摘要:
A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the module circuits and a method for effecting the repairs of defects in the circuits of this module. A defect can occur in any one of a first signal via, a second signal via, and a circuit line extending between and intended to electrically connect the first signal via and the second signal via. After a defective circuit is identified, the signal vias of the circuit are isolated. Then, the first signal via of the defective circuit is electrically connected to that repair via of the chip site having the first signal via that is connected to that repair via of the chip site having the second signal via and the second signal via of the defective circuit is electrically connected to that repair via of the chip site having the second signal via that is connected to that repair via of the chip site having the first signal via.
摘要:
A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.
摘要:
In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.
摘要:
A system and method of designing an integrated circuit capable of deriving timing constraints for individual block-level circuits of an integrated circuit that are derived from the chip-level timing constraints and analysis. The block-level timing constraints are in the form of one or more logical timing constraint points at the input and output ports of block-level circuits. Each logical timing constraint points specifies a clock source used to clock data through the port, a delay parameter specifying data propagation delay backward from an input port and forward from an output port, and any timing exception associated with the data path. Using the logical timing constraint point, the circuit design system performs independent timing analysis and optimization of each block-level circuit. The system then reassembles the block-level circuits into a modified chip-level circuit for which timing closure can be achieved.
摘要:
Write logic and read logic are coupled to SDRAM and a frame status table. VCG members are written into SDRAM by the write logic and an entry (based on the MFI and SQ) in the frame status table is maintained by the write logic for each member. The read logic scans the frame status table to identify the earliest frame number for which data is available in SDRAM. Based on the frame status and the address pointer offset, the read logic maintains a state table entry for each VCG member and a state for each VCG. According to the preferred embodiment, the read logic is provided in two parts separated by a temporary buffer. The first part of the read logic performs the functions described above and writes chunk data into the temporary buffer. The second part of the read logic reads byte data from the temporary buffer according to a selectable leak rate.
摘要:
Process for producing multilayer ceramic substrates using greensheet technology and thin dielectric ceramic greensheets for miniaturization purposes. The process avoids the screening of the thin greensheets by forming self-supporting fusible particulate metal electrode layers, interposing them with the thin greensheets and sintering the assembly to form the multilayer substrates such as integrated capacitors.
摘要:
In one embodiment of the invention, a method includes partitioning an integrated circuit design into a hierarchy of a top level and a plurality of partitions, wherein the top level includes a top level netlist and each partition includes a partition netlist; receiving data path timing budgets and clock path timing budgets for each of the plurality of partitions of the integrated circuit design; and generating a timing budget model of each partition in response to the respective data path timing budgets and clock path timing budgets, wherein each timing budget model includes an intra-partition clock timing constraint for each respective partition for independent implementation of the top level.
摘要:
Combined hardware and software processing is applied in an end node of the network which includes mapping/demapping and deskewing. Most of the LCAS procedure is implemented in software so that it can be modified easily. Some of the procedure is implemented in hardware to meet stringent timing requirements. In particular, the handshaking protocol is implemented in software and the procedure for actually changing of the link capacity in response to the handshaking is implemented in hardware. The hardware and software communicate via a shared memory which includes a receive packet FIFO, receive control and status registers, a transmit packet FIFO, transmit control and status registers, and a transmit time slot interchange table.
摘要:
Write logic and read logic are coupled to SDRAM and a frame status table. VCG members are written into SDRAM by the write logic and an entry (based on the MFI and SQ) in the frame status table is maintained by the write logic for each member. The read logic scans the frame status table to identify the earliest frame number for which data is available in SDRAM. Based on the frame status and the address pointer offset, the read logic maintains a state table entry for each VCG member and a state for each VCG. According to the preferred embodiment, the read logic is provided in two parts separated by a temporary buffer. The first part of the read logic performs the functions described above and writes chunk data into the temporary buffer. The second part of the read logic reads byte data from the temporary buffer according to a selectable leak rate.
摘要:
A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.