Method for fabricating a semiconductor device comprising a polycide
structure
    1.
    发明授权
    Method for fabricating a semiconductor device comprising a polycide structure 失效
    一种制造半导体器件的方法,该半导体器件包括多晶硅结构

    公开(公告)号:US5459101A

    公开(公告)日:1995-10-17

    申请号:US266218

    申请日:1994-06-27

    摘要: A semiconductor device comprising a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a polycide film including a polysilicon layer and a silicide layer formed on the insulating film. The polysilicon layer includes a p-type region having p-type impurities diffused therein and an n-type region having n-type impurities diffused therein. The p-type impurities are implanted into the silicide layer in order to have a substantially uniform concentration over the entire portion thereof, so that the p-type impurities in the p-type region of the polysilicon layer do not diffuse into the silicide film by a post heat treatment.

    摘要翻译: 一种半导体器件,包括半导体衬底,形成在半导体衬底上的绝缘膜和在绝缘膜上形成的包括多晶硅层和硅化物层的多晶硅膜。 多晶硅层包括在其中扩散有p型杂质的p型区域和在其中扩散n型杂质的n型区域。 将p型杂质注入到硅化物层中以在其整个部分上具有基本上均匀的浓度,使得多晶硅层的p型区域中的p型杂质不会通过以下方式扩散到硅化物膜中: 后热处理。

    Semiconductor device with a dual type polycide layer comprising a
uniformly p-type doped silicide
    3.
    发明授权
    Semiconductor device with a dual type polycide layer comprising a uniformly p-type doped silicide 失效
    具有双重型多晶硅化物层的半导体器件包括均匀的p型掺杂的硅化物

    公开(公告)号:US5355010A

    公开(公告)日:1994-10-11

    申请号:US900993

    申请日:1992-06-18

    摘要: A semiconductor device comprising a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a polycide film including a polysilicon layer and a silicide layer formed on the insulating film. The polysilicon layer includes a p-type region having p-type impurities diffused therein and an n-type region having n-type impurities diffused therein. The p-type impurities are implanted into the silicide layer in order to have a substantially uniform concentration over the entire potion thereof, so that the p-type impurities in the p-type region of the polysilicon layer do not diffuse into the silicide film by a poet heat treatment.

    摘要翻译: 一种半导体器件,包括半导体衬底,形成在半导体衬底上的绝缘膜和在绝缘膜上形成的包括多晶硅层和硅化物层的多晶硅膜。 多晶硅层包括在其中扩散有p型杂质的p型区域和在其中扩散n型杂质的n型区域。 将p型杂质注入到硅化物层中,以便在其整个部分具有基本上均匀的浓度,使得多晶硅层的p型区域中的p型杂质不会通过以下方式扩散到硅化物膜中: 诗人热处理。

    Semiconductor device and a method of fabricating the same
    4.
    发明授权
    Semiconductor device and a method of fabricating the same 失效
    半导体装置及其制造方法

    公开(公告)号:US5341014A

    公开(公告)日:1994-08-23

    申请号:US989347

    申请日:1992-12-11

    摘要: A semiconductor device of the present invention includes a semiconductor substrate, a p-type impurity diffused region formed in the semiconductor substrate, and a polycide interconnection electrically connected to the p-type impurity diffused region. In the semiconductor device, the polycide interconnection includes a first polysilicon film, a refractory metal silicide film formed on the first polysilicon film, and a second polysilicon film formed on the refractory metal silicide film.

    摘要翻译: 本发明的半导体器件包括半导体衬底,形成在半导体衬底中的p型杂质扩散区域和与p型杂质扩散区域电连接的多晶硅互连。 在半导体器件中,多晶硅互连包括形成在第一多晶硅膜上的第一多晶硅膜,难熔金属硅化物膜和形成在难熔金属硅化物膜上的第二多晶硅膜。

    Method of fabricating a high-density dynamic random-access memory
    5.
    发明授权
    Method of fabricating a high-density dynamic random-access memory 失效
    制造高密度动态随机存取存储器的方法

