公开(公告)号：US07989949B2

公开(公告)日：2011-08-02

申请号：US12499182

申请日：2009-07-08

申请人： Vikas Gupta ,  Siva P Gurrum ,  Gregory E Howard

发明人： Vikas Gupta ,  Siva P Gurrum ,  Gregory E Howard

IPC分类号： H01L23/34

CPC分类号： H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01004 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00012

摘要： A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.

摘要翻译： 一种具有塑料封装化合物（102）和两个表面上的金属片（103a和104）的半导体器件（100A），用作散热器。 一个或多个优选均匀高度的热导体（103a）连接一片（103b）和芯片表面（101a）; 导体的数量可随芯片尺寸而变化。 每个导体由细长的线环（优选为铜）组成，线末端连接到衬垫（105），优选两端连接至相同的衬垫。 主环直径大致垂直于第一表面，并且环形顶点与片材（103b）接触。 衬底（104，优选地是第二金属片）覆盖第二封装表面的至少一部分并且导热连接到芯片。

公开(公告)号：US07572679B2

公开(公告)日：2009-08-11

申请号：US11828853

申请日：2007-07-26

申请人： Vikas Gupta ,  Siva P. Gurrum ,  Gregory E. Howard

发明人： Vikas Gupta ,  Siva P. Gurrum ,  Gregory E. Howard

IPC分类号： H01L21/00

CPC分类号： H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01004 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00012

摘要： A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.

摘要翻译： 一种具有塑料封装化合物（102）和两个表面上的金属片（103a和104）的半导体器件（100A），用作散热器。 一个或多个优选均匀高度的热导体（103a）连接一片（103b）和芯片表面（101a）; 导体的数量可随芯片尺寸而变化。 每个导体由细长的线环（优选为铜）组成，线末端连接到衬垫（105），优选两端连接至相同的衬垫。 主环直径大致垂直于第一表面，并且环形顶点与片材（103b）接触。 衬底（104，优选地是第二金属片）覆盖第二封装表面的至少一部分并且导热连接到芯片。

公开(公告)号：US08129224B2

公开(公告)日：2012-03-06

申请号：US12906240

申请日：2010-10-18

申请人： Siva P Gurrum ,  Kapil H Sahasrabudhe ,  Vikas Gupta

发明人： Siva P Gurrum ,  Kapil H Sahasrabudhe ,  Vikas Gupta

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/367 ,  H01L23/3171 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.

摘要翻译： 公开了一种用于倒装芯片半导体器件的热管理配置。 该器件包括具有金属接合表面的高功率硅基管芯。 在金属表面上形成多个互连件并连接到基板。 在金属接合表面上形成多个热管理突起，热管理突起凸起与互连不同，并且局部到管芯热点，热管理突起隆起与衬底间隔开的暴露端。

公开(公告)号：US20090026605A1

公开(公告)日：2009-01-29

申请号：US11828853

申请日：2007-07-26

申请人： Vikas Gupta ,  Siva P. Gurrum ,  Gregory Eric Howard

发明人： Vikas Gupta ,  Siva P. Gurrum ,  Gregory Eric Howard

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01004 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00012

摘要： A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.

摘要翻译： 一种具有塑料封装化合物（102）和两个表面上的金属片（103a和104）的半导体器件（100A），用作散热器。 一个或多个优选均匀高度的热导体（103a）连接一片（103b）和芯片表面（101a）; 导体的数量可随芯片尺寸而变化。 每个导体由细长的线环（优选为铜）组成，线末端连接到衬垫（105），优选两端连接至相同的衬垫。 主环直径大致垂直于第一表面，并且环形顶点与片材（103b）接触。 衬底（104，优选地是第二金属片）覆盖第二封装表面的至少一部分并且导热连接到芯片。

公开(公告)号：US20100301470A1

公开(公告)日：2010-12-02

申请号：US12543763

申请日：2009-08-19

申请人： Siva P. Gurrum ,  Kapil Heramb Sahasrabudhe ,  Vikas Gupta

发明人： Siva P. Gurrum ,  Kapil Heramb Sahasrabudhe ,  Vikas Gupta

IPC分类号： H01L23/367 ,  H01L21/58

CPC分类号： H01L23/367 ,  H01L23/3171 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.

摘要翻译： 公开了一种用于倒装芯片半导体器件的热管理配置。 该器件包括具有金属接合表面的高功率硅基管芯。 在金属表面上形成多个互连件并连接到基板。 在金属接合表面上形成多个热管理突起，热管理突起凸起与互连不同，并且局部到管芯热点，热管理突起凸起与基板间隔开的暴露端。

公开(公告)号：US20080023805A1

公开(公告)日：2008-01-31

申请号：US11460101

申请日：2006-07-26

申请人： Gregory E. Howard ,  Vikas Gupta ,  Darvin R. Edwards

发明人： Gregory E. Howard ,  Vikas Gupta ,  Darvin R. Edwards

IPC分类号： H01L23/495

CPC分类号： H01L23/3121 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85951 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.

