公开(公告)号：US5140643A

公开(公告)日：1992-08-18

申请号：US634305

申请日：1990-12-27

申请人： Yasuo Izumi ,  Masanori Yasutake

发明人： Yasuo Izumi ,  Masanori Yasutake

IPC分类号： H05K13/04 ,  H05K13/08

CPC分类号： H05K13/0421 ,  H05K13/0413

摘要： A part mounting apparatus which includes a part holding/transfer device which holds the part at a part supply position for transfer up to a predetermined part mounting position for mounting, a recognizing device for recognizing a shape of the part held by the part holding/transfer device, and an inclined mirror device for inputting into a recognizing device, an image of the shape of the part in a direction perpendicular to a direction of an optical axis of the recognizing device.

摘要翻译： 一种部件安装装置，包括：部件保持/传送装置，其将部件保持在用于传送到预定部件安装位置的部件供应位置用于安装;识别装置，用于识别由部件保持/传送保持的部件的形状; 装置，以及用于向识别装置输入与所述识别装置的光轴的方向垂直的方向上的所述部分的形状的图像。

公开(公告)号：US20050056761A1

公开(公告)日：2005-03-17

申请号：US10941862

申请日：2004-09-16

申请人： Yasuharu Danjo ,  Yasuo Izumi

发明人： Yasuharu Danjo ,  Yasuo Izumi

IPC分类号： B60N2/06 ,  B60N2/07 ,  B60N2/08 ,  F16M13/00

CPC分类号： B60N2/073 ,  B60N2/072 ,  B60N2/0818 ,  B60N2/0843

摘要： An automobile slide adjuster includes a lower rail to be secured to a vehicle body and an upper rail slidably mounted on the lower rail. A plurality of rolling elements are disposed between the upper and lower rails at a lower portion thereof. The upper rail has a plurality of upward protrusions formed on an upper portion thereof and also has an elongated opening formed along a lower edge of each of the plurality of upward protrusions. The upward protrusions are held in sliding contact with a portion of the lower rail.

摘要翻译： 汽车滑块调节器包括固定到车体的下轨道和可滑动地安装在下轨道上的上轨道。 多个滚动元件在其下部设置在上轨道和下轨道之间。 上轨道具有形成在其上部的多个向上突出部，并且还具有沿着多个向上突起中的每一个的下边缘形成的细长开口。 向上的突起保持与下轨道的一部分滑动接触。

公开(公告)号：US5314175A

公开(公告)日：1994-05-24

申请号：US869193

申请日：1992-04-13

申请人： Yasuo Izumi ,  Nobuya Matsumura ,  Akihiro Yamamoto ,  Yutaka Makino

发明人： Yasuo Izumi ,  Nobuya Matsumura ,  Akihiro Yamamoto ,  Yutaka Makino

IPC分类号： B25B5/06 ,  H01L21/00 ,  H01L41/09 ,  B25B1/06

CPC分类号： H01L21/67138 ,  B25B5/06 ,  H02N2/043

摘要： A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm faces the and of the movable arm with a suitable gap, the movable arm being capable of bending so that the end of the movable arm approaches the end of the fixed arm; and a piezoelectric element that is attached to the movable arm which bends the movable arm by mechanical deformation of the piezoelectric device in order to clamp wire between the end of the movable arm and the end of the fixed arm. A wire clamping method for clamping bonding wire comprising bending a movable arm toward a fixed arm during wire bonding of electronic components by means of mechanical deformation of a piezoelectric element, the deformation being generated by applying a voltage to the piezoelectric element.

摘要翻译： 一种用于在电子部件的引线接合中夹紧接合线的线夹装置，包括：固定臂; 可移动臂被定位成使得固定臂的端部具有适当的间隙面向可动臂和可动臂，可动臂能够弯曲，使得可动臂的端部接近固定臂的端部; 以及压电元件，其附接到可动臂，其通过压电装置的机械变形来弯曲可动臂，以便将可动臂的端部与固定臂的端部之间夹紧线。 一种用于夹紧接合线的线夹紧方法，包括通过压电元件的机械变形在电子部件的引线接合期间将可动臂朝向固定臂弯曲，所述变形通过向压电元件施加电压而产生。

公开(公告)号：US5289966A

公开(公告)日：1994-03-01

申请号：US942167

申请日：1992-09-08

申请人： Yasuo Izumi ,  Syoji Sato ,  Hiroshi Yamauchi ,  Ryoji Inutsuka

发明人： Yasuo Izumi ,  Syoji Sato ,  Hiroshi Yamauchi ,  Ryoji Inutsuka

IPC分类号： B23K1/005 ,  B23K1/20 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K1/0056 ,  B23K1/203 ,  H05K3/3415 ,  H05K3/3494 ,  B23K2201/36 ,  H05K2201/10689 ,  H05K2203/043 ,  H05K2203/0475 ,  H05K2203/107 ,  H05K2203/111 ,  H05K2203/1476 ,  Y02P70/613

摘要： A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.

