻译： 本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中 晶片粘合层的波长为532nm的光的透光率为40％以上，激光标记层的波长为532nm的光的透光率为40％以下。

公开(公告)号：US08692389B2

公开(公告)日：2014-04-08

申请号：US12976112

申请日：2010-12-22

申请人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

发明人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/562 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16221 ,  H01L2224/274 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/1476 ,  Y10T428/28 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.

摘要翻译： 本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中压敏粘合剂层之间的剥离力（温度：23℃，剥离角度：180°，拉伸速度：300mm / min） 切割带的粘合剂层和倒装芯片型半导体背面的膜的厚度为0.05N / 20mm至1.5N / 20mm。