公开(公告)号：US08497521B2

公开(公告)日：2013-07-30

申请号：US12875566

申请日：2010-09-03

申请人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

发明人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L33/48 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。

公开(公告)号：US08378347B2

公开(公告)日：2013-02-19

申请号：US13289587

申请日：2011-11-04

申请人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

发明人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L21/329 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L33/50

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

摘要翻译： 根据一个实施例，LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。 第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。 基部的下表面的一部分，基部的侧表面，延伸部的下表面和延伸部的侧表面被树脂覆盖。 基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。 基部的下表面的一部分包括第一引线框架的第一边缘和第二引线框架的第二边缘。 第一边缘和第二边缘彼此相对。

公开(公告)号：US08319320B2

公开(公告)日：2012-11-27

申请号：US12874406

申请日：2010-09-02

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

摘要翻译： 根据一个实施例，LED模块包括板，互连和LED封装。 互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。 此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和 边缘表面。 并且，树脂体的外观是LED封装的外观。

公开(公告)号：US20120080674A1

公开(公告)日：2012-04-05

申请号：US13289587

申请日：2011-11-04

申请人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

发明人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

IPC分类号： H01L33/62 ,  H01L33/50

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

摘要翻译： 根据一个实施例，LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。 第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。 基部的下表面的一部分，基部的侧表面，延伸部的下表面和延伸部的侧表面被树脂覆盖。 基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。 基部的下表面的一部分包括第一引线框的第一边缘和第二引线框的第二边缘。 第一边缘和第二边缘彼此相对。

公开(公告)号：US20120126256A1

公开(公告)日：2012-05-24

申请号：US13053522

申请日：2011-03-22

申请人： Tetsuro Komatsu ,  Naoya Ushiyama

发明人： Tetsuro Komatsu ,  Naoya Ushiyama

IPC分类号： H01L27/15 ,  H01L33/52

CPC分类号： H01L33/62 ,  B29C70/78 ,  B29C2791/006 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/4809 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/005 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes a first and a second lead frame separated from each other, an LED chip, a wire and a resin body. The LED chip is provided above the first and second lead frames, and has a pair of terminals provided on an upper surface of the LED chip. One of the terminals is connected to the first lead frame and one other terminal is connected to the second lead frame. The wire is drawn out from the one terminal horizontally to connect the one terminal to the first lead frame. The resin body covers the LED chip and the wire, an upper surface, a part of a lower surface and a part of an end surface of each of the first and second lead frames to expose a remaining part of the lower surface and a remaining part of the lower surface.

摘要翻译： 根据一个实施例，LED封装包括彼此分离的第一和第二引线框架，LED芯片，线和树脂体。 LED芯片设置在第一和第二引线框架的上方，并且具有设置在LED芯片的上表面上的一对端子。 一个端子连接到第一引线框架，另一个端子连接到第二引线框架。 电线从一个端子水平拉出，将一个端子连接到第一引线框架。 树脂体覆盖LED芯片和导线，上表面，下表面的一部分和每个第一引线框架和第二引线框架的端面的一部分，以暴露下表面的剩余部分和剩余部分 的下表面。

公开(公告)号：US20110193112A1

公开(公告)日：2011-08-11

申请号：US12874406

申请日：2010-09-02

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

IPC分类号： H01L33/62

CPC分类号： H01L24/97 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

摘要翻译： 根据一个实施例，LED模块包括板，互连和LED封装。 互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。 此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和 边缘表面。 并且，树脂体的外观是LED封装的外观。

公开(公告)号：US20110186901A1

公开(公告)日：2011-08-04

申请号：US12875566

申请日：2010-09-03

申请人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

发明人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。

公开(公告)号：US20110297980A1

公开(公告)日：2011-12-08

申请号：US12886709

申请日：2010-09-21

申请人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

发明人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

IPC分类号： H01L33/44 ,  H01L33/50

CPC分类号： H01L33/0066 ,  H01L27/15 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/44 ,  H01L33/48 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.

摘要翻译： 根据一个实施例，半导体发光器件包括发光芯片和荧光材料层。 发光芯片包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层。 半导体层包括形成在与第一主表面相对的一侧上的发光层，第一主表面和第二主表面。 荧光材料层设置在第一主表面上，并且具有比发光芯片更大的平面尺寸。

公开(公告)号：USD578082S1

公开(公告)日：2008-10-07

申请号：US29287884

申请日：2007-09-28

申请人： Shota Shimonishi ,  Mitsuhiro Nawashiro ,  Tetsuro Komatsu ,  Hiroaki Oshio

设计人： Shota Shimonishi ,  Mitsuhiro Nawashiro ,  Tetsuro Komatsu ,  Hiroaki Oshio

公开(公告)号：US20070145255A1

公开(公告)日：2007-06-28

申请号：US11613503

申请日：2006-12-20

申请人： Shouichi Nishikawa ,  Tetsuro Komatsu ,  Hatsuo Takezawa ,  Yukinori Aoki

发明人： Shouichi Nishikawa ,  Tetsuro Komatsu ,  Hatsuo Takezawa ,  Yukinori Aoki

IPC分类号： H01J5/02 ,  H01J40/14

CPC分类号： H01L33/58 ,  B29C45/14655 ,  B29C45/1671 ,  B29L2011/0016 ,  H01L33/54 ,  H01L2224/48247

摘要： A lens-equipped light-emitting diode device of the present invention includes a lead frame in which an electrode is formed, a light-emitting diode which is mounted on the electrode of the lead frame, an outer peripheral unit which is made of a first resin, which is provided on the lead frame, and in which a hollow portion is formed while an area including at least the light-emitting diode is exposed in the outer peripheral unit, a sealing portion which is made of a second resin filled in the lead frame of the hollow portion of the outer peripheral unit, and which seals the light-emitting diode, and a lens unit made of a third resin laminated and filled in the sealing portion.

摘要翻译： 本发明的带镜头的发光二极管装置包括：其中形成有电极的引线框架，安装在引线框架的电极上的发光二极管，外部单元，其由第一 树脂，其设置在引线框架上，并且其中形成中空部分，同时至少包括发光二极管的区域在外周单元中露出;密封部分，由填充在所述外部单元中的第二树脂制成; 外周单元的中空部分的引线框架，并且密封发光二极管，以及由层压并填充在密封部分中的由第三树脂制成的透镜单元。