公开(公告)号：US20100047968A1

公开(公告)日：2010-02-25

申请号：US12519510

申请日：2007-12-13

申请人： Yasuhiro Amano ,  Yoshio Terada ,  Naohide Takamoto

发明人： Yasuhiro Amano ,  Yoshio Terada ,  Naohide Takamoto

IPC分类号： H01L21/78 ,  C08K3/36 ,  B32B5/16

CPC分类号： C09J133/04 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/42 ,  B32B2262/101 ,  B32B2264/107 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/54 ,  B32B2457/00 ,  C08F220/18 ,  C08K3/346 ,  C08K9/04 ,  C08L33/06 ,  C08L33/08 ,  C08L51/003 ,  C08L61/00 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/14 ,  C08L2666/16 ,  C08L2666/22 ,  C09J11/04 ,  C09J133/08 ,  C09J151/003 ,  C09J163/00 ,  C09J2203/326 ,  H01L21/6836 ,  H01L23/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83885 ,  H01L2224/85001 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20305 ,  H01L2924/20752 ,  H01L2924/3011 ,  Y10T428/259 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/2075

摘要： The present invention relates to an adhesive sheet for producing a semiconductor device, which is used when a semiconductor element is caused to adhere onto an adherend and the semiconductor element is wire-bonded, in which a lipophilic lamellar clay mineral is contained.

摘要翻译： 本发明涉及一种用于制造半导体器件的粘合片，当将半导体元件粘附到被粘物上并且半导体元件被引线接合时使用，其中包含亲油性层状粘土矿物。

公开(公告)号：US08524007B2

公开(公告)日：2013-09-03

申请号：US12977762

申请日：2010-12-23

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： B08B7/00 ,  B32B3/30 ,  B32B17/10

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

摘要翻译： 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0mum以下的最大高度Rz的微细度形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。

公开(公告)号：US07793668B2

公开(公告)日：2010-09-14

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B3/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US08475600B2

公开(公告)日：2013-07-02

申请号：US12067235

申请日：2006-10-12

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： B08B7/00 ,  B32B3/30 ,  B32B17/10

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

公开(公告)号：US20110088721A1

公开(公告)日：2011-04-21

申请号：US12977762

申请日：2010-12-23

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： B08B1/00

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

摘要翻译： 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0微米或更小的最大高度Rz的微细凹凸形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。

公开(公告)号：US20050244632A1

公开(公告)日：2005-11-03

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B7/00 ,  B32B27/06

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20100319151A1

公开(公告)日：2010-12-23

申请号：US12851797

申请日：2010-08-06

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： A47L25/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20090263153A1

公开(公告)日：2009-10-22

申请号：US12067235

申请日：2006-10-12

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： G03G21/00 ,  B32B3/00

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency.The transfer member provided with a cleaning function includes a transfer member and the cleaning layer provided on at least one surface of the transfer member. The cleaning layer has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2.

摘要翻译： 提供具有清除功能的转印构件，其具有优异的异物去除性能和转印性能，并且可以以特别高的效率去除具有预定粒径的异物。 设置有清洁功能的传送构件包括传送构件和设置在传送构件的至少一个表面上的清洁层。 清洁层具有0.05微米以下的算术平均粗糙度Ra和1.0μm以下的最大高度Rz的微细度形状。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。

公开(公告)号：US07575812B2

公开(公告)日：2009-08-18

申请号：US11252800

申请日：2005-10-19

申请人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

发明人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

IPC分类号： B32B27/06 ,  B32B7/12 ,  B08B7/00

CPC分类号： B32B27/28 ,  B32B27/06 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2432/00 ,  Y10T428/28 ,  Y10T428/2896 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

摘要翻译： 本发明提供了一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 Pa至1×10 9 Pa 底物的至少一个面; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

公开(公告)号：US20060141258A1

公开(公告)日：2006-06-29

申请号：US11252800

申请日：2005-10-19

申请人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

发明人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

IPC分类号： B32B27/00

CPC分类号： B32B27/28 ,  B32B27/06 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2432/00 ,  Y10T428/28 ,  Y10T428/2896 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

摘要翻译： 本发明提供一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 / 在衬底的至少一个面上的SUP> Pa至1×10 9 Pa; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。