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1.发明申请Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto 失效包含聚酰亚胺和疏水性环氧树脂的组合物及其相关方法公开(公告)号：US20070083017A1
公开(公告)日：2007-04-12
申请号：US11248803
申请日：2005-10-12
CPC分类号： H01L21/02118 , C08L63/00 , C08L79/08 , C08L2205/02 , G03F7/023 , G03F7/0387 , H01L21/02282 , H01L21/312 , H05K1/095 , H05K2201/0154 , Y10T428/31522 , C08L2666/20 , C08L2666/22
摘要： Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.
摘要翻译： 吸水性聚酰亚胺/环氧基组合物（如糊剂（或溶液））特别适用于制作电子可屏幕印刷的材料和电子元件。 发现一组疏水性环氧化物（和可溶性聚酰亚胺）特别耐吸湿性。 用这些环氧化物（和这些聚酰亚胺）制成的聚酰亚胺/环氧树脂浆料可以任选含有热交联剂，粘合促进剂，封闭异氰酸酯和其它无机填料。 本发明的聚酰亚胺/环氧树脂糊料的玻璃化转变温度可以高于250℃，吸水率小于2％，并且具有正的溶解度测量。
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2.发明申请Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto 失效用于柔性电路应用的聚酰亚胺基粘合剂组合物，以及与其有关的组合物和方法公开(公告)号：US20050143534A1
公开(公告)日：2005-06-30
申请号：US10892863
申请日：2004-07-16
申请人： Thomas Dueber , Michael West , Brian Auman , Robert Kasowski
发明人： Thomas Dueber , Michael West , Brian Auman , Robert Kasowski
IPC分类号： C08L79/08 , B32B27/08 , B32B27/18 , C08G65/336 , C08G77/455 , C08K5/00 , C08K5/34 , C08L63/00 , C08L71/02 , C08L83/04 , C08L83/10 , C08L83/14 , C09D183/10 , C09J7/00 , C09J11/00 , C09J179/08 , C09J183/10 , H01L21/60 , H05K1/00 , H05K1/03 , H05K3/28 , H05K3/38 , H05K3/46
CPC分类号： B32B27/08 , B32B7/02 , B32B7/12 , B32B27/18 , B32B27/281 , B32B2379/08 , C08G65/336 , C08G77/455 , C08K5/0066 , C08K5/34 , C08L63/00 , C08L71/02 , C08L83/10 , C09D183/10 , H05K1/0346 , H05K1/0373 , H05K1/0393 , H05K3/281 , H05K3/386 , H05K3/389 , H05K3/4626 , H05K3/4635 , H05K2201/012 , H05K2201/0154 , H05K2201/0162 , Y10T428/31663 , C08L83/14 , C08L2666/22 , C08L2666/14
摘要： The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.
摘要翻译： 本发明的低模量聚酰亚胺粘合剂组合物含有低模量聚酰亚胺硅氧烷聚合物，热固性基本上非卤化的环氧树脂（任选地包括环氧催化剂），增塑剂，不溶性无卤阻燃填料和任选的粘合 启动子。 粘合剂可以使用相对较低的层压温度（通常不高于200℃，190℃，180℃，175℃，170℃，165℃，160℃，155℃或150℃）施加在（或并入）柔性电路。粘合剂通常具有抗性 即使在粘合聚酰亚胺和基膜聚酰亚胺具有相差大于10,15,20,25或30ppm的线性热膨胀系数（在50℃和250℃之间测量）的情况下， /C。
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公开(公告)号：US20060110678A1
公开(公告)日：2006-05-25
申请号：US10997701
申请日：2004-11-23
IPC分类号： G03C1/76
CPC分类号： H05K3/287 , G03F7/037 , Y10S430/106 , Y10S430/117 , Y10S430/127
摘要： The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
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公开(公告)号：US20060110679A1
公开(公告)日：2006-05-25
申请号：US11271267
申请日：2005-11-10
IPC分类号： G03C1/76
CPC分类号： H05K3/287 , G03F7/037 , Y10S430/106 , Y10S430/117 , Y10S430/127
摘要： The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
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公开(公告)号：US20050154105A1
公开(公告)日：2005-07-14
申请号：US10754348
申请日：2004-01-09
申请人： John Summers , Thomas Dueber , Cheng-Chung Chen , Xin Fang , John Felten
发明人： John Summers , Thomas Dueber , Cheng-Chung Chen , Xin Fang , John Felten
IPC分类号： C08L101/12 , C08K3/08 , C08K3/22 , C08K5/3447 , C08L3/00 , C08L25/06 , C08L45/00 , C08L61/04 , C08L65/00 , C08L67/00 , C08L67/03 , C08L71/12 , C09D7/12 , C09D145/00 , C09D167/03 , C09D201/00 , C09J9/02 , H01C7/00 , H01C17/06 , H01C17/065 , H01G4/18 , H05K1/16 , H05K3/28 , C08K3/10 , C08K3/18
CPC分类号： H01C17/06586 , C08K3/08 , C08K3/12 , C08K3/22 , C08L25/06 , C08L61/04 , C08L65/00 , C08L67/00 , C08L67/03 , C08L71/12 , C09D167/03 , C09J9/02 , H05K1/167 , H05K3/285 , C08L2666/16 , C08L2666/06 , C08L2666/22
摘要： A composition comprising: a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less; one or more metals or metal compounds; and an organic solvent. The polymer can optionally include sites that can crosslink with one or more crosslinking agents. The compositions can be used to produce electronic components such as resistors, discrete or planar capacitors, conductive adhesives and electrical and thermal conductors. The invention is also directed to a composition comprising a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less, and an organic solvent. These compositions can also be used in a number of electronic applications such as an encapsulant and as an integrated circuit packaging material.
