公开(公告)号：US5075370A

公开(公告)日：1991-12-24

申请号：US395849

申请日：1989-08-18

Applicant: Werner Kubitza ,  Hermann Gruber ,  Joachim Probst

Inventor： Werner Kubitza ,  Hermann Gruber ,  Joachim Probst

IPC: C09D175/04 ,  C08G18/00 ,  C08G18/08 ,  C08G18/62 ,  C08G18/70 ,  C09D175/00

CPC classification number: C08G18/706 ,  C08G18/0819 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/6287

Abstract: The present invention is directed to a two-component coating composition which contains as binder componentsa) a polyol component containing at least one hydroxyl-containing polymer having chemically incorporated carboxylate and/or sulfonate groups and based on olefinically unsaturated compounds andb) a polyisocyanate component having a viscosity at 23.degree. C. of about 50 to 10,000 mPa.s and based on at least one organic polyisocyanatein quantities corresponding to an NCO/OH equivalent ratio of about 0.5:1 to 5:1, characterized in that component a) is an aqueous solution and/or dispersion of a polymer containing hydroxyl groups in which the polyisocyanate component b) is present in emulsified form.The present invention also relates to a process for the production of this coating composition which is characterized in that a polyisocyanate component having a viscosity at 23.degree. C. of about 50 to 10,000 mPa.s and based on at least one organic polyisocyanate is emulsified in an aqueous solution or dispersion of one or more polymer resins containing hydroxyl groups and chemically incorporated sulfonate and/or carboxylate groups in a quantity which makes them soluble and/or dispersible in water, the quantitative ratios between the two components corresponding to an NCO/OH equivalent ratio, based on the isocyanate groups of the polyisocyanate component and the incorporated hydroxyl groups of the polymer component, of about 0.5:1 to 5:1.

Abstract translation: 本发明涉及一种双组分涂料组合物，其包含作为粘合剂组分的a）含有至少一种具有化学结合的羧酸盐和/或磺酸盐基团并基于烯属不饱和化合物的含羟基聚合物的多元醇组分和b）多异氰酸酯 组分，其在23℃下的粘度为约50至10,000mPa.s，并且基于至少一种有机多异氰酸酯，其数量对应于约0.5:1至5:1的NCO / OH当量比，其特征在于组分a ）是含有羟基的聚合物的水溶液和/或分散体，其中多异氰酸酯组分b）以乳化形式存在。 本发明还涉及一种制备该涂料组合物的方法，其特征在于在23℃下的粘度为约50至10,000mPa.s并基于至少一种有机多异氰酸酯的多异氰酸酯组分在 含有羟基的一种或多种聚合物树脂的水溶液或分散体，并且化学掺入的磺酸盐和/或羧酸盐基团的数量使得它们可溶和/或分散在水中，两种组分之间的数量比对应于NCO / OH 基于多异氰酸酯组分的异氰酸酯基团和聚合物组分的引入羟基的当量比为约0.5:1至5:1。

公开(公告)号：US09079449B2

公开(公告)日：2015-07-14

申请号：US13389639

申请日：2010-08-09

Applicant: Hermann Gruber

Inventor： Hermann Gruber

IPC: B65D21/032 ,  B42F7/14

CPC classification number: B42F7/14

Abstract: A device for storing collectibles, including a base unit having a first receiving region that receives a first object and a second receiving region that receives a collectibles storage unit. The base unit has a connecting wall connecting the first and second side walls, and two receiving elements for mounting the storage unit. The first receiving region is delimited by the first side wall, the second side wall and the connecting wall. The second receiving region, open on at least one side and separated from the first receiving region by the connecting wall, is delimited by the first receiving element, the second receiving element and the connecting wall. The storage unit includes at least two segments connectable to and separable from each other, wherein each segment has a receiving region for receiving at least one collectible and wherein at least a partial region of each segment is transparent.

