Microwave plasma etching method and apparatus
    2.
    发明授权
    Microwave plasma etching method and apparatus 失效
    微波等离子体蚀刻方法和装置

    公开(公告)号:US5013401A

    公开(公告)日:1991-05-07

    申请号:US497077

    申请日:1990-03-21

    CPC分类号: H01J37/32192 H01J37/32678

    摘要: A microwave plasma etching method and apparatus for manufacturing electronic devices such as transistors. The method includes the steps of forming a stream of plasma from a processing gas within a plasma formation chamber by using an electric field produced by a microwave and an electron cyclotron resonance phenomenon produced by a magnetic field perpendicular to the electric field, and processing a substrate surface by locating it at the electron cyclotron resonance point and exposing it to a radiation of the plasma stream. The apparatus has a plasma formation chamber, a microwave introducing device connected to the plasma formation chamber, a magnetic field applying device for producing a magnetic field perpendicular to an electric field produced within the plasma formation chamber, and a gas introducing system for introducing a processing gas into the plasma formation chamber. A substrate holder is provided within the plasma formation chamber for holding a substrate at a resonance point of the electron cyclotron resonance phenomenon exhibited by the introduced microwave and applied magnetic field where the magnetic field has a particular strength.

    摘要翻译: 一种用于制造诸如晶体管的电子器件的微波等离子体蚀刻方法和装置。 该方法包括以下步骤:通过使用由与电场垂直的磁场产生的由微波产生的电场和电子回旋共振现象,从等离子体形成室内的处理气体形成等离子体流,以及处理基板 通过将其定位在电子回旋共振点处并将其暴露于等离子体流的辐射。 该装置具有等离子体形成室,与等离子体形成室连接的微波导入装置,用于产生与等离子体形成室内产生的电场垂直的磁场的磁场施加装置,以及用于引入处理 气体进入等离子体形成室。 在等离子体形成室内设置有基板保持器,用于将基板保持在由引入的微波表现的电子回旋共振现象的共振点和施加的磁场,其中磁场具有特定的强度。

    Non-magnetic ceramics and ceramic multilayer parts
    5.
    发明授权
    Non-magnetic ceramics and ceramic multilayer parts 失效
    非磁性陶瓷和陶瓷多层零件

    公开(公告)号:US6008151A

    公开(公告)日:1999-12-28

    申请号:US89502

    申请日:1998-06-03

    摘要: The invention provides a nonmagnetic ceramic comprising 5% to 40% by weight of .alpha.-quartz and 5% to 60% by weigth of zinc silicate dispersed in 35% to 75% by weight of borosilicate glass as a matrix, the borosilicate glass having SiO.sub.2 and B.sub.2 O.sub.3 contents: SiO.sub.2 =70 to 90% by weight and B.sub.2 O.sub.3 =10 to 30% by weight. Using the nonmagnetic ceramic, multilayer ceramic inductors are obtained. When the ceramic is used as ceramic multilayer parts having an inductor section, it has a low dielectric constant and good characteristics in the high-frequency region, allows for low-temperature firing enabling the use of silver electrodes, prevents chip deformation and crack occurrence upon sintering, and provides a higher mechanical strength.

    摘要翻译: 本发明提供了一种非磁性陶瓷,其包含5重量%至40重量%的α-石英和5重量%至60重量%的分散在35重量%至75重量%的硼硅酸盐玻璃作为基质的硅酸锌,硼硅酸盐玻璃具有SiO 2 B 2 O 3含量:SiO 2 = 70〜90重量%,B 2 O 3 = 10〜30重量%。 使用非磁性陶瓷,获得多层陶瓷电感器。 当陶瓷用作具有电感器部分的陶瓷多层部件时,其在高频区域具有低介电常数和良好的特性,允许使用银电极的低温烧制,防止芯片变形和裂纹发生 烧结,提供更高的机械强度。

    Seat device for use in a vehicle
    6.
    发明授权
    Seat device for use in a vehicle 有权
    用于车辆的座椅装置

    公开(公告)号:US09016797B2

    公开(公告)日:2015-04-28

    申请号:US13355355

    申请日:2012-01-20

    摘要: A seat device for use in a vehicle that can move through an opening of a vehicle between a loading and unloading position positioned outside the vehicle, where a passenger can load and unload as well as be seated, and a seating position positioned in the cabin of the vehicle, where the passenger can maintain a seated disposition. A securing member of the seat device can secure a wheelchair in a folded state to a side surface or a back surface of the seat. The wheelchair together with the seat can move from the loading and unloading position to inside the cabin of the vehicle, with the passenger in a seated position.

