公开(公告)号：US06351031B1

公开(公告)日：2002-02-26

申请号：US09533173

申请日：2000-03-22

申请人： Makoto Iijima ,  Masaru Nukiwa ,  Seiji Ueno ,  Muneharu Morioka

发明人： Makoto Iijima ,  Masaru Nukiwa ,  Seiji Ueno ,  Muneharu Morioka

IPC分类号： H01L2304

CPC分类号： H05K3/4635 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/0393 ,  H05K3/205 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/016 ,  H05K2203/063 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a multi-flexible substrate and semiconductor chips mounted thereon. The multi-flexible substrate is configured such that organic insulation substrate layers and filmy adhesive layers are alternatively stacked together and wiring layers formed therein are interconnected by means of vias. Each of the vias consisting of a via-hole which is formed penetrating both the organic insulation substrate layers and the filmy adhesive layers and a metal via member 26 which is provided in the via-hole and made of an identical material. A method of manufacturing the multi-flexible substrate for the semiconductor device is also disclosed.

摘要翻译： 半导体器件包括安装在其上的多柔性基板和半导体芯片。 多柔性基板被配置为使得有机绝缘基底层和膜状粘合剂层交替堆叠在一起，并且其中形成的布线层通过通孔相互连接。 每个通孔由穿透有机绝缘基底层和薄膜粘合剂层的通孔组成，以及设置在通孔中并由相同材料制成的金属通孔构件26。 还公开了制造用于半导体器件的多柔性基板的方法。

公开(公告)号：US06396155B1

公开(公告)日：2002-05-28

申请号：US09605086

申请日：2000-06-27

申请人： Masaru Nukiwa ,  Makoto Iijima ,  Seiji Ueno ,  Muneharu Morioka

发明人： Masaru Nukiwa ,  Makoto Iijima ,  Seiji Ueno ,  Muneharu Morioka

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a semiconductor element on which a plurality of bumps are formed and a substrate having a first surface on which a plurality of protruding electrodes are protrudingly formed in correspondence to an arrangement of the bumps, and a second surface on which balls serving as mounting terminals are formed. The semiconductor element is bonded in a face-down manner to the substrate with the protruding electrodes being embedded into the bumps. Alloy layers having materials identical to those of the bumps and the protruding electrodes are formed on interfaces of the bumps and the protruding electrodes.

摘要翻译： 一种半导体器件包括其上形成有多个凸块的半导体元件和具有第一表面的基板，其上突出形成有多个突起电极，所述第一表面对应于所述凸块的布置;以及第二表面，其中作为 形成安装端子。 半导体元件以面朝下的方式结合到基板，其中突出的电极被嵌入到凸块中。 在凸块和突出电极的界面上形成具有与凸块和突起电极相同材料的合金层。

公开(公告)号：US06693029B2

公开(公告)日：2004-02-17

申请号：US10028358

申请日：2001-12-28

申请人： Makoto Iijima ,  Masaru Nukiwa ,  Seiji Ueno ,  Muneharu Morioka

发明人： Makoto Iijima ,  Masaru Nukiwa ,  Seiji Ueno ,  Muneharu Morioka

IPC分类号： H01L214763

CPC分类号： H05K3/4635 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/0393 ,  H05K3/205 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/016 ,  H05K2203/063 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for manufacturing a substrate, including adhering an adhesive layer to an organic insulation substrate to form a first part; forming a via hole in the first part such that the via hole penetrates the first part; forming a conductive metal film so that the conductive metal film covers the via-hole on one side of the first part; using an electrolytic plating process, where the conductive metal Film is used as an electrode, to form a metal via member within the via hole and to form an inter-layer wire; and removing an entirety of the conductive metal film without removing the inter-layer formed by the electrolytic plating process; repeating steps (a)-(e) for a second part; and thereafter attaching the first part to the second part.

