公开(公告)号：US07020953B2

公开(公告)日：2006-04-04

申请号：US10239060

申请日：2001-03-23

申请人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Satoshi Shida ,  Shunji Onobori

发明人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Satoshi Shida ,  Shunji Onobori

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。

公开(公告)号：US07827677B2

公开(公告)日：2010-11-09

申请号：US11216074

申请日：2005-09-01

申请人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

发明人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

IPC分类号： H05K13/04

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。

公开(公告)号：US20050283972A1

公开(公告)日：2005-12-29

申请号：US11216074

申请日：2005-09-01

申请人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

发明人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

IPC分类号： H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。

公开(公告)号：US06706130B1

公开(公告)日：2004-03-16

申请号：US10089843

申请日：2002-04-04

申请人： Shozo Minamitani ,  Shinji Kanayama ,  Satoshi Shida ,  Yasuharu Ueno

发明人： Shozo Minamitani ,  Shinji Kanayama ,  Satoshi Shida ,  Yasuharu Ueno

IPC分类号： B29C6506

CPC分类号： H01L24/81 ,  B23K20/12 ,  B23K20/129 ,  B23K2101/40 ,  G11B5/48 ,  G11B5/4806 ,  G11B5/4826 ,  G11B5/486 ,  G11B21/16 ,  H01L21/67138 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75302 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3011

摘要： When pressurizing and relatively moving the objects to be bonded to each other relative to each other subject their metallic bonding portions to friction bonding for the friction bonding of the metallic bonding portions, the friction bonding operation is temporarily partway reduced or stopped.

摘要翻译： 当相对于彼此接合的物体相互加压和相对移动时，金属接合部分被摩擦接合用于金属接合部分的摩擦接合，摩擦接合操作暂时地中止或停止。

公开(公告)号：US07296727B2

公开(公告)日：2007-11-20

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US20050098610A1

公开(公告)日：2005-05-12

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K1/00 ,  H01L21/56 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US07353596B2

公开(公告)日：2008-04-08

申请号：US10549175

申请日：2004-03-18

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘合辅助剂，以便将粘合助剂供应的部件安装在板上。 所述部件安装工序包括将所述粘接辅助剂供给到所述多个部件中的第一部件，并且在所述粘接助剂的安装完成之前开始向所述多个部件中的第二部件供给所述粘合辅助剂 代理提供的第一个组件到板上。

公开(公告)号：US20060185157A1

公开(公告)日：2006-08-24

申请号：US10549175

申请日：2004-03-18

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H05K3/34 ,  B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应 的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。

公开(公告)号：US07797820B2

公开(公告)日：2010-09-21

申请号：US12073523

申请日：2008-03-06

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应 的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。

公开(公告)号：US20080163481A1

公开(公告)日：2008-07-10

申请号：US12073523

申请日：2008-03-06

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H05K3/30 ,  B23P21/00 ,  H05K13/04

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应 的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。