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公开(公告)号：US20090155961A1
公开(公告)日：2009-06-18
申请号：US11957845
申请日：2007-12-17
申请人： WonJun Ko , Jong Wook Ju , SeungYong Chai , Taeg Ki Lim , Ja Eun Yun
发明人： WonJun Ko , Jong Wook Ju , SeungYong Chai , Taeg Ki Lim , Ja Eun Yun
IPC分类号： H01L21/56 , H01L23/495
CPC分类号： H01L23/3121 , H01L23/16 , H01L23/3128 , H01L23/49822 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06568 , H01L2225/06575 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.
摘要翻译： 一种集成电路封装系统，包括：提供基底基板; 将基底集成电路芯片附接到基底基板上; 在基底基板的仅一个边缘附近在基底基板上形成支撑件; 以及将堆叠衬底附接在所述支撑件和所述基底集成电路管芯上。
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公开(公告)号：US08067275B2
公开(公告)日：2011-11-29
申请号：US11957845
申请日：2007-12-17
申请人： WonJun Ko , Jong Wook Ju , SeungYong Chai , Taeg Ki Lim , Ja Eun Yun
发明人： WonJun Ko , Jong Wook Ju , SeungYong Chai , Taeg Ki Lim , Ja Eun Yun
CPC分类号： H01L23/3121 , H01L23/16 , H01L23/3128 , H01L23/49822 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06568 , H01L2225/06575 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.
摘要翻译： 一种集成电路封装系统，包括：提供基底基板; 将基底集成电路芯片附接到基底基板上; 在基底基板的仅一个边缘附近在基底基板上形成支撑件; 以及将堆叠衬底附接在所述支撑件和所述基底集成电路管芯上。
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公开(公告)号：US08659175B2
公开(公告)日：2014-02-25
申请号：US11762055
申请日：2007-06-12
申请人： Jong Wook Ju , Taeg Ki Lim , Hyun Joung Kim
发明人： Jong Wook Ju , Taeg Ki Lim , Hyun Joung Kim
CPC分类号： H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2224/05554 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2225/0651 , H01L2225/06562 , H01L2225/06568 , H01L2225/1023 , H01L2225/1052 , H01L2924/00014 , H01L2924/01014 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including mounting a first integrated circuit device over a carrier, mounting a second integrated circuit device having an adhesive spacer over the first integrated circuit device in an offset configuration, connecting a first internal interconnect between the carrier and the first integrated circuit device with the first internal interconnect within the adhesive spacer, connecting a second internal interconnect between the carrier and the second integrated circuit device, and encapsulating the first integrated circuit device, the second integrated circuit device, the first internal interconnect and the second internal interconnect.
摘要翻译： 提供了一种集成电路封装系统，包括将第一集成电路器件安装在载体上，将具有粘合隔离物的第二集成电路器件以偏移配置安装在第一集成电路器件上，连接载体和第一器件之间的第一内部互连 集成电路装置，其中所述第一内部互连在所述粘合剂间隔件内，连接所述载体和所述第二集成电路装置之间的第二内部互连，并且封装所述第一集成电路装置，所述第二集成电路装置，所述第一内部互连和所述第二内部互连 互连。
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公开(公告)号：US07737539B2
公开(公告)日：2010-06-15
申请号：US11306854
申请日：2006-01-12
申请人： Hyeog Chan Kwon , Hyun Joung Kim , Jae Chang Kim , Taeg Ki Lim , Jong Wook Ju
发明人： Hyeog Chan Kwon , Hyun Joung Kim , Jae Chang Kim , Taeg Ki Lim , Jong Wook Ju
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L21/561 , H01L21/565 , H01L23/562 , H01L2224/32225 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/3511
摘要： An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.
摘要翻译： 一种集成电路封装系统，包括具有顶表面和底表面的衬底。 配置顶表面以包括形成在基板的周边和半导体管芯之间的电触头。 在基板的顶表面上对准具有柱的蜂窝网状物的模具板或阶梯式蜂窝状网状物柱，并沉积材料以防止基板在基板的顶表面和模板之间翘曲。 卸下模板以露出形成在与电触点对准的材料内的离散中空导管。
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公开(公告)号：US20100237488A1
公开(公告)日：2010-09-23
申请号：US12789456
申请日：2010-05-28
申请人： Hyeog Chan Kwon , Hyun Joung Kim , Jae Chang Kim , Taeg Ki Lim , Jong Wook Ju
发明人： Hyeog Chan Kwon , Hyun Joung Kim , Jae Chang Kim , Taeg Ki Lim , Jong Wook Ju
CPC分类号： H01L25/105 , H01L21/561 , H01L21/565 , H01L23/562 , H01L2224/32225 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/3511
摘要： A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.