摘要翻译： 本发明的一个实施例是封装装置的阵列（1401,1402等）的半导体系统（1400）。 每个阵列包括由与导电水平线和垂直通孔成一体的绝缘材料制成的片状衬底（1411,1412等）和表面上的端子。 可以包括多于一个有源或无源芯片或不同尺寸的芯片的半导体部件附接到基板; 电连接可以包括倒装芯片，引线键合或组合技术。 附着在基板上的封装化合物（1412,1422等）嵌入所连接的部件。 金属柱（1431,1432等）垂直穿过封装化合物，将衬底通孔与封装表面上的焊盘连接。 焊盘被用于连接到下一级器件阵列的焊料体覆盖，从而形成封装器件的3维系统。

公开(公告)号：US07892889B2

公开(公告)日：2011-02-22

申请号：US12491667

申请日：2009-06-25

申请人： Gregory E Howard ,  Vikas Gupta ,  Darvin R Edwards

发明人： Gregory E Howard ,  Vikas Gupta ,  Darvin R Edwards

IPC分类号： H01L21/00

CPC分类号： H01L23/3121 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85951 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.

摘要翻译： 本发明的一个实施例是封装装置的阵列（1401,1402等）的半导体系统（1400）。 每个阵列包括由与导电水平线和垂直通孔成一体的绝缘材料制成的片状衬底（1411,1412等）和表面上的端子。 可以包括多于一个有源或无源芯片或不同尺寸的芯片的半导体部件附接到基板; 电连接可以包括倒装芯片，引线键合或组合技术。 附着在基板上的封装化合物（1412,1422等）嵌入所连接的部件。 金属柱（1431,1432等）垂直穿过封装化合物，将衬底通孔与封装表面上的焊盘连接。 焊盘被用于连接到下一级器件阵列的焊料体覆盖，从而形成封装器件的3维系统。

公开(公告)号：US09682286B2

公开(公告)日：2017-06-20

申请号：US15213970

申请日：2016-07-19

申请人： Hideomi Shishido ,  Vikas Gupta ,  Vinod Mahajan

发明人： Hideomi Shishido ,  Vikas Gupta ,  Vinod Mahajan

IPC分类号： A63B41/08 ,  A63B45/00 ,  B29C65/48 ,  B29C65/72 ,  B29C65/62 ,  B29C65/00 ,  B29L31/54

CPC分类号： A63B41/08 ,  A63B45/00 ,  B29C65/4835 ,  B29C65/62 ,  B29C65/72 ,  B29C66/7484 ,  B29L2031/545

摘要： The ball for ball games has a ball body and a spherical shell-shaped outer layer having a plurality of leather panels and disposed on the outside of the ball body. The plurality of leather panels each have a main body and an extending portion that is thinner than the main body and extends from a front-side portion of an outer end surface of the main body to configure an outer end surface of the leather panel. The extending portions of adjacent leather panels are bonded to each other with an adhesive and stitched together with a stitching thread. In the ball for ball games, the extending portion is provided with a reinforcing member for reinforcing an area thereof stitched with the stitching thread.

公开(公告)号：US09146798B2

公开(公告)日：2015-09-29

申请号：US13801849

申请日：2013-03-13

申请人： Vikas Gupta ,  Aby Jose

发明人： Vikas Gupta ,  Aby Jose

IPC分类号： G06F11/00 ,  G06F11/07 ,  G06F11/30

CPC分类号： G06F11/0748 ,  G06F11/0709 ,  G06F11/0763 ,  G06F11/3006 ,  G06F11/3051

摘要： In an example embodiment, a method of performing a health check on a process integration (PI) component is provided. A PI health check scenario is loaded into the PI component, the PI health check scenario including a reference to a list of checks. The PI health check scenario is then executed using the PI component, causing one or more checks in the list of checks to be performed at a predetermined frequency. The system can then automatically determine if one or more of the one or more checks fail.

摘要翻译： 在示例实施例中，提供了对过程集成（PI）组件执行健康检查的方法。 PI健康检查场景将加载到PI组件中，PI运行状况检查场景包括对检查列表的引用。 然后使用PI组件执行PI健康检查场景，使得以预定频率执行检查列表中的一个或多个检查。 然后，系统可以自动确定一个或多个检查中的一个或多个检查是否失败。

公开(公告)号：US09055050B2

公开(公告)日：2015-06-09

申请号：US13534977

申请日：2012-06-27

申请人： Vikas Gupta

发明人： Vikas Gupta

IPC分类号： H04L29/06 ,  G06F21/34 ,  G06F21/62 ,  H04L29/08

CPC分类号： H04L63/08 ,  G06F21/34 ,  G06F21/629 ,  G06F2221/2115 ,  G06F2221/2141 ,  G06F2221/2153 ,  H04L63/06 ,  H04L63/0853 ,  H04L63/0876 ,  H04L63/10 ,  H04L63/107 ,  H04L67/02

摘要： In one embodiment, a first computing device receives an access token from a second computing device, the access token being generated by the second computing device for a specific software application executing on a specific computing device; stores the access token; receives a request for the access token from a software application executing on a third computing device; verifies whether the software application is the same as the specific software application and the third computing device is the same as the specific computing device for which the access token is generated; and sends the access token to the third computing device only when the software application is the same as the specific software application and the third computing device is the same as the specific computing device for which the access token is generated.

摘要翻译： 在一个实施例中，第一计算设备从第二计算设备接收访问令牌，由第二计算设备为特定计算设备上执行的特定软件应用程序生成访问令牌; 存储访问令牌; 从在第三计算设备上执行的软件应用接收对所述访问令牌的请求; 验证软件应用程序是否与特定软件应用程序相同，并且第三计算设备与生成访问令牌的特定计算设备相同; 并且仅当软件应用与特定软件应用相同并且第三计算设备与生成访问令牌的特定计算设备相同时才将访问令牌发送到第三计算设备。