Abstract translation: 一种用于存储收藏品的装置，包括具有接收第一物体的第一接收区域的基本单元和接收收藏品存储单元的第二接收区域。 基座单元具有连接第一和第二侧壁的连接壁和用于安装存储单元的两个接收元件。 第一接收区域由第一侧壁，第二侧壁和连接壁限定。 在第一接收元件，第二接收元件和连接壁上限定第二接收区域，该第二接收区域在至少一个侧面上被连接壁与第一接收区域分开。 存储单元包括至少两个可彼此连接并可彼此分离的段，其中每个段具有用于接收至少一个可收集物的接收区域，并且其中每个段的至少一部分区域是透明的。

公开(公告)号：US08866274B2

公开(公告)日：2014-10-21

申请号：US13431251

申请日：2012-03-27

Applicant: Hermann Gruber ,  Joachim Mahler ,  Uwe Hoeckele ,  Anton Prueckl ,  Thomas Fischer ,  Matthias Schmidt

Inventor： Hermann Gruber ,  Joachim Mahler ,  Uwe Hoeckele ,  Anton Prueckl ,  Thomas Fischer ,  Matthias Schmidt

IPC: H01L23/495 ,  H01L21/00 ,  H01L23/31

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L23/291 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate. A bond layer is disposed between the substrate and the dielectric liner layer.

Abstract translation: 在一个实施例中，形成半导体封装的方法包括提供在顶表面上但不在相对的底表面上具有接触区域的第一裸片。 介电衬垫层沉积在第一管芯的底表面下方。 第一裸片与沉积的介电衬垫层连接到衬底的裸片上。 接合层设置在基板和电介质衬垫层之间。

公开(公告)号：US07468307B2

公开(公告)日：2008-12-23

申请号：US11476497

申请日：2006-06-28

Applicant: Walter Hartner ,  Andreas Meiser ,  Hermann Gruber ,  Dietrich Bonart ,  Thomas Gross

Inventor： Walter Hartner ,  Andreas Meiser ,  Hermann Gruber ,  Dietrich Bonart ,  Thomas Gross

IPC: H01L21/76

CPC classification number: H01L21/743 ,  H01L23/535 ,  H01L29/0653 ,  H01L29/7809 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor structure includes a semiconductor layer stack includes a semiconductor substrate of a first conductivity type, a heavily-doped buried layer of a second conductivity type, and a monocrystalline semiconductor layer of a third conductivity type formed on top of the semiconductor layer and the buried layer, a contact to the buried layer, the contact formed in a contact hole, and a lateral insulation of different portions of the semiconductor structure, the insulation formed in an isolation trench. A contact to the semiconductor substrate may be formed within the isolation trench.

Abstract translation: 半导体结构包括半导体层堆叠，其包括第一导电类型的半导体衬底，第二导电类型的重掺杂掩埋层和形成在半导体层的顶部上的第三导电类型的单晶半导体层和埋入 层，与埋层的接触，在接触孔中形成的接触以及半导体结构的不同部分的横向绝缘，所述绝缘体形成在隔离沟槽中。 可以在隔离沟槽内形成与半导体衬底的接触。

公开(公告)号：US20070018195A1

公开(公告)日：2007-01-25

申请号：US11476497

申请日：2006-06-28

Applicant: Walter Hartner ,  Andreas Meiser ,  Hermann Gruber ,  Dietrich Bonart ,  Thomas Gross

Inventor： Walter Hartner ,  Andreas Meiser ,  Hermann Gruber ,  Dietrich Bonart ,  Thomas Gross

IPC: H01L29/74

CPC classification number: H01L21/743 ,  H01L23/535 ,  H01L29/0653 ,  H01L29/7809 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor structure includes a semiconductor layer stack includes a semiconductor substrate of a first conductivity type, a heavily-doped buried layer of a second conductivity type, and a monocrystalline semiconductor layer of a third conductivity type formed on top of the semiconductor layer and the buried layer, a contact to the buried layer, the contact formed in a contact hole, and a lateral insulation of different portions of the semiconductor structure, the insulation formed in an isolation trench. A contact to the semiconductor substrate may be formed within the isolation trench.

