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公开(公告)号：US06271107B1
公开(公告)日：2001-08-07
申请号：US09282788
申请日：1999-03-31
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L21/563 , H01L23/3171 , H01L24/11 , H01L24/16 , H01L24/29 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2224/05169 , H01L2224/05571 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/29111 , H01L2224/73203 , H01L2224/83102 , H01L2224/83191 , H01L2224/92125 , H01L2924/0001 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H05K3/0032 , H05K3/3484 , H01L2224/13099 , H01L2924/00012 , H01L2224/29099 , H01L2924/00014
摘要： Bumped semiconductor substrates and methods for forming bumped semiconductor substrates are disclosed. The bumped semiconductor substrates have a polymeric layer, which can serve as a passivation layer for chips derived from the semiconductor substrate.
摘要翻译： 公开了凸起的半导体衬底和用于形成凸起的半导体衬底的方法。 凸起的半导体衬底具有聚合物层，其可以用作来自半导体衬底的芯片的钝化层。
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公开(公告)号：US20050218514A1
公开(公告)日：2005-10-06
申请号：US11096542
申请日：2005-04-01
申请人： Thomas Massingill
发明人： Thomas Massingill
IPC分类号： H01L23/14 , H01L23/48 , H01L23/498
CPC分类号： H01L23/49822 , H01L23/142 , H01L23/49816 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73204 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor package is disclosed for an integrated circuit die (52). The integrated circuit die is electrically connected to the package substrate by either die solder balls (53a), or wirebonds (53b). The package substrate (50), a single sided printed wiring board, has a thick metal core (100), consisting of a base metal, a core capacitor, and one or more thin build up layers.
摘要翻译： 公开了一种用于集成电路管芯（52）的半导体封装。 集成电路管芯通过模焊球（53a）或引线键（53b）与封装衬底电连接。 封装基板（50）是单面印刷线路板，具有厚的金属芯（100），由金属基体，核心电容器和一个或多个薄层构成。
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3.发明授权Multilayer laminated substrates with high density interconnects and methods of making the same 失效具有高密度互连的多层叠层基板及其制造方法
公开(公告)号：US6163957A
公开(公告)日：2000-12-26
申请号：US192003
申请日：1998-11-13
IPC分类号： H01R12/04 , H01L21/48 , H01L23/538 , H05K1/14 , H05K3/00 , H05K3/12 , H05K3/28 , H05K3/36 , H05K3/40 , H05K3/46 , H01K3/10
CPC分类号： H05K3/4617 , H01L21/4857 , H01L23/5385 , H01L2924/0002 , H05K3/0035 , H05K3/1216 , H05K3/28 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0394 , H05K2203/0191 , H05K2203/1453 , Y10S428/901 , Y10T29/49126 , Y10T29/49165 , Y10T29/49167 , Y10T428/31678 , Y10T428/31681 , H01L2924/00
摘要： Multilayer circuit lamination methods and circuit layer structures are disclosed which enable one to manufacture high-density multichip module boards and the like at lower cost, with higher yield, with higher signal densities, and with fewer processing steps.
摘要翻译： 公开了多层电路层叠方法和电路层结构，其能够以更低的成本，更高的产量，更高的信号密度和更少的处理步骤来制造高密度多芯片模块板等。
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