摘要翻译： 一种基板的制造方法，其特征在于，包括将有机绝缘基板粘接成粘接层，形成第1部分; 在第一部分中形成通孔，使得通孔穿透第一部分; 形成导电金属膜，使得导电金属膜覆盖第一部分一侧的通孔; 使用导电性金属膜作为电极的电解电镀工序，在通路孔内形成金属通孔部件，形成层间电线; 并且在不去除通过电解电镀工艺形成的层间的情况下去除整个导电金属膜; 对第二部分重复步骤（a） - （e）; 然后将第一部分附接到第二部分。

公开(公告)号：US06347037B2

公开(公告)日：2002-02-12

申请号：US09185716

申请日：1998-11-04

申请人： Makoto Iijima ,  Tetsushi Wakabayashi ,  Toshio Hamano ,  Masaharu Minamizawa ,  Masashi Takenaka ,  Taturou Yamashita ,  Masataka Mizukoshi ,  Masaru Nukiwa ,  Takao Akai

发明人： Makoto Iijima ,  Tetsushi Wakabayashi ,  Toshio Hamano ,  Masaharu Minamizawa ,  Masashi Takenaka ,  Taturou Yamashita ,  Masataka Mizukoshi ,  Masaru Nukiwa ,  Takao Akai

IPC分类号： H05H720

CPC分类号： H01L23/10 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

摘要翻译： 半导体器件包括通过面朝下接合连接到板的上表面的板和半导体芯片。 半导体器件还包括框架状构件，其利用第一粘合剂连接到板的上表面，并且具有用于容纳半导体芯片的开口以及覆盖半导体芯片的板状构件， 框状构件，并且用第二粘合剂连接到半导体芯片和框架状构件，其中框架构件具有足够的坚固性，以防止热膨胀引起的板和板状构件的变形， 形状成员。

公开(公告)号：US06573600B2

公开(公告)日：2003-06-03

申请号：US09817787

申请日：2001-03-27

申请人： Atsushi Kikuchi ,  Makoto Iijima ,  Yoshihiko Ikemoto ,  Muneharu Morioka ,  Yoshiyuki Kimura

发明人： Atsushi Kikuchi ,  Makoto Iijima ,  Yoshihiko Ikemoto ,  Muneharu Morioka ,  Yoshiyuki Kimura

IPC分类号： G01R1900

CPC分类号： H05K1/0245 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K2201/09336 ,  H05K2201/09345 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.

摘要翻译： 多层布线基板包括布置在第一电源平面和第一接地平面之间的第一绝缘层内的差动信号线; 以及放置在第二电源平面和第二接地平面之间的第二绝缘层内的一般信号线。 在多层布线基板中，差分信号线被放置在与具有每个通用信号线的平面不同的平面中，使得不同的平面包括具有差分信号线的第一区域，以及具有第二 电源平面和第二个接地层。 通常的信号线以叠层状态放置在第二区域的垂直方向上，使得每条通用信号线都位于第二电源平面和第二接地面之间。

公开(公告)号：US20070139892A1

公开(公告)日：2007-06-21

申请号：US11359996

申请日：2006-02-23

申请人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

发明人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  Y10T428/12389 ,  Y10T428/24926 ,  Y10T428/24942

摘要： A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

摘要翻译： 半导体器件包括：板，安装在板的主表面之一中的半导体元件，设置在半导体元件附近的多个无源元件;以及安装在板上方并连接到半导体元件的背面的散热板 该半导体元件经由导热材料。 表面与导热材料接触的散热板的表面的表面粗糙度在整个表面上是不均匀的。

公开(公告)号：US07813133B2

公开(公告)日：2010-10-12

申请号：US11359996

申请日：2006-02-23

申请人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

发明人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  Y10T428/12389 ,  Y10T428/24926 ,  Y10T428/24942

摘要： A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

摘要翻译： 半导体器件包括：板，安装在板的主表面之一中的半导体元件，设置在半导体元件附近的多个无源元件;以及安装在板上方并连接到半导体元件的背面的散热板 该半导体元件经由导热材料。 表面与导热材料接触的散热板的表面的表面粗糙度在整个表面上是不均匀的。

公开(公告)号：US08973245B2

公开(公告)日：2015-03-10

申请号：US13638690

申请日：2011-02-25

申请人： Takehiko Shoji ,  Keiko Itaya ,  Masashi Kondo ,  Makoto Iijima

发明人： Takehiko Shoji ,  Keiko Itaya ,  Masashi Kondo ,  Makoto Iijima

IPC分类号： B23P21/00 ,  G01T1/20

CPC分类号： G01T1/2018 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49798 ,  Y10T29/49826 ,  Y10T29/49904 ,  Y10T428/249974 ,  Y10T428/269

摘要： Disclosed is a method of manufacturing a flat panel detector such that the surface on the side of a fluorescent body layer of a scintillator panel which has the fluorescent body layer comprising a column crystal on the supporting body, is coupled to the planar light receiving element surface of a light-receiving element, comprising: a step of manufacturing the scintillator panel which has a larger area than that of the planar light receiving element surface; a step of trimming the edges of the scintillator panel, obtained by the step of manufacturing the scintillator panel, to correspond to the area of the planar light receiving element surface; and a step of coupling the edge-trimmed scintillator panel to the planar light receiving element surface, thus providing a flat panel detector which has an excellent productivity and that can be made small in size without non-image area.

