公开(公告)号：US06341417B1

公开(公告)日：2002-01-29

申请号：US09404510

申请日：1999-09-23

申请人： Dinesh Gupta ,  Lester Wynn Herron ,  John U. Knickerbocker ,  David C. Long ,  Jawahar P. Nayak ,  Keith C. O'Neil ,  Brenda L. Peterson

发明人： Dinesh Gupta ,  Lester Wynn Herron ,  John U. Knickerbocker ,  David C. Long ,  Jawahar P. Nayak ,  Keith C. O'Neil ,  Brenda L. Peterson

IPC分类号： H05K336

CPC分类号： H01L23/5382 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K1/0298 ,  H05K1/0306 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.

摘要翻译： 用于个性化多层衬底结构的方法和结构包括提供具有电特征并改变电特征的通用层以产生多层衬底的个性化层。

公开(公告)号：US06475555B2

公开(公告)日：2002-11-05

申请号：US09429256

申请日：1999-10-29

申请人： Jon A. Casey ,  Dinesh Gupta ,  Lester Wynn Herron ,  John U. Knickerbocker ,  David C. Long ,  Jawahar P. Nayak ,  Brenda L. Peterson ,  Robert A. Rita

发明人： Jon A. Casey ,  Dinesh Gupta ,  Lester Wynn Herron ,  John U. Knickerbocker ,  David C. Long ,  Jawahar P. Nayak ,  Brenda L. Peterson ,  Robert A. Rita

IPC分类号： B05D132

CPC分类号： H05K3/1233 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/227 ,  H05K2201/0116 ,  H05K2203/0783 ,  H01L2924/00

摘要： A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.

摘要翻译： 一种方法，其中将低粘度的含金属浆料筛选到陶瓷毛坯上，然后设置以增加其粘度。 在一种方法中，低粘度是由过量的溶剂引起的，然后将其印迹或以其它方式除去，使得糊料的粘度增加。 在另一种方法中，低粘度糊剂含有交联剂，其使糊剂在筛选后增加其粘度。

公开(公告)号：US06358439B1

公开(公告)日：2002-03-19

申请号：US08466562

申请日：1995-06-06

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01B122

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31678 ,  H01L2924/00

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

摘要翻译： 公开了一种用于在半导体芯片器件的陶瓷衬底封装上填充通孔并形成导电表面图案的铜基膏。 该浆料含有适当粒度和重量比的铝酸铝粉末，以实现烧结产生的通孔和厚膜铜的晶粒尺寸和收缩率控制。 烧结过程中铜材的收缩与陶瓷基体的收缩密切相关。

公开(公告)号：US6116127A

公开(公告)日：2000-09-12

申请号：US354222

申请日：1999-07-15

申请人： William Dale Carbaugh, Jr. ,  Lester Wynn Herron ,  Mark William Kapfhammer ,  Mark Joseph LaPlante ,  David Clifford Long ,  Nabil Amir Rizk ,  James Robert Wylder

发明人： William Dale Carbaugh, Jr. ,  Lester Wynn Herron ,  Mark William Kapfhammer ,  Mark Joseph LaPlante ,  David Clifford Long ,  Nabil Amir Rizk ,  James Robert Wylder

IPC分类号： B21D28/00 ,  B26F1/14 ,  B26F1/44 ,  H05K1/03 ,  H05K3/00 ,  B26F1/38

CPC分类号： B26F1/44 ,  B26F1/14 ,  H05K3/005 ,  B26F1/40 ,  B26F2001/4436 ,  B26F2001/4445 ,  B26F2001/4472 ,  B26F2001/449 ,  B26F2210/08 ,  H05K1/0306 ,  H05K2201/0133 ,  H05K2203/0278 ,  H05K3/0044 ,  Y10T83/04 ,  Y10T83/323 ,  Y10T83/9425 ,  Y10T83/9437 ,  Y10T83/9476

摘要： Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.

