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公开(公告)号：US5078710A
公开(公告)日：1992-01-07
申请号：US494832
申请日：1990-03-16
CPC分类号： A61F13/512 , A61F13/51104 , A61F13/51305 , A61L15/42 , Y10T428/23921 , Y10T428/24322
摘要： A sanitary article comprises an absorbent and a sheet of a surface material to envelop the absorbent, the sheet comprising an opaque, hydrophobic film, having recesses in its land portion, the recesses being formed to have a bottom and side walls, the side walls having a slanting part, the slanting part being provided therein with an opening so that the slanting part having the opening may not be covered with the land portion.
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公开(公告)号：US5126201A
公开(公告)日：1992-06-30
申请号：US458063
申请日：1989-12-28
申请人： Daisuke Shiba , Norihiro Abe , Takatoshi Kobayashi
发明人： Daisuke Shiba , Norihiro Abe , Takatoshi Kobayashi
IPC分类号： A61F13/511 , A61F13/15 , A61F13/49 , A61L15/18 , D01F8/06 , D04H1/4382 , D04H1/541
CPC分类号： A61L15/18 , D04H1/4209 , D04H1/4382 , Y10S428/913 , Y10T428/2927 , Y10T428/2929 , Y10T428/2931 , Y10T428/2958 , Y10T442/641
摘要： An absorbent article using, as a surface material (or a liquid-permeable top sheet), a nonwoven fabric is disclosed, the nonwoven fabric containing at least 10% by weight of a conjugate fiber comprising first and second parts differing from each other, wherein the second part covers at least a part of the first part, at least the first part contains an inorganic component in a proportion higher than that contained in the second part, and the content of the inorganic component in the first part is at least 1.5% by weight based on the weight of the first part. The nonwoven fabric has excellent cutting properties while retaining satisfactory strength, absorbency and touch.
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公开(公告)号：US06914325B2
公开(公告)日：2005-07-05
申请号：US10621547
申请日：2003-07-18
CPC分类号： H01L24/32 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/162 , H01L25/18 , H01L2224/291 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/0132 , H01L2924/014 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/01082 , H01L2224/45099 , H01L2224/05599
摘要： A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.
摘要翻译： 功率半导体模块具有电路组件主体，其包括金属基底，陶瓷基板和功率半导体芯片，并且与具有一体形成的端子的封装组合。 模块的陶瓷基板分别具有将上电路板和下板接合到陶瓷板的两侧的结构，并且使用焊料将金属基体和陶瓷基板彼此固定，从而提高可靠性 并且通过优化陶瓷基板及其金属基底，其尺寸以及用于在陶瓷基板和金属基底之间形成的接合体的材料和方法来延长功率半导体模块的寿命。
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4.发明授权Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base 有权功率半导体模块陶瓷基板，上下板连接在金属基座上公开(公告)号：US06690087B2
公开(公告)日：2004-02-10
申请号：US10028263
申请日：2001-12-28
IPC分类号： H01L2302
CPC分类号： H01L24/32 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/162 , H01L25/18 , H01L2224/291 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/0132 , H01L2924/014 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/01082 , H01L2224/45099 , H01L2224/05599
摘要： A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.
摘要翻译： 功率半导体模块具有电路组件主体，其包括金属基底，陶瓷基板和功率半导体芯片，并且与具有一体形成的端子的封装组合。 模块的陶瓷基板分别具有将上电路板和下板接合到陶瓷板的两侧的结构，并且使用焊料将金属基体和陶瓷基板彼此固定，从而提高可靠性 并且通过优化陶瓷基板及其金属基底，其尺寸以及用于在陶瓷基板和金属基底之间形成的接合体的材料和方法来延长功率半导体模块的寿命。
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公开(公告)号：US06262474B1
公开(公告)日：2001-07-17
申请号：US09301716
申请日：1999-04-29
IPC分类号： H01L23495
CPC分类号： H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01039 , H01L2924/1305 , H01L2924/13055 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor device is formed of a casing, a substrate situated in the casing, at least one semiconductor chip fixed on the substrate, and at least one lead-out terminal for connecting the semiconductor chip to outside. The lead-out terminal includes a soldered portion soldered to the substrate, and a fixed portion fixed to the casing. A stress relaxing device or cutout is formed between the soldered portion and the fixed portion of the lead-out terminal to relieve stress along three axial directions orthogonal to each other. Thus, the crack formation is prevented in the soldered portion of the lead-out terminal while the resistance and impedance of the lead-out terminal are maintained at low values.