摘要翻译： 公开了一种制造平板检测器的方法，使得在支撑体上具有包括柱晶体的荧光体层的闪烁体面板的荧光体层的表面被耦合到平面光接收元件表面 的光接收元件，包括：制造具有比所述平面光接收元件表面大的面积的闪烁体面板的步骤; 通过制造闪烁体面板的步骤获得的闪烁体面板的边缘的边缘对应于平面光接收元件表面的面积的步骤; 以及将边缘修整的闪烁体面板耦合到平面光接收元件表面的步骤，从而提供具有优异生产率并且可以在没有非图像区域的情况下小尺寸的平板检测器。

公开(公告)号：US08870266B2

公开(公告)日：2014-10-28

申请号：US13697648

申请日：2011-04-06

申请人： Yusuke Iinuma ,  Hideyuki Kawamata ,  Makoto Iijima

发明人： Yusuke Iinuma ,  Hideyuki Kawamata ,  Makoto Iijima

IPC分类号： B60S1/60 ,  B62D35/00

CPC分类号： B62D35/008 ,  B60Q1/0017 ,  B62D35/007

摘要： A vehicle rear outlet structure includes: an outer member constituting an outer surface of a rear vehicle body and defining a flow path space inside of the vehicle body; and a protrusion portion provided on an outer surface of the outer member to protrude in an outboard direction. The outer member is provided with an air outlet opening through which the flow path space and a space outside of the vehicle body communicate with each other. The protrusion portion is arranged forward of the air outlet opening in the vehicle longitudinal direction and continuously in a vertical direction of the vehicle, such that the flow of air flowing along the outer surface of the outer member sucks out air in the flow path space through the air outlet opening to an outboard side thereof.

摘要翻译： 车辆后出口结构包括：外部构件，构成后车身的外表面并限定车身内的流路空间; 以及设置在所述外部构件的外表面上以在外侧方向突出的突出部。 外部构件设置有空气出口开口，流路空间和车身外部的空间通过该出口开口彼此连通。 突出部在车辆前后方向上配置在车辆前后方向上并沿着车辆的上下方向连续地配置，使得沿着外部构件的外表面流动的空气流吸入流路空间内的空气 出风口通向其外侧。

公开(公告)号：US08449627B2

公开(公告)日：2013-05-28

申请号：US13572140

申请日：2012-08-10

申请人： Makoto Iijima ,  Naohiro Ando ,  Takashi Matsuo ,  Yuko Nobuto

发明人： Makoto Iijima ,  Naohiro Ando ,  Takashi Matsuo ,  Yuko Nobuto

IPC分类号： A61Q5/10

CPC分类号： A61Q5/10 ,  A61K8/046 ,  A61K8/44 ,  A61K8/8158 ,  A61K2800/87 ,  A61K2800/88

摘要： A two-part hair dye composed of a first part containing an alkali agent, a second part containing hydrogen peroxide, and a non-aerosol foamer container for discharging a liquid mixture of the first part and the second part in the form of a foam, the liquid mixture containing the following components (A) and (B): (A) a polymer or copolymer containing 70% or more mole fraction of diallyldimethyl quaternary ammonium salt monomer, and (B) an N-acylamino acid salt, an N-acyl-N-alkylamino acid salt, or an ether carboxylic acid salt, wherein, an equivalent ratio of the anion site of the component (B) to the cation site of the component (A) (anion/cation) is more than 1.

摘要翻译： 由含有碱剂的第一部分，含有过氧化氢的第二部分和用于排出泡沫形式的第一部分和第二部分的液体混合物的非气溶胶发泡剂容器组成的两部分染发剂， 含有以下组分（A）和（B）的液体混合物：（A）含有70％或更多摩尔分数二烯丙基二甲基季铵盐单体的聚合物或共聚物，和（B）N-酰基氨基酸盐， 酰基-N-烷基氨基酸盐或醚羧酸盐，其中组分（B）的阴离子位点与组分（A）的阳离子位点（阴离子/阳离子）的当量比大于1。