摘要翻译： 集成电路封装系统的制造方法包括：向基板提供顶表面; 配置顶表面以包括电触点; 将集成电路连接到顶表面; 并且沉积材料以防止衬底在衬底的顶表面上和集成电路上的翘曲，该图案化的材料具有超过和大于电触点的离散中空导管。
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公开(公告)号：US20070229107A1
公开(公告)日：2007-10-04
申请号：US11278421
申请日：2006-04-01
申请人： Hyun Joung Kim , Jong Wook Ju , Taeg Ki Lim
发明人： Hyun Joung Kim , Jong Wook Ju , Taeg Ki Lim
IPC分类号： G01R31/26
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/0401 , H01L2224/05599 , H01L2224/1134 , H01L2224/1308 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/4899 , H01L2224/73265 , H01L2224/83139 , H01L2224/83191 , H01L2224/83194 , H01L2224/83856 , H01L2224/85051 , H01L2224/85399 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2924/3512 , H01L2924/00012 , H01L2224/4554
摘要： A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate, applying a protective dot on the first integrated circuit device, mounting a second integrated circuit device, having an adhesive, on the protective dot, with the adhesive on the first integrated circuit device, connecting the second integrated circuit device and the substrate, and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.
摘要翻译： 提供连接第一集成电路器件和衬底之间的互连的堆叠集成电路封装系统，衬底上的第一集成电路器件，在第一集成电路器件上施加保护点，安装第二集成电路器件， 在第一集成电路器件上的粘合剂上粘合在保护点上，连接第二集成电路器件和衬底，并封装第一集成电路器件，第二集成电路器件和互连。
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公开(公告)号：US08956914B2
公开(公告)日：2015-02-17
申请号：US11768790
申请日：2007-06-26
申请人： Ja Eun Yun , Jong Wook Ju
发明人： Ja Eun Yun , Jong Wook Ju
IPC分类号： H01L21/00 , H01L23/31 , H01L23/16 , H01L23/00 , H01L25/065
CPC分类号： H01L23/3121 , H01L23/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/05553 , H01L2224/29101 , H01L2224/2919 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/4899 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83385 , H01L2224/83856 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the support structure; connecting the substrate and the first integrated circuit device; and encapsulating the first integrated circuit device and the support structure.
摘要翻译： 一种集成电路封装系统，包括：形成具有由所述焊接掩模形成的支撑结构的焊料掩模的衬底; 在支撑结构上安装第一集成电路装置; 连接所述基板和所述第一集成电路装置; 并封装第一集成电路器件和支撑结构。
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公开(公告)号：US08067831B2
公开(公告)日：2011-11-29
申请号：US11162629
申请日：2005-09-16
申请人： Hyeog Chan Kwon , Tae Sung Jeong , Jae Han Chung , Taeg Ki Lim , Jong Wook Ju
发明人： Hyeog Chan Kwon , Tae Sung Jeong , Jae Han Chung , Taeg Ki Lim , Jong Wook Ju
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/24 , H01L24/97 , H01L25/03 , H01L25/105 , H01L25/50 , H01L2224/16238 , H01L2224/24226 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48229 , H01L2224/73265 , H01L2224/73267 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2224/83 , H01L2224/82
摘要： An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming first planar interconnects in contact with the first integrated circuit and electrically connecting the first integrated circuit to the first substrate.
摘要翻译： 提供一种集成电路封装系统，包括形成第一基板，将第一集成电路安装到第一基板，以及形成与第一集成电路接触的第一平面互连并将第一集成电路电连接到第一基板。
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公开(公告)号：US20070158806A1
公开(公告)日：2007-07-12
申请号：US11306854
申请日：2006-01-12
申请人： Hyeog Chan Kwon , Hyun Joung Kim , Jae Chang Kim , Taeg Ki Lim , Jong Wook Ju
发明人： Hyeog Chan Kwon , Hyun Joung Kim , Jae Chang Kim , Taeg Ki Lim , Jong Wook Ju
CPC分类号： H01L25/105 , H01L21/561 , H01L21/565 , H01L23/562 , H01L2224/32225 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/3511
摘要： An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.
摘要翻译： 一种集成电路封装系统，包括具有顶表面和底表面的衬底。 配置顶表面以包括形成在基板的周边和半导体管芯之间的电触头。 在基板的顶表面上对准具有柱的蜂窝网状物的模具板或阶梯式蜂窝状网状物柱，并沉积材料以防止基板在基板的顶表面和模板之间翘曲。 卸下模板以露出形成在与电触点对准的材料内的离散中空导管。
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公开(公告)号：US20070063331A1
公开(公告)日：2007-03-22
申请号：US11162629
申请日：2005-09-16
申请人： Hyeog Chan Kwon , Tae Sung Jeong , Jae Han Chung , Taeg Ki Lim , Jong Wook Ju
发明人： Hyeog Chan Kwon , Tae Sung Jeong , Jae Han Chung , Taeg Ki Lim , Jong Wook Ju
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/24 , H01L24/97 , H01L25/03 , H01L25/105 , H01L25/50 , H01L2224/16238 , H01L2224/24226 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48229 , H01L2224/73265 , H01L2224/73267 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2224/83 , H01L2224/82
摘要： An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming first planar interconnects in contact with the first integrated circuit and electrically connecting the first integrated circuit to the first substrate.
摘要翻译： 提供一种集成电路封装系统，包括形成第一基板，将第一集成电路安装到第一基板，以及形成与第一集成电路接触的第一平面互连并将第一集成电路电连接到第一基板。
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