Abstract:
A high density MIS array on a single substrate wherein at least two series coupled transistors are provided comprising two diffused junctions separated laterally in one surface of the substrate with a pair of spaced apart gate electrodes located intermediate thereof and separated therefrom by a first layer of insulated material. Another or top electrode separated from the pair of gate electrodes by a second layer of insulated material extends above and across to at least the closest edge of the two diffused junctions. A bias potential is applied between the substrate and the top electrode whereby field induced regions and respective P-N junctions are generated in the surface of the substrate between the diffused junctions in the region not subtended by the two gate electrodes. Two MIS transistors result having a common field induced junction therebetween, said common field induced junction acting as the drain for one transistor and the source for the other transistor.
Abstract:
A random access nondestructive voltage readout complementary MOSFET memory fabricated on a single integrated circuit ''''chip, '''' including not only a plurality of identical memory cells arranged in a matrix array, but also the digital address decoding logic circuitry as well as the input/output buffer circuitry including data line driver circuits insulating the memory cell array from external data lines and input/output control logic circuits insulating the address decoding logic circuitry and the data line driver circuits from external read/write control and strobe input sources. Both N-channel and P-channel MOSFETS are fabricated adjacent to one another as complementary pairs on the same ''''chip'''' with the exclusion of at least one guard ring diffusion region between adjacent drain diffusion regions of the complementary pairs by the inclusion of a relatively thick oxide layer (15-20 KA.) which operates to minimize internal interconnection line capacitance and parasitic surface channels. The data line drivers are bidirectional to provide nondestructive readout, fast readout response, noisy immunity and low-input capacitance. Each memory cell is comprised of two pairs of complementary MOSFETS coupled together as cross-coupled inverter circuits. Additionally, each cell is provided with a pair of parallely connected complementary MOSFETS acting as an input/output transmission switch and are coupled to a common input/output internal data line and operated by separate address command signals from the address decoding logic circuit. Another pair of parallely connected complementary MOSFETS are coupled to the memory cell as a feedback transmission switch and are operated by still other separate address command signals from the address decoding logic circuit. The address command logic utilized to operate the parallely connected pairs comprising the input/output transmission switch and the feedback transmission switch is timed to permit nondestructive readout of the memory cell.
Abstract:
An encapsulated microcircuit device including a wafer of semiconductor material, an intermediate coating of silicon dioxide on the wafer, a metal interconnect pattern on the silicon dioxide coating and having portions extending therethrough to the wafer, an outer coating on the intermediate coating and on the metal interconnect pattern and being composed of glass and a metal oxide and having a coefficient of thermal expansion substantially equal to that of the interconnect pattern and the silicon dioxide coating.
Abstract:
An MNOS radiation charge transfer memory device wherein charge generated in a semiconductor body by radiation is transferred through a surface inversion layer and an oxide layer to a silicon-nitride-oxide interface for storage. The readout voltage is proportional to the charge density stored. Therefore, it is possible to realize a gain proportional to the ratio of the junction sensor area to the nitride-oxide memory gate area. The device may be applied to optically accessed digital or analog memories.
Abstract:
A non-volatile memory employing variable threshold voltage field effect transistors as main memory storage elements is utilized in a fuse system for detonating explosive projectiles. Each transistor is selectively set to first and second stable threshold voltages by applying positive or negative polarizing voltages between the gate and the source of the transistor. The threshold voltage state of the transistor is determined by applying a read voltage having a magnitude greater than the first stable threshold voltage and less than the second stable threshold voltage. The transistor is activated only if it has assumed the first threshold voltage. A buffer shift register is provided for receiving a serial data input and producing a corresponding parallel output of positive and negative polarizing voltages. The information in the buffer shift register is transferred to the main memory by a plurality of write transmission gates and is transferred from the main memory to the shift register by a plurality of read transmission gates. A fire command generated by the firing of a projectile, such as an artillery shell, transfers the information in the main memory to a counter. The counter is then operated until overflow occurs and a signal is generated by the counter to detonate the explosive projectile.
Abstract:
Integrated circuit wafers are provided with links of such nature as to render the wafers electrically programmable without reliance upon joule-heating melting to destroy the links in the desired locations. The joule-heating melting previously used with electrically programmable wafers causes undesired effects such as volatilization, unwanted diffusions, etc. With use of photoengraving and etching techniques, there can be produced upon a wafer, according to this invention, links of novel kind that respond, through a defect-aided electromigration effect, to current densities below those required with the hitherto-known links fusible by joule heating. The novel links are of metal, typically about 0.4 mil wide and 50-1500 Angstroms thick, being used to join permanent connection members on the integrated circuit wafer, with the permanent connection members being on the order of 5000 Angstroms thick.
Abstract:
A metal insulated semiconductor (MIS) field effect transistor is operated in a gate-to-source mode. The voltage threshold of conduction of the transistor is variable and is switched between two different stable threshold conditions in response to application of corresponding, different predetermined values of polarizing voltages applied between the gate and source terminals. Determination of the threshold condition to which the transistor is switched is effected by applying a read voltage to the gate of the transistor intermediate the voltage threshold levels and sensing the current flow between the source and drain. Since the sense voltage is less than the polarizing voltage for either condition of switching, the preset threshold condition is maintained. The transistor therefore exhibits a non-volatile memory capability. A plurality of the transistors are employed in a memory array and may be readily fabricated in integrated circuit form.
Abstract:
A combinatorial circuit utilizing transmission switch logic wherein the entire arithmetic function including the generation of a sum and output carry signal occurs simultaneously in a twolevel logic configuration of interconnected switches which are preferably metal oxide semiconductor field effect transistors. The two-level logic configuration permits shorter propagation time thereby enabling a high speed of operation. Additionally, the propagation of the output carry signal is increased by controlling the gating of the carry signal independently of the carry input. MOSFETS are preferably utilized because little or no quiescent current flow occurs therein realizing minimum power dissipation.