摘要:
An ordinary read/write operation (normal operation) and a refresh operation are separated from one another and the number of read amplification circuits or in other words, the number of sense amplifiers operating during the normal operation is made smaller than that during the refresh operation. Accordingly, a bit line charge/discharge current during the normal operation can be reduced.
摘要:
An ordinary read/write operation (normal operation) and a refresh operation are separated from one another and the number of read amplification circuits or, in other words, the number of sense amplifiers operating during the normal operation is made smaller than that during the refresh operation. Accordingly, a bit line charge/discharge current during the normal operation can be reduced.
摘要:
An ordinary read/write operation (normal operation) and a refresh operation are separated from one another and the number of read amplification circuits or, in other words, the number of sense amplifiers operating during the normal operation is made smaller than that during the refresh operation. Accordingly, a bit line charge/discharge current during the normal operation can be reduced.
摘要:
A pair of DRAM chips 1A and 1B are mounted opposedly to each other with wiring means such as lead frames put therebetween, the lead frames being substantially integral with external terminals 3B. Then, these DRAM chips and lead frames are connected together by the conventional wire bonding method. Each chip is bonded with an associated lead frame and each lead frame is disposed as plural lead frame conductors contacting mutually lead frame conductors associated with similarly function bonding pads, i.e. external terminals of the chips, of the other one of the pair of chips. Ones or plural pairs of the thus-connected DRAM chips and lead frames are stacked and corresponding leads of the lead frames are connected in common to form a laminate. The plural DRAM chips thus mounted are activated selectively in accordance with a predetermined chip selection signal. Additionally, partial DRAM chips capable of partially functioning normally are combined together by utilizing the above chip mounting method to constitute a single DRAM package.
摘要:
A pair of DRAM chips 1A and 1B are mounted opposedly to each other with wiring means such as lead frames put therebetween, the lead frames being substantially integral with external terminals 3B. Then, these DRAM chips and lead frames are connected together by the conventional wire bonding method. Plural pairs of the thus-connected DRAM chips and lead frames are stacked and corresponding leads of the lead frames are connected in common to form a laminate. The plural DRAM chips thus mounted are activated selectively in accordance with a predetermined chip selection signal. Additionally, partial DRAM chips capable of partially functioning normally are combined together by utilizing the above chip mounting method to constitute a single DRAM package.
摘要:
A pair of DRAM chips 1A and 1B are mounted opposedly to each other with wiring means such as lead frames put therebetween, the lead frames being substantially integral with external terminals 3B. Then, these DRAM chips and lead frames are connected together by the conventional wire bonding method. Plural pairs of the thus-connected DRAM chips and lead frames are stacked and corresponding leads of the lead frames are connected in common to form a laminate. The plural DRAM chips thus mounted are activated selectively in accordance with a predetermined chip selection signal. Additionally, partial DRAM chips capable of partially functioning normally are combined together by utilizing the above chip mounting method to constitute a single DRAM package.
摘要:
A pseudo static RAM is provided which uses a one MOSFET dynamic RAM cell, in which two functions of a page mode and a static column mode are realized by using an address buffer having a function to transmit address signals fed from external terminals as they are and a latch function to latch the address signals fed from the external terminals in synchronism with predetermined control signals fed from the external terminals. The address buffer also has a multiplexer function to selectively incorporate the address signals from the external terminals and the address signals produced in the inside of the RAM so that the address buffer and an internal address signal generating circuit may be controlled by external control terminals to make possible the continuous access by the internal address signals.
摘要:
A microprocessor or the like supplies address signals for memory access according to its own operation speed irrespective of operation speed of a memory. A plurality of registers which take a plurality of address signals inputted in asynchronous state are installed in the memory. The memory access is performed according to sequence of the address signals taken in these plural registers.
摘要:
A microprocessor or the like supplies a plurality of address signals for memory access according to its own operation speed irrespective of the operation speed of a memory. A plurality of registers receives and stores the plurality of address signals which are inputted in an asynchronous state. The memory access is performed according to a sequence signals of the address signals stored in the plurality of registers.
摘要:
A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.