Abstract translation: 半导体结构包括半导体层堆叠，其包括第一导电类型的半导体衬底，第二导电类型的重掺杂掩埋层和形成在半导体层的顶部上的第三导电类型的单晶半导体层和埋入 层，与埋层的接触，在接触孔中形成的接触以及半导体结构的不同部分的横向绝缘，所述绝缘体形成在隔离沟槽中。 可以在隔离沟槽内形成与半导体衬底的接触。

公开(公告)号：US4719278A

公开(公告)日：1988-01-12

申请号：US026928

申请日：1987-03-17

Applicant: Wolfgang Wellner ,  Hermann Gruber ,  Alois Fehlbier

Inventor： Wolfgang Wellner ,  Hermann Gruber ,  Alois Fehlbier

IPC: C08G18/32 ,  C08G18/10 ,  C08G18/65 ,  C08G18/76 ,  C09D175/04 ,  C09K3/10

CPC classification number: C08G18/7664 ,  C08G18/10

Abstract: The present invention is directed to a process for the preparation of air drying binders containing free isocyanate groups, having thixotropic properties and prepared by reacting aromatic diamines which have at least one alkyl substituent in the ortho position to each amino group with either prepolymers or semi-prepolymers containing free isocyanate groups and based on polyisocyanate mixture of the diphenylmethane series containing at least 20% by weight of 2,4'-diisocyanatodiphenylmethane and organic polyhydroxyl compounds or mixtures of these prepolymers or semi-prepolymers with prepolymers or semi-prepolymers based on other organic polyisocyanates, provided that the mixture contains at least 3% of the prepolymers or semi-prepolymers based on polyisocyanate mixtures of the diphenylmethane series. The invention further relates to the binders produced by this process and their use for the preparation of coating and sealing compounds which harden under the influence of atmospheric moisture.

Abstract translation: 本发明涉及一种制备含有游离异氰酸酯基团的空气干燥粘合剂的方法，具有触变性能，并且通过使具有至少一个邻位的至少一个烷基取代基的芳族二胺与各个氨基与预聚物或半 - 含有游离异氰酸酯基团和基于含有至少20重量％的2,4'-二异氰酸根合二苯基甲烷和有机多羟基化合物或这些预聚物或半预聚物与其它预聚物或半预聚物的混合物的二苯基甲烷系列的多异氰酸酯混合物的预聚物 有机多异氰酸酯，条件是混合物含有至少3％的基于二苯基甲烷系列的多异氰酸酯混合物的预聚物或半预聚物。 本发明还涉及通过该方法制备的粘合剂及其用于制备在大气湿气影响下硬化的涂料和密封化合物的用途。

公开(公告)号：US4609572A

公开(公告)日：1986-09-02

申请号：US719782

申请日：1985-04-04

Applicant: Hermann Gruber ,  Alois Fehlbier

Inventor： Hermann Gruber ,  Alois Fehlbier

IPC: C09D7/12 ,  C08G18/08 ,  C08G18/30 ,  C08G18/32 ,  C08K3/22 ,  C09D175/00 ,  C09D175/04 ,  B05D3/02

CPC classification number: C08K3/22 ,  C08G18/0885 ,  C08G18/302 ,  C08G18/3206 ,  C09D175/04

Abstract: The present invention is directed to a process for applying a chemically resistant coating to a substrate which entails coating a substrate with a composition containing(a) a liquid polyisocyanate component which is present in an amount sufficient to provide an isocyanate index for said composition of at least 30,(b) a polyol component containing at least one organic polyhydroxyl compound having an alcoholic hydroxyl group content of about 0.5 to 15% by weight,(c) water in a quantity of from 20 to 60% by weight, based on the weight of component (b),(d) glycerine in a quantity of about 40 to 200% by weight, based on the weight of component (b), and(e) at least one alkaline earth metal hydroxide or oxide in a quantity of about 50 to 1000% by weight, based on the weight of the glycerine.