摘要翻译： 提供了一种将不具有回流温度的第一电子部件和耐回流温度的第二电子部件电连接到基板的方法。 该方法包括以下步骤：将膏状焊料施加到基板的第一预定部分，使得第一电子元件与其连接并连接到基板的第二预定部分，使得第二电子元件与其连接，将第二电子元件 在基板上，通过回流加热安装在基板上的第二电子部件，以将第二电子部件焊接到基板上，在基板的第一预定部分上形成由膏状焊料制成的预焊部分，将焊剂施加到一个 将第一电子部件安装在基板的第一预定部分上，通过局部加热基板来熔化预焊部分的焊膏，并将第一电子部件焊接到第一电子部件上 基质。 将不可洗涤的电子部件和可洗涤电子部件电连接到基板的另一种方法包括与上述方法相似的步骤。

公开(公告)号：US5153707A

公开(公告)日：1992-10-06

申请号：US610046

申请日：1990-11-06

申请人： Yutaka Makino ,  Kazumi Ishimoto ,  Yasuo Izumi ,  Yuji Uesugi

发明人： Yutaka Makino ,  Kazumi Ishimoto ,  Yasuo Izumi ,  Yuji Uesugi

IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L23/544 ,  H05K1/09 ,  H05K3/02

CPC分类号： H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H05K3/027 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/09

摘要： A film material for manufacturing film carriers and its manufacturing method wherein the film material common in all may be applied with respect to the various semiconductor chips which are different in the electrode layout, because the inner lead portions for bump connection use which are required to be changed each time the electrode layout of the semiconductor chip changes are not pattern formed, and are kept as the inner lead forming portion with the whole remaining covered with the conductive metallic layer, and, the manufacturing apparatus for etching mask and model and so on have only to be one in type.

摘要翻译： 用于制造薄膜载体的薄膜材料及其制造方法，其中可以相对于电极布局不同的各种半导体芯片，可以应用共同的薄膜材料，因为需要使用凸块连接用的内部引线部分 半导体芯片的电极布局每次改变都不会形成图案，并且保持为内部引线形成部分，整个仍然被导电金属层覆盖，并且用于蚀刻掩模和模型等的制造装置具有 只有一个在类型。

公开(公告)号：US5118556A

公开(公告)日：1992-06-02

申请号：US593020

申请日：1990-10-03

申请人： Yutaka Makino ,  Kazumi Ishimoto ,  Koichi Kumagai ,  Yasuo Izumi

发明人： Yutaka Makino ,  Kazumi Ishimoto ,  Koichi Kumagai ,  Yasuo Izumi

IPC分类号： H01L23/50 ,  H01L21/00 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K3/02

CPC分类号： H01L21/67132 ,  H01L23/49572 ,  H01L23/4985 ,  H05K3/027 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T428/24917

摘要： A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion. A method for manufacturing the film carrier includes the steps of forming a conductive layer of material on a film; forming the lead pattern by etching part of the layer formed on the film into an outer lead portion having a pattern independent of the electrode arrangement of each semiconductor chip to be mounted thereon, and by leaving another part of the layer as it is to form an inner lead formation portion having a pattern which is changeable according to the electrode arrangement of the semiconductor chip to be mounted thereon; and selectively removing part of the inner lead formation portion by laser processing in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon.

摘要翻译： 用于制造薄膜载体的薄膜材料具有引线图案，其包括独立于要安装在薄膜载体上的半导体芯片的电极布置而形成的外部引线部分，以及内部引线形成部分，其一部分可选择性地移除 根据要安装在其上的半导体芯片的电极布置，内引线形成部分邻接并连接到外引线部分的相应引线。 制造薄膜载体的方法包括以下步骤：在薄膜上形成材料的导电层; 通过将形成在膜上的层的一部分蚀刻到具有独立于要安装在其上的每个半导体芯片的电极布置的图案的外引线部分中，并且通过使层的另一部分原样形成来形成引线图案 内引线形成部，其具有根据要安装在其上的半导体芯片的电极布置而可改变的图案; 并且根据要安装在其上的半导体芯片的电极布置，通过激光加工选择性地去除内部引线形成部分的一部分。

公开(公告)号：US5234105A

公开(公告)日：1993-08-10

申请号：US982041

申请日：1992-11-24

申请人： Syoji Sato ,  Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

发明人： Syoji Sato ,  Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

IPC分类号： B65B69/00 ,  B65D75/32 ,  B65D81/20 ,  B65D85/38 ,  H05K3/28

CPC分类号： H05K3/282 ,  B65B69/00 ,  B65D75/32 ,  B65D75/327 ,  B65D81/2023 ,  B65D81/2084 ,  B65D2575/3245 ,  B65D85/38

摘要： A package is used for keeping an electric circuit board with no electronic components provided thereon in an air-tight cavity thereof and for preventing from oxidation during the transportation to the process wherein the electronic components are mounted on the electric circuit board. The cavity is composed of the lower and upper sheet of gas-impermeable materials, which are bonded at the bonded area by the fusion bonding, adhesive agent or viscous agent. The cavity is kept in non-oxidizing atmosphere by filling inert gas or evacuating air therefrom. The lower and upper sheets are composed of single layer or multi-layers, which may be made of flexible material or rigid material. An electric circuit board accommodated in the cavity of the package is taken out by the device comprising a separation roller pair. The device weakens the bonding strength to enable easy pulling of the lower and upper sheets to unpackage the circuit board.