摘要翻译： 半导体器件由壳体，位于壳体中的衬底，固定在衬底上的至少一个半导体芯片和用于将半导体芯片连接到外部的至少一个引出端子形成。 引出端子包括焊接到基板的焊接部分和固定到壳体的固定部分。 在引出端子的焊接部分和固定部分之间形成应力松弛装置或切口，以沿着彼此正交的三个轴向方向减轻应力。 因此，在引出端子的电阻和阻抗保持在低值的情况下，在引出端子的焊接部分中防止了裂纹形成。
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公开(公告)号：US5922659A
公开(公告)日：1999-07-13
申请号：US789536
申请日：1997-01-27
IPC分类号： A61K8/39 , A61K8/55 , A61Q5/02 , A61Q19/10 , C11D1/02 , C11D1/06 , C11D1/10 , C11D1/34 , C11D1/37 , C11D3/26 , C11D3/32
摘要： A cleanser composition comprising a phosphate type surfactant and an amide ether carboxylic acid as the essential components. This cleanser composition is lowly irritant to the skin etc., and excellent in lathering property, gives creamy foam in quality, and can give an excellent feeling to the skin cleansed even when it is used in hard water.
摘要翻译： 一种清洁剂组合物，其包含磷酸盐型表面活性剂和酰胺醚羧酸作为必需组分。 该清洁剂组合物对皮肤等刺激性低，起泡性优异，即使在硬水中使用也能赋予皮肤清洁的良好的感觉。
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公开(公告)号：US20090166851A1
公开(公告)日：2009-07-02
申请号：US12379815
申请日：2009-03-02
IPC分类号： H01L23/34
CPC分类号： H01L24/32 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/162 , H01L25/18 , H01L2224/291 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/0132 , H01L2924/014 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/01082 , H01L2224/45099 , H01L2224/05599
摘要： A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.
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公开(公告)号：US4721647A
公开(公告)日：1988-01-26
申请号：US868241
申请日：1986-05-29
IPC分类号： A61F13/15 , A61F13/472 , A61F13/49 , A61F13/53 , A61L15/24 , A61L15/26 , A61L15/60 , B01J20/26 , B01J20/28 , C08F2/00 , C08F2/44 , C08F20/00 , C08F20/04 , C08L23/00 , C08L33/00 , C08L33/02 , C08L51/00 , C08L51/02 , C08L77/00 , C08L101/00 , B32B5/16
CPC分类号： A61F13/53 , A61L15/24 , A61L15/26 , A61L15/60 , D04H1/587 , D04H1/64 , A61F2013/530182 , A61F2013/530496 , Y10S428/913 , Y10T428/254 , Y10T442/642
摘要： An absorbent article comprises a base material of fibers a part or all of which fibers are hydrophobic and a water-absorbent polymer a part or all of which is in the form of substantially spherical particles and has been bonded to said fibers to surround them. Fixation of the polymer is secured. Softness of the base material is maintained.
摘要翻译： 吸收性物品包括纤维的基材，其一部分或全部纤维是疏水性的，吸水性聚合物的一部分或全部是基本上球形的颗粒形式并且已经结合到所述纤维上以包围它们。 确保聚合物的固定。 保持基材的柔软性。
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公开(公告)号：US4666975A
公开(公告)日：1987-05-19
申请号：US707718
申请日：1985-03-04
CPC分类号： A61L15/60
摘要： A polymer in the form of particles is water-insoluble and water-sellable, containing carboxyl or carboxylate groups. It has a physiological saline absorption quantity of 40 to 90 grams per one gram of the polymer, a physiological saline absorption rate of at least 8 ml per 0.3 gram of the polymer, a gel strength of 33 to 200 g/cm2 when it has been swollen to saturation with ion-exchange water. It is useful as an absorbent in a sanitary article.
摘要翻译： 颗粒形式的聚合物是水不溶性和可水溶性的，含有羧基或羧酸酯基团。 每1g聚合物具有40至90克的生理盐水吸收量，每0.3克聚合物的生理盐水吸收速率至少为8毫升，凝胶强度为33至200克/平方厘米 用离子交换水溶胀至饱和。 它作为卫生用品中的吸收剂是有用的。
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公开(公告)号：US4497930A
公开(公告)日：1985-02-05
申请号：US527134
申请日：1983-08-26
CPC分类号： C08J3/24 , A61L15/60 , C08J2300/14
摘要： A highly water absorbent polymer having high resistance to salt solution is prepared by crosslinking a hyrophilic polymer or copolymer having carboxyl and/or carboxylate groups and water content of 10 to 40 wt. % with a crosslinking agent having at least two functional groups capable of reaction with said carboxyl and carboxylate group. An improved hydrophilic polymer is produced by polymerizing a monomer with a persulfate and a hydroperoxide as combined initiators. Another improved hydrophilic polymer is prepared by polymerizing a monomer with a persulfate and adding a hydroperoxide to the resulting polymer.
摘要翻译： 通过交联具有羧基和/或羧酸酯基团的亲水性聚合物或共聚物，水含量为10〜40重量％，可制备高耐盐性溶液的高吸水性聚合物。 ％的交联剂具有至少两个能够与所述羧基和羧酸酯基反应的官能团。 通过将单体与过硫酸盐和氢过氧化物作为组合的引发剂聚合来制备改进的亲水聚合物。 通过使单体与过硫酸盐聚合并向所得聚合物中加入氢过氧化物来制备另一种改进的亲水聚合物。
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