公开(公告)号：US20050097727A1

公开(公告)日：2005-05-12

申请号：US10450844

申请日：2002-03-27

申请人： Tomoo Iijima ,  Yoshiro Kato ,  Hiroshi Odaira ,  Masayuki Ohsawa ,  Inetaro Kurosawa ,  Kazuo Sakuma ,  Toshihiko Asano ,  Kimitaka Endo

发明人： Tomoo Iijima ,  Yoshiro Kato ,  Hiroshi Odaira ,  Masayuki Ohsawa ,  Inetaro Kurosawa ,  Kazuo Sakuma ,  Toshihiko Asano ,  Kimitaka Endo

IPC分类号： B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01R3/00 ,  B23P19/00

CPC分类号： H05K3/4614 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0384 ,  H05K2203/061 ,  Y10T29/5313

摘要： A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.

摘要翻译： 多个多层金属板（1）各自由凸块形成金属层（2），蚀刻停止层（3）和布线膜形成金属层（4）构成，其中布线膜 由凸极形成金属层形成由布线膜形成金属层形成的凸块2a，并且在多层金属板的凸块形成表面上形成另一多层的布线膜 金属板重叠。 这样的层压方法被连续重复进行多层。 另外，包括用于保持金属板（1a）的金属板保持装置（13）的多层布线板（11a）的抛光机，用于将切割器（26）保持在其上方的切割器保持装置（25） 金属板，用于调节刀具保持装置的高度的高度调节机构（20）以及用于使刀具保持装置平行于金属板的表面相对移动的刀具平行移动机构（15）进行抛光。

公开(公告)号：US08736064B2

公开(公告)日：2014-05-27

申请号：US12941511

申请日：2010-11-08

申请人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

发明人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC分类号： H01L23/522

CPC分类号： H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

摘要翻译： 提供互连元件。 单片电介质元件具有第一暴露的主表面，从第一主表面向内延伸的多个第一凹槽和远离第一主表面的第二暴露的主表面，从第二主表面向内延伸的多个第二凹槽。 多个第一金属互连图案被嵌入在多个第一凹部中并沿着第一主表面沿一个或多个方向延伸。 多个第二金属互连图案被嵌入在多个第二凹部中并沿着第二主表面沿一个或多个方向延伸。 多个非中空金属柱在多个第一金属互连图案中的至少一些和多个第二金属互连图案中的至少一些之间延伸穿过介质元件。

公开(公告)号：US20080169568A1

公开(公告)日：2008-07-17

申请号：US11897200

申请日：2007-08-29

申请人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

发明人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC分类号： H01L21/768 ,  H01L23/538

CPC分类号： H05K3/4614 ,  H01L23/48 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00

摘要： A multilayer interconnect element is provided which includes at least one dielectric element in which metal interconnect patterns are exposed at an outer surface thereof, the metal interconnect patterns having outer surfaces which are co-planar with an exposed outer surface of the dielectric element. In addition, multilayer interconnect elements are provided in which second interconnect elements which do not have co-planar interconnect patterns are integrated therewith as intermediate elements, and the resulting multilayer interconnect element has co-planar interconnect patterns.

摘要翻译： 提供了一种多层互连元件，其包括至少一个电介质元件，其中金属互连图案在其外表面处露出，金属互连图案具有与介电元件的暴露的外表面共平面的外表面。 此外，提供了多层互连元件，其中不具有共面互连图案的第二互连元件作为中间元件与其集成，并且所得到的多层互连元件具有共面互连图案。

公开(公告)号：US20110057324A1

公开(公告)日：2011-03-10

申请号：US12941511

申请日：2010-11-08

申请人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

发明人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC分类号： H01L23/522

CPC分类号： H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

摘要翻译： 提供互连元件。 单片电介质元件具有第一暴露的主表面，从第一主表面向内延伸的多个第一凹槽和远离第一主表面的第二暴露的主表面，从第二主表面向内延伸的多个第二凹槽。 多个第一金属互连图案被嵌入在多个第一凹部中并沿着第一主表面沿一个或多个方向延伸。 多个第二金属互连图案被嵌入在多个第二凹部中并沿着第二主表面沿一个或多个方向延伸。 多个非中空金属柱在多个第一金属互连图案中的至少一些和多个第二金属互连图案中的至少一些之间延伸穿过介质元件。

公开(公告)号：US20080136041A1

公开(公告)日：2008-06-12

申请号：US11805300

申请日：2007-05-23

申请人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

发明人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An interconnect element is provided which includes a dielectric element having a major surface. Metal interconnect patterns are embedded in recesses which extend inwardly from the major surface, the outer surfaces of the interconnect patterns being substantially co-planar with the major surface and extending in one or more directions of the major surface. A projecting conductive film extends over the major surface in at least one direction parallel to a plane defined by the major surface such that it contacts the dielectric element along at least a portion of the major surface and conductively contacts an outer surface of at least one of the metal interconnect patterns.