    公开(公告)号:US5856219A

    公开(公告)日:1999-01-05

    申请号:US912686

    申请日:1997-08-18

    CPC分类号: H01L27/1052 H01L27/10873

    摘要: The invention relates to a high-density DRAM fabrication technique for forming a source/drain contact between word lines in a self-alignment manner, with the offset length between a source region and a drain region of a peripheral transistor maintained at an adequate value. After gate electrodes (i.e. word lines) are formed, a first insulating layer, which is thin enough not to block up space defined between the word lines, is deposited. The source/drain contact is etched as deep as the first insulating layer is thick to form an extraction electrode made of polycrystalline silicon. A second insulating layer is deposited until a spacer thickness (i.e. the sum of the film thickness of the second insulating layer and the film thickness of the first insulating layer) for determining the offset length is obtained. The first and second insulating layers are etched back for a distance corresponding to the sum of the film thickness of the second insulating layer and the film thickness of the first insulating layer so that a spacer (i.e. the residue of the insulating layers) is left on the side walls of the gate electrode. An implantation of highlevel impurities is performed to form heavily doped source and drain regions of a peripheral transistor. In-cell self-align contact is made possible while maintaining the offset length of the heavily doped source and drain regions

    摘要翻译: 本发明涉及用于以自对准方式在字线之间形成源极/漏极接触的高密度DRAM制造技术,其中外围晶体管的源极区域和漏极区域之间的偏移长度保持在足够的值。 在形成栅电极(即字线)之后,沉积足够薄而不能阻挡字线之间限定的空间的第一绝缘层。 源极/漏极接触被蚀刻为第一绝缘层较厚的深度,以形成由多晶硅制成的引出电极。 沉积第二绝缘层,直到获得用于确定偏移长度的间隔物厚度(即第二绝缘层的膜厚度和第一绝缘层的膜厚度之和)。 第一绝缘层和第二绝缘层被回蚀一段对应于第二绝缘层的膜厚度与第一绝缘层的膜厚之和的距离,使得间隔物(即,绝缘层的残留物)留在 栅电极的侧壁。 执行高级杂质的注入以形成外围晶体管的重掺杂源极和漏极区域。 在保持重掺杂源极和漏极区域的偏移长度的同时使单元内自对准接触成为可能

    Method for manufacturing a semiconductor memory device
    6.
    发明授权
    Method for manufacturing a semiconductor memory device 失效
    半导体存储器件的制造方法

    公开(公告)号:US5242852A

    公开(公告)日:1993-09-07

    申请号:US944883

    申请日:1992-09-11

    摘要: In a method for manufacturing DRAMs in a stacked memory cell type, an edge portion of each bit line is bared upon etching a first insulating film, the bared edge portion is etched to from an opening and an inner peripheral surface of the opening is covered by a second insulating film. There is also disclosed a method wherein second and third insulating films and second conductive film are stacked on a first insulating film, a second conductive film is formed and the second conductive film and the first conductive film are partially etched whereby the unetched portions of the first conductive film serve as electrode planes of charge storage electrodes.

    摘要翻译: 在以堆叠式存储单元型制造DRAM的方法中,蚀刻第一绝缘膜时,每个位线的边缘部分被露出,裸露的边缘部分被从开口蚀刻并且开口的内周面被 第二绝缘膜。 还公开了一种方法,其中第二绝缘膜和第三绝缘膜和第二导电膜堆叠在第一绝缘膜上,形成第二导电膜,并且第二导电膜和第一导电膜被部分蚀刻,由此第一绝缘膜的未蚀刻部分 导电膜用作电荷存储电极的电极平面。

    DISPLAY PANEL AND PRODUCTION METHOD FOR SAME
    7.
    发明申请
    DISPLAY PANEL AND PRODUCTION METHOD FOR SAME 有权
    显示面板及其制作方法

    公开(公告)号:US20140151709A1

    公开(公告)日:2014-06-05

    申请号:US14236361

    申请日:2011-08-03

    IPC分类号: H01L27/32

    摘要: Provided is a display panel having a plurality of pixels arranged in a matrix of rows and columns. Each of the pixels is composed of a plurality of first sub-pixels emitting light of different colors. Each of the first sub-pixels is composed of a plurality of second sub-pixels emitting light of the same color. Each of the second sub-pixels includes: a first electrode; a second electrode above the first electrode; and a light-emitting layer between the first electrode and the second electrode.