摘要翻译： 公开了一种用于在至少一片材料中形成孔的柔性模具冲压装置。 有一个可弹性的可挤压的压板，当对其施加力时，挤出至少一片材料的至少一部分通过模头的孔。 柔性的可挤压压板可以具有对应于模孔的形状和位置的冲头特征，其有助于通过模头孔挤出柔性的可挤压压板，并且还可以在材料片材中形成孔 。 在本发明的另一个实施例中，可以存在第二模具，其中至少一片材料放置在第一和第二模具之间，以在该材料片材中形成孔。

公开(公告)号：US5945735A

公开(公告)日：1999-08-31

申请号：US797678

申请日：1997-01-31

申请人： Laertis Economikos ,  Lester Wynn Herron ,  Mario J. Interrante

发明人： Laertis Economikos ,  Lester Wynn Herron ,  Mario J. Interrante

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/08 ,  H01L23/48

CPC分类号： H01L23/10 ,  H01L2224/16 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/163

摘要： The present invention relates generally to a new process for hermetically sealing of a high thermally conductive substrate, such as, an aluminum nitride substrate, using a low thermally conductive interposer and structure thereof. More particularly, the invention encompasses a hermetic cap which is secured to an aluminum nitride substrate using the novel thermal interposer. The novel thermal interposer basically comprises of layers of relatively high thermal conductive metallic materials sandwiching a core layer of low thermal conductive metallic material.

公开(公告)号：US5974931A

公开(公告)日：1999-11-02

申请号：US889038

申请日：1997-07-07

申请人： William Dale Carbaugh, Jr. ,  Lester Wynn Herron ,  Mark William Kapfhammer ,  Mark Joseph LaPlante ,  David Clifford Long ,  Nabil Amir Rizk ,  James Robert Wylder

发明人： William Dale Carbaugh, Jr. ,  Lester Wynn Herron ,  Mark William Kapfhammer ,  Mark Joseph LaPlante ,  David Clifford Long ,  Nabil Amir Rizk ,  James Robert Wylder

IPC分类号： B21D28/00 ,  B26F1/14 ,  B26F1/44 ,  H05K1/03 ,  H05K3/00 ,  B26F1/38

CPC分类号： B26F1/44 ,  B26F1/14 ,  H05K3/005 ,  B26F1/40 ,  B26F2001/4436 ,  B26F2001/4445 ,  B26F2001/4472 ,  B26F2001/449 ,  B26F2210/08 ,  H05K1/0306 ,  H05K2201/0133 ,  H05K2203/0278 ,  H05K3/0044 ,  Y10T83/04 ,  Y10T83/323 ,  Y10T83/9425 ,  Y10T83/9437 ,  Y10T83/9476

摘要： Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.

公开(公告)号：US5932043A

公开(公告)日：1999-08-03

申请号：US819928

申请日：1997-03-18

申请人： Richard Allen Bates ,  Carla Natalia Cordero ,  Benjamin Vito Fasano ,  David Brian Goland ,  Robert Hannon ,  Lester Wynn Herron ,  Gregory Marvin Johnson ,  Andrew Michael Reitter ,  Subhash Laxman Shinde ,  Lisa Michelle Studzinski

发明人： Richard Allen Bates ,  Carla Natalia Cordero ,  Benjamin Vito Fasano ,  David Brian Goland ,  Robert Hannon ,  Lester Wynn Herron ,  Gregory Marvin Johnson ,  Andrew Michael Reitter ,  Subhash Laxman Shinde ,  Lisa Michelle Studzinski

IPC分类号： C04B35/581 ,  C04B37/02 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  B32B31/20 ,  B32B15/04

CPC分类号： H01L21/4807 ,  C04B35/581 ,  C04B37/021 ,  C04B2237/066 ,  C04B2237/36 ,  C04B2237/366 ,  C04B2237/403 ,  C04B2237/525 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629

摘要： A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500.degree. C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process.