摘要翻译： 提供一种互连元件，其包括具有主表面的电介质元件。 金属互连图案嵌入从主表面向内延伸的凹槽中，互连图案的外表面与主表面基本共面并且在主表面的一个或多个方向上延伸。 突出的导电膜在平行于由主表面限定的平面的至少一个方向上在主表面上延伸，使得其沿着主表面的至少一部分接触电介质元件，并且导电地接触至少一个的外表面 金属互连图案。

公开(公告)号：US20070221329A1

公开(公告)日：2007-09-27

申请号：US11585287

申请日：2006-10-23

申请人： Kazuo Sakuma ,  Inetaro Kurosawa ,  Kiyoshi Hyodo

发明人： Kazuo Sakuma ,  Inetaro Kurosawa ,  Kiyoshi Hyodo

IPC分类号： H01L21/306 ,  B44C1/22

CPC分类号： H05K3/0085 ,  H01L21/6708 ,  H01L21/67706 ,  H01L21/67721 ,  H01L21/6776 ,  H05K1/0393 ,  H05K3/068 ,  H05K2201/09018 ,  H05K2203/0746 ,  H05K2203/1572

摘要： An apparatus and method are provided for processing an item by distributing a liquid onto a surface of the item. The apparatus includes a conveyor which defines an undulating path which varies in vertical position relative to the direction of movement of the item conveyable along the path. Thus, the path has at least one apex at a location of the path higher than other locations in the direction of movement along the path. A sprayer is operable to spray the liquid onto the surface of the item at a location that is substantially aligned to the apex of the path.

摘要翻译： 提供了一种通过将液体分配到物品的表面上来处理物品的装置和方法。 该设备包括一个输送机，该输送机限定了一个波浪路径，该波纹路径相对于沿该路径可传送的物品的移动方向在垂直位置上变化。 因此，路径在路径的位置处具有比沿着路径的移动方向上的其他位置更高的位置处的至少一个顶点。 喷雾器可操作以在基本上与路径的顶点对准的位置处将液体喷射到物品的表面上。

公开(公告)号：US20080128288A1

公开(公告)日：2008-06-05

申请号：US11811066

申请日：2007-06-08

申请人： Yukio Hashimoto ,  Inetaro Kurosawa ,  Hideki Kotake

发明人： Yukio Hashimoto ,  Inetaro Kurosawa ,  Hideki Kotake

IPC分类号： C25D5/02

CPC分类号： H05K3/381 ,  H05K3/108 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4658 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/1152

摘要： Methods are provided for manufacturing a wiring circuit element or wiring board in which a set of rough wiring patterns are formed by selectively etching a metal layer of a patternable member which includes a carrier layer having a rough surface and a thin rough-surfaced etch stop layer between the carrier layer and the metal layer. The etch stop layer and wiring patterns are joined to an insulating layer such that the wiring patterns adhere to the insulating layer and the insulating layer acquires a rough surface. Thereafter, the carrier layer and the etch stop layer are removed, after which openings are formed in the insulating layer in contact with at least some of the wiring patterns. A layer of metal is electrolessly plated onto the rough major surface of the insulating layer, and then a conductive wiring pattern is selectively electroplated over the electrolessly plated layer to form plated openings that interconnect at least some of the wiring patterns.

摘要翻译： 提供了用于制造布线电路元件或布线板的方法，其中通过选择性地蚀刻包括具有粗糙表面的载体层和薄的粗糙表面蚀刻停止层的可图案构件的金属层来形成一组粗糙布线图案 在载体层和金属层之间。 蚀刻停止层和布线图案被接合到绝缘层，使得布线图案粘附到绝缘层，并且绝缘层获得粗糙的表面。 此后，去除载体层和蚀刻停止层，之后在与至少一些布线图案接触的绝缘层中形成开口。 将一层金属化学镀在绝缘层的粗糙主表面上，然后在无电镀层上选择性地电镀导电布线图案，以形成互连至少一些布线图案的电镀开口。