Abstract translation: 本发明涉及一种将耐化学腐蚀性涂层施加到基材上的方法，该方法需要用包含（a）液体多异氰酸酯组分的组合物涂覆基材，所述组合物的量足以提供所述组合物的异氰酸酯指数 至少30，（b）含有至少一种醇羟基含量为约0.5至15重量％的有机多羟基化合物的多元醇组分，（c）20至60重量％的水，基于 组分（b），（d）基于组分（b）的重量约40至200重量％的量的甘油和（e）至少一种碱土金属氢氧化物或氧化物 约50至1000重量％，基于甘油的重量。

公开(公告)号：US20130256857A1

公开(公告)日：2013-10-03

申请号：US13431251

申请日：2012-03-27

Applicant: Hermann Gruber ,  Joachim Mahler ,  Uwe Hoeckele ,  Anton Prueckl ,  Thomas Fischer ,  Matthias Schmidt

Inventor： Hermann Gruber ,  Joachim Mahler ,  Uwe Hoeckele ,  Anton Prueckl ,  Thomas Fischer ,  Matthias Schmidt

IPC: H01L25/07 ,  H01L23/495 ,  H01L21/50 ,  H01L23/28

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L23/291 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate.

Abstract translation: 在一个实施例中，形成半导体封装的方法包括提供在顶表面上但不在相对的底表面上具有接触区域的第一裸片。 介电衬垫层沉积在第一管芯的底表面下方。 第一裸片与沉积的介电衬垫层连接到衬底的裸片上。

公开(公告)号：US20130099308A1

公开(公告)日：2013-04-25

申请号：US13279846

申请日：2011-10-24

Applicant: Hermann Gruber ,  Thomas Gross ,  Andreas Peter Meiser ,  Markus Zundel

Inventor： Hermann Gruber ,  Thomas Gross ,  Andreas Peter Meiser ,  Markus Zundel

IPC: H01L29/78 ,  H01L21/50 ,  H01L21/78

CPC classification number: H01L23/481 ,  H01L21/6835 ,  H01L21/76224 ,  H01L21/76898 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to an embodiment, a method of forming a semiconductor device includes: providing a wafer having a semiconductor substrate with a first side a second side opposite the first side, and a dielectric region arranged on the first side; mounting the wafer with the first side on a carrier system; etching a deep vertical trench from the second side through the semiconductor substrate to the dielectric region, thereby insulating a mesa region from the remaining semiconductor substrate; and filling the deep vertical trench with a dielectric material.

Abstract translation: 根据实施例，一种形成半导体器件的方法包括：提供具有半导体衬底的晶片，第一侧具有与第一侧相对的第二侧和布置在第一侧的电介质区域; 将具有第一侧的晶片安装在载体系统上; 蚀刻从第二侧通过半导体衬底到电介质区域的深垂直沟槽，从而将台面区域与剩余的半导体衬底绝缘; 并用介电材料填充深垂直沟槽。

公开(公告)号：US08404562B2

公开(公告)日：2013-03-26

申请号：US12894344

申请日：2010-09-30

Applicant: Rudolf Berger ,  Hermann Gruber ,  Wolfgang Lehnert ,  Guenther Ruhl ,  Raimund Foerg ,  Anton Mauder ,  Hans-Joachim Schulze

Inventor： Rudolf Berger ,  Hermann Gruber ,  Wolfgang Lehnert ,  Guenther Ruhl ,  Raimund Foerg ,  Anton Mauder ,  Hans-Joachim Schulze

IPC: H01L21/322 ,  H01L21/00 ,  H01L21/31

CPC classification number: H01L21/76251 ,  H01L21/02002 ,  H01L21/0237 ,  H01L21/0243 ,  H01L21/02527 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/7624 ,  H01L29/02 ,  H01L29/04 ,  H01L29/16 ,  H01L29/1608 ,  H01L29/161

Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite core and a monocrystalline semiconductor layer attached to the carrier substrate.

Abstract translation: 根据实施例，复合晶片包括具有石墨芯和附着到载体衬底的单晶半导体层的载体衬底。