摘要翻译： 公开了一种用于平坦化陶瓷体的方法和装置，其主要由具有在其焙烧期间进行低温烧结所需的液相添加剂的氮化铝系统组成。 陶瓷体称为氮化铝多层陶瓷（AlN MLC）。 该方法和装置包括在其接触表面上具有第一涂层的支撑瓦，所述AlN MLC用于放置在支撑瓦片的接触表面上。 提供了一种在其接触表面上具有第二涂层的负载平整瓦，所述负载平整瓦被放置在其涂覆表面上并与AlN MLC接触。 最后，提供炉子，用于在大于1500℃的温度下加热支撑砖，AlN MLC和负载平整砖，将陶瓷体平坦化到所需的平整度所需的时间，其中第一涂层和 支撑瓦片和载荷平整瓦片的第二次涂层分别与AlN MLC反应，用于淬火陶瓷体的液相，以防止在平坦化过程中支撑瓦片和载荷平整瓦片粘附到AlN MLC上 。

公开(公告)号：US5925443A

公开(公告)日：1999-07-20

申请号：US758991

申请日：1991-09-10

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/06

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31678

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

公开(公告)号：US5888446A

公开(公告)日：1999-03-30

申请号：US7625

申请日：1998-01-15

申请人： Jon A. Casey ,  Jonathan H. Harris ,  Lester Wynn Herron ,  Irvin Huseby ,  Richard A. Shelleman ,  Subhash L. Shinde ,  Robert A. Youngman

发明人： Jon A. Casey ,  Jonathan H. Harris ,  Lester Wynn Herron ,  Irvin Huseby ,  Richard A. Shelleman ,  Subhash L. Shinde ,  Robert A. Youngman

IPC分类号： C04B35/581 ,  C04B35/638 ,  C04B35/64

CPC分类号： C04B35/638 ,  C04B35/581

摘要： Disclosed is a method of forming an aluminum nitride article. The method includes the steps of adding platinum to a composition including a binder, aluminum nitride particles and a sintering aid; forming the composition into an article; placing the article in a substantially non-carbonaceous container; and sintering the article in a reducing atmosphere to cause removal of the binder and densification of the aluminum nitride article, wherein the platinum catalyzes the removal of the binder.

摘要翻译： 公开了一种形成氮化铝制品的方法。 该方法包括将铂添加到包含粘合剂，氮化铝颗粒和烧结助剂的组合物中的步骤; 将组合物形成制品; 将物品放置在基本上非碳质的容器中; 并且在还原气氛中烧结该制品以使得粘结剂的去除和氮化铝制品的致密化，其中铂催化除去粘合剂。

公开(公告)号：US06762119B2

公开(公告)日：2004-07-13

申请号：US09885791

申请日：2001-06-20

申请人： Sudipta K. Ray ,  Mitchell S. Cohen ,  Lester Wynn Herron ,  Mario J. Interrante ,  Thomas E. Lombardi ,  Subhash L. Shinde

发明人： Sudipta K. Ray ,  Mitchell S. Cohen ,  Lester Wynn Herron ,  Mario J. Interrante ,  Thomas E. Lombardi ,  Subhash L. Shinde

IPC分类号： H01L2144

CPC分类号： H01S5/02272 ,  G02B6/4238 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01S5/02236 ,  H01S5/02268 ,  H01L2924/00 ,  H01L2924/00014

摘要： A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

摘要翻译： 一种用于在集成电路中形成光学子组件的工艺和结构，包括：在衬底上的金属化层中限定导电线和焊盘; 在所述金属化层上沉积钝化层; 蚀刻钝化层以从每个接合焊盘和与每个焊盘相关联的金属化层的一部分去除钝化层; 从靠近所述接合焊盘的线扩散Cr，以防止焊料向下润湿; 将光学器件接合到所述接合焊盘之一; 以及使用焊料粘合附着将衬底附接到载体上。