    摘要翻译: 提供了具有排列成行和列的矩阵的多个像素的显示面板。 每个像素由发射不同颜色的光的多个第一子像素组成。 每个第一子像素由发射相同颜色的光的多个第二子像素构成。 每个第二子像素包括:第一电极; 在所述第一电极上方的第二电极; 以及在第一电极和第二电极之间的发光层。

    Method for measuring temperature, annealing method and method for fabricating semiconductor device
    9.
    发明授权
    Method for measuring temperature, annealing method and method for fabricating semiconductor device 有权
    测量温度的方法,退火方法和制造半导体器件的方法

    公开(公告)号:US07037733B2

    公开(公告)日:2006-05-02

    申请号:US10343762

    申请日:2002-07-01

    IPC分类号: H01L21/66 G01N25/00 G01J5/00

    CPC分类号: G01J5/0003

    摘要: When the emissivity ε on the reverse face of a substrate 10 is measured during annealing processing for the substrate 10, films made from a material that varies the emissivity ε, such as a first DPS film 15 used for forming a plug 15A, a second DPS film 17 used for forming a capacitor lower electrode 17A and a third DPS film 20 used for forming a capacitor upper electrode 20A, are formed on the top face of the substrate 10. On the other hand, no film made from a material that varies the emissivity ε, such as a DPS film, is formed on the reverse face of the substrate 10.

    摘要翻译: 当在衬底10的退火处理期间测量衬底10的反面上的发射率ε时,由用于形成插头15A的第一DPS膜15,例如用于形成插头15A的第一DPS膜15的材料制成的膜,第二 用于形成用于形成电容器上电极20A的电容器下电极17A和第三DPS膜20的DPS膜17形成在基板10的顶面上。另一方面,没有由材料制成的膜 在基板10的背面上形成改变发射率ε(例如DPS膜)。

    Broadcast receiving apparatus, and a tuner and a distributor for the same
    10.
    发明授权
    Broadcast receiving apparatus, and a tuner and a distributor for the same 失效
    广播接收装置,以及调谐器及其分配器

    公开(公告)号:US07990480B2

    公开(公告)日:2011-08-02

    申请号:US11604311

    申请日:2006-11-27

    IPC分类号: H04N5/50 H04N5/44

    摘要: Within a broadcast receiving apparatus, mounting therein two (2) pieces of tuner units, each being receivable at least three (3) kinds of broadcasting signals, and being receivable plural numbers of broadcasting signals, simultaneously, the tuner units, each capable to receive an analog terrestrial broadcasting signal, digital BS/CS broadcasting signals, and a digital terrestrial broadcasting signal, are mounted within a housing 11 of the broadcast receiving apparatus 10, wherein a main tuner 110 and a sub-tuner 120 are mounted on both surfaces of a substrate 100, directing upper and lower surfaces thereof into the same direction, and distributors 130 and 140 for distributing antenna inputs are attached between input terminals 111, 112, 121 and 122 of those tuner units, bridging over both surfaces of the substrate, and thereby providing a technology for mounting or packaging the tuner units, with achieving small-sizing and thin-sizing thereof.

    摘要翻译: 在广播接收装置内,安装有两(2)个调谐器单元,每个调谐器单元可接收至少三种(3)种广播信号,并且可接收多个广播信号,同时,每个能够接收的调谐器单元 模拟地面广播信号,数字BS / CS广播信号和数字地面广播信号安装在广播接收设备10的外壳11内,其中主调谐器110和子调谐器120安装在 将其上表面和下表面引导到相同方向的基板100,并且用于分配天线输入的分配器130和140附接在那些调谐器单元的输入端子111,112,121和122之间,桥接在基板的两个表面上,以及 从而提供了一种用于安装或包装调谐器单元的技术,其实现了小尺寸和薄型化。