    摘要翻译: 一种用于车辆的座椅装置,其可以在位于车辆外部的装载和卸载位置之间移动通过车辆的开口,乘客可以在其中装载和卸载以及被安置,并且位于座舱内的座位位置 车辆,乘客可以保持坐姿。 座椅装置的固定构件可将处于折叠状态的轮椅固定到座椅的侧表面或后表面。 轮椅与座椅一起可以从装载和卸载位置移动到车辆舱内,乘客处于就座位置。

    Method for producing flexible metal laminate
    7.
    发明授权
    Method for producing flexible metal laminate 有权
    柔性金属层压板的制造方法

    公开(公告)号:US08858751B2

    公开(公告)日:2014-10-14

    申请号:US13395822

    申请日:2010-09-09

    摘要: A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.

    摘要翻译: 柔性金属层叠体的制造方法包括将层压金属箔连续热压接在树脂膜上。 通过将保护金属箔放置在热压成形装置的压力表面和层压金属箔之间来进行热压接步骤。 当保护金属箔经受耐磨性试验时,其中保护金属箔被放置成使得保护金属箔的无光泽表面与具有与压力表面相当的表面的板材接触,并且其中无光泽表面是 通过向保护金属箔的光泽表面施加负载并拉动保护金属箔而摩擦板材表面,仅在每个面积的负载超过500g的情况下,在无光泽表面上发现条纹 76毫米×26毫米。

    Method for producing multilayer substrate and electronic part, and multilayer electronic part
    8.
    发明授权
    Method for producing multilayer substrate and electronic part, and multilayer electronic part 失效
    多层基板和电子部件的制造方法以及多层电子部件

    公开(公告)号:US06808642B2

    公开(公告)日:2004-10-26

    申请号:US10238677

    申请日:2002-09-11

    IPC分类号: H01B1300

    摘要: This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of insufficient strength or the like in the handling, as well as the electronic part. Such object has been attained by a method for producing a multilayer substrate or an electronic part comprising the steps of adhering a conductor layer to a transfer film, patterning the conductor layer to form a predetermined pattern, placing the transfer film overlaid with the patterned conductor layer on a prepreg so that the side of the conductor layer faces the prepreg, and then adhering the transfer film to the prepreg by applying heat and pressure and peeling the transfer film to produce the prepreg having the conductor layer formed thereon; and the multilayer electronic part produced by such method.

    摘要翻译: 本发明的目的在于提供一种制造多层基板或电子部件的方法,其中已经实现了厚度的减小,而不会导致处理中的强度等不足的问题以及电子部件。 这样的目的已经通过多层基板或电子部件的制造方法来实现,该方法包括以下步骤:将导体层粘合到转印膜上,图案化导体层以形成预定图案,将转印膜重叠在图案化导体层 在预浸料坯上使导体层的一侧面向预浸料坯,然后通过施加热和压力将转印膜粘附到预浸料上,并剥离转印膜以制备其上形成有导体层的预浸料; 和通过这种方法制造的多层电子部件。

    Electrostastic chuck
    9.
    发明授权
    Electrostastic chuck 失效
    电磁卡盘

    公开(公告)号:US5530616A

    公开(公告)日:1996-06-25

    申请号:US341001

    申请日:1994-11-17

    IPC分类号: B23Q3/15 H01L21/683 H02N13/00

    摘要: An electrostatic chuck for electrostatically clamping a semiconductor wafer while minimizing any plane temperature difference thereof has a dielectric layer joined to a metal plate and an inner electrode disposed in the di-electric layer. The dielectric layer has a raised outer rim disposed on an upper surface thereof along an outer peripheral edge thereof, and a plurality of protrusions disposed on the upper surface radially inwardly of the outer rim, the protrusions having upper surfaces for clamping the semiconductor wafer in direct contact therewith. The volume resistivity of the dielectric layer is 10.sup.9 .OMEGA.m or less, and Rmax (maximum height) of the clamping surfaces of the protrusions 5 is 2.0 .mu.m or less and or Ra (center-line average roughness) thereof is 0.25 .mu.m or less. The ratio of the total area of the clamping surfaces of the protrusions to the entire area of the upper surface of the dielectric layer is equal to or greater than 1% and less than 10%.

    摘要翻译: 用于静电夹持半导体晶片同时最小化其平面温度差的静电卡盘具有连接到设置在二电层中的金属板和内部电极的电介质层。 电介质层具有沿着其外周边缘设置在其上表面上的凸起的外边缘,以及设置在外边缘的径向内侧的上表面上的多个突起,所述突起具有用于将半导体晶片直接夹持的上表面 与其接触。 电介质层的体积电阻率为10 10Ω·m以下,突起5的夹持面的Rmax(最大高度)为2.0μm以下,Ra(中心线平均粗糙度)为0.25μm, 减。 突起的夹持表面的总面积与介电层的上表面的整个面积的比率等于或大于1%且小于10%。