摘要翻译： 一种组合物，其包含：玻璃化转变温度高于250℃，吸水率为2％以下的聚合物; 一种或多种金属或金属化合物; 和有机溶剂。 聚合物可以任选地包括可以与一种或多种交联剂交联的位点。 组合物可用于生产电子部件，例如电阻器，分立或平面电容器，导电粘合剂和电导体和导热体。 本发明还涉及包含玻璃化转变温度高于250℃，吸水率为2％以下的聚合物和有机溶剂的组合物。 这些组合物也可用于许多电子应用中，例如密封剂和集成电路封装材料。
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公开(公告)号：US20070244267A1
公开(公告)日：2007-10-18
申请号：US11401150
申请日：2006-04-10
申请人： Thomas Dueber , John Summers , William Borland , Olga Renovales , Diptarka Majumdar , Daniel Amey
发明人： Thomas Dueber , John Summers , William Borland , Olga Renovales , Diptarka Majumdar , Daniel Amey
IPC分类号： C08L63/00
CPC分类号： H05K1/162 , C08G59/24 , C08G59/621 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763
摘要： Compositions comprising: an epoxy containing cyclic olefin resin with a water absorption of 2% or less; one or more phenolic resins with water absorption of less than 2% or less; an epoxy catalyst; optionally one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a cure temperature of 190° C. or less.
摘要翻译： 组合物，其包含：含有环氧树脂的环状烯烃树脂，其吸水率为2％以下; 一种或多种吸水率小于2％的酚醛树脂; 环氧催化剂; 任选地一种或多种电绝缘填料，消泡剂和着色剂以及一种或多种有机溶剂。 该组合物可用作密封剂并具有190℃或更低的固化温度。
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公开(公告)号：US20070083016A1
公开(公告)日：2007-04-12
申请号：US11414351
申请日：2006-05-01
申请人： Thomas Dueber , John Summers
发明人： Thomas Dueber , John Summers
CPC分类号： H01L21/02118 , C08L63/00 , C08L79/08 , C08L2205/02 , G03F7/023 , G03F7/0387 , H01L21/02282 , H01L21/312 , H05K1/095 , H05K2201/0154 , Y10T428/31522 , C08L2666/20 , C08L2666/22
摘要： A photosensitive resin composition comprising a pre-imidized aromatic polyimide, which when coated on a silicon wafer, has a light transmittance at a wavelength of 365 nm of at least 1% and imparts low residual stress after cure. The composition can be patterned through I-line exposure followed by development with organic or alkaline solutions, and can be cured at relatively mild temperature to yield low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.
摘要翻译： 一种包含预酰亚胺化的芳族聚酰亚胺的感光性树脂组合物，当涂覆在硅晶片上时，在365nm的波长下的透光率至少为1％，并且在固化后赋予较低的残留应力。 组合物可以通过I线曝光进行图案化，然后用有机或碱性溶液显影，并且可以在相对温和的温度下固化以产生低应力聚酰亚胺图案。 具有聚酰亚胺图案的电子元件具有高可靠性。
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8.发明申请公开(公告)号：US20070236859A1
公开(公告)日：2007-10-11
申请号：US11401149
申请日：2006-04-10
CPC分类号： H01G2/10 , C08G59/621 , H01G4/224 , H05K1/092 , H05K1/162 , H05K3/1291 , H05K3/429 , H05K3/4652 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , H05K2203/1126
摘要： An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.
摘要翻译： 应用于箔形陶瓷电容器和嵌入式印刷线路板的有机密封剂组合物允许电容器抵抗印刷线路板化学品，并在高湿度，高温和施加的直流偏压下进行1000小时的加速寿命测试。
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9.发明申请Polyimide compositions having resistance to water sorption, and methods relating thereto 失效具有耐水吸附性的聚酰亚胺组合物及其相关方法公开(公告)号：US20050154181A1
公开(公告)日：2005-07-14
申请号：US10782326
申请日：2004-02-19
申请人： Thomas Dueber , John Summers , Xin Fang
发明人： Thomas Dueber , John Summers , Xin Fang
IPC分类号： C08L79/08 , C08G69/08 , C08G73/10 , C08K5/00 , C08K5/04 , C08K5/07 , C08K5/101 , C08K5/151 , C08K5/1535 , C09D179/08 , C09J9/02 , C09J179/08 , H01C7/00 , H05K1/03
CPC分类号： C08G73/1032 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08K5/0008 , C08L79/08 , H05K1/0346
摘要： Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.
摘要翻译： 吸水性聚酰亚胺浆料（或溶液）对于制造电子丝网印刷浆料和由这些浆料制成的电子部件特别有用。 发现一组可溶性聚酰亚胺及其溶剂特别耐吸湿性。 这些聚酰亚胺溶液任选地含有也含有可交联单体和/或热交联剂的聚酰亚胺。 此外，这些聚酰亚胺浆料可任选地含有粘合促进剂，封闭的异氰酸酯，金属，金属氧化物和其它无机填料。 本发明的聚酰亚胺膏（或溶液）具有玻璃化转变温度大于250℃的聚酰亚胺，吸水系数小于2％，并且具有正的溶解度测量。
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公开(公告)号：US20060210819A1
公开(公告)日：2006-09-21
申请号：US11080608
申请日：2005-03-15
申请人： Thomas Dueber
发明人： Thomas Dueber
IPC分类号： B32B27/34
CPC分类号： H05K3/281 , C09J7/22 , C09J7/35 , C09J2479/08 , C09J2479/086 , H05K3/0023 , H05K3/386 , H05K2201/0154 , H05K2201/0195 , Y10S430/107 , Y10S430/117 , Y10S430/127 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.
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