摘要翻译： 一种封装用于将其上没有设置有电子部件的电路板保持在其气密腔中，并且用于在运输到其中电子部件安装在电路板上的过程中防止氧化。 该空腔由不透气材料的下部和上部组成，它们通过熔融粘合剂，粘合剂或粘性剂粘合在粘合区域。 通过填充惰性气体或从其中排出空气将空腔保持在非氧化性气氛中。 下层和上层由单层或多层组成，其可以由柔性材料或刚性材料制成。 通过包括分离辊对的装置将容纳在包装体的空腔中的电路板取出。 该装置削弱了接合强度，以便容易地拉动下部和上部片材以将电路板打包。

公开(公告)号：US5113788A

公开(公告)日：1992-05-19

申请号：US571096

申请日：1990-08-21

申请人： Yasuo Izumi ,  Syoji Sato ,  Kazumi Ishimoto ,  Yutaka Makino ,  Shohzo Ueno

发明人： Yasuo Izumi ,  Syoji Sato ,  Kazumi Ishimoto ,  Yutaka Makino ,  Shohzo Ueno

IPC分类号： B41F15/08 ,  B41F15/26 ,  B41M1/12 ,  H05K1/02 ,  H05K3/12 ,  H05K3/40 ,  H05K13/04

CPC分类号： H05K3/4053 ,  B41F15/08 ,  H05K13/0469 ,  H05K3/1233 ,  H05K1/0269 ,  H05K2201/09981 ,  H05K2203/082 ,  H05K2203/163

摘要： A screen printing machine has a table on which a substrate is to be put, a substrate adjusting device on the table to adjust the position of the substrate on the table, a screen plate capable of being placed on the table, a squeegee movable on the plate, a suction unit connected with the table to apply suction to the substrate through through holes of the substrate, a measuring device arranged in the suction unit to measure the degree of vacuum in the suction unit, and an adjusting device arranged in the suction unit to adjust the degree of vacuum.

摘要翻译： 丝网印刷机具有要放置基板的工作台，工作台上的基板调节装置，用于调整工作台上的基板的位置，能够放置在工作台上的筛板，可在其上移动的刮板 板，与所述工作台连接的抽吸单元，以通过所述基板的通孔向所述基板施加吸力;布置在所述抽吸单元中以测量所述抽吸单元中的真空度的测量装置;以及布置在所述抽吸单元中的调节装置 调整真空度。

公开(公告)号：US5033783A

公开(公告)日：1991-07-23

申请号：US424367

申请日：1989-10-19

申请人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

发明人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

IPC分类号： B25J15/06 ,  B25J19/02 ,  H01L21/52 ,  H05K13/04 ,  H05K13/08

CPC分类号： B25J19/021 ,  B25J15/0616 ,  Y10S294/907 ,  Y10T29/53191

摘要： A parts mounting apparatus which picks up a part by using a suction nozzle provided in a mounting head and transports the part so as to mount the part at a predetermined position, has: a suction nozzle portion including a suction nozzle, a light transmitting plate and a suction cylinder assembled such that the suction nozzle, the light transmitting plate and the suction cylinder define a suction chamber; the suction nozzle is made of light transmitting material; the light transmitting plate is spaced a proper distance from the suction nozzle; and the suction nozzle, the light transmitting plate and the suction cylinder connected integrally with each other.

摘要翻译： 一种部件安装装置，其通过使用设置在安装头中的吸嘴来拾取部件并将部件运输以将部件安装在预定位置，具有：吸嘴部分，其包括吸嘴，透光板和 抽吸缸组装成使得吸嘴，透光板和抽吸缸限定吸入室; 吸嘴由透光材料制成; 透光板与吸嘴间隔适当的距离; 并且吸嘴，透光板和吸引筒彼此一体地连接。

公开(公告)号：US07147195B2

公开(公告)日：2006-12-12

申请号：US10941862

申请日：2004-09-16

申请人： Yasuharu Danjo ,  Yasuo Izumi

发明人： Yasuharu Danjo ,  Yasuo Izumi

IPC分类号： F16M13/00

CPC分类号： B60N2/073 ,  B60N2/072 ,  B60N2/0818 ,  B60N2/0843

摘要： An automobile slide adjuster includes a lower rail to be secured to a vehicle body and an upper rail slidably mounted on the lower rail. A plurality of rolling elements are disposed between the upper and lower rails at a lower portion thereof. The upper rail has a plurality of upward protrusions formed on an upper portion thereof and also has an elongated opening formed along a lower edge of each of the plurality of upward protrusions. The upward protrusions are held in sliding contact with a portion of the lower rail.

摘要翻译： 汽车滑块调节器包括固定到车体的下轨道和可滑动地安装在下轨道上的上轨道。 多个滚动元件在其下部设置在上轨道和下轨道之间。 上轨道具有形成在其上部的多个向上突出部，并且还具有沿着多个向上突起中的每一个的下边缘形成的细长开口。 向上的突起保持与下轨道的一部分滑动接触。