公开(公告)号：US20110186989A1

公开(公告)日：2011-08-04

申请号：US12883950

申请日：2010-09-16

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chih-Hang Tung ,  Cheng-Chang Wei

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chih-Hang Tung ,  Cheng-Chang Wei

IPC分类号： H01L23/52 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L21/44 ,  H01L21/76885 ,  H01L23/49811 ,  H01L23/52 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13018 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/80815 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.

摘要翻译： 半导体器件包括覆盖并电连接到焊盘区域的焊料凸块和形成在焊料凸块的至少一部分上的金属盖层。 金属盖层的熔融温度大于焊料凸块的熔化温度。

公开(公告)号：US08101052B2

公开(公告)日：2012-01-24

申请号：US11563515

申请日：2006-11-27

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： C25D17/12 ,  C25B9/12

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

摘要： An adjustable anode assembly for a wet processing apparatus to allow selective tuning of the electrical field density distribution within a wet process chemical of the apparatus, which in turn allows the process specification or specifications to be selectively varied across the process surface of a wafer when processed by the apparatus. The adjustable anode assembly includes an anode which may be divided into several plates, at least one of which is capable of being moved from a first plane to at least a second plane.

摘要翻译： 一种用于湿处理设备的可调节阳极组件，用于允许选择性地调节设备的湿法化学品中的电场密度分布，这又允许在处理过程中跨过晶片的工艺表面选择性地改变工艺规格或规格 通过该装置。 可调节阳极组件包括阳极，该阳极可分为多个板，其中至少一个能够从第一平面移动到至少第二平面。

公开(公告)号：US20090317214A1

公开(公告)日：2009-12-24

申请号：US12435861

申请日：2009-05-05

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/67 ,  B65D81/26 ,  F25B29/00

CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

公开(公告)号：US08322299B2

公开(公告)日：2012-12-04

申请号：US11419933

申请日：2006-05-23

申请人： Chen-Hua Yu ,  Minghsing Tsai ,  Yi-Li Hsiao

发明人： Chen-Hua Yu ,  Minghsing Tsai ,  Yi-Li Hsiao

IPC分类号： B05C13/00 ,  B05C15/00 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： H01L21/67196 ,  H01L21/67017 ,  H01L21/76849 ,  H01L21/76883

摘要： An apparatus includes an enclosure, at least one process chamber, a robot and at least one valve. The enclosure has a gas therein and at least one door configured to cover an opening into the enclosure. The gas includes at least one reduction gas. The robot is disposed within the enclosure and configured to transfer a substrate between the door and the process chamber. The valve is coupled to the enclosure.

摘要翻译： 一种装置包括外壳，至少一个处理室，机​​器人和至少一个阀。 外壳中具有气体，并且至少一个门构造成覆盖到外壳中的开口。 气体包括至少一种还原气体。 机器人设置在外壳内并且构造成在门和处理室之间传送基板。 阀连接到外壳。

公开(公告)号：US20120227886A1

公开(公告)日：2012-09-13

申请号：US13045365

申请日：2011-03-10

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

IPC分类号： B32B37/00 ,  B23B31/28 ,  H01L21/673 ,  B23K31/02

CPC分类号： H01L21/6833 ,  H01L21/67346 ,  Y10T29/49998 ,  Y10T156/10 ,  Y10T279/23

摘要： A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface.

摘要翻译： 便携式静电卡盘托架包括具有电介质顶表面的保持器和在电介质顶表面下方的双极电极。 双极电极包括与正极电绝缘的正极和负极。 正电极和负电极在基本上平行于电介质顶表面的平面中以交替图案分配。

公开(公告)号：US07418982B2

公开(公告)日：2008-09-02

申请号：US11419914

申请日：2006-05-23

申请人： Chen-Hua Yu ,  Yi-Li Hsiao

发明人： Chen-Hua Yu ,  Yi-Li Hsiao

IPC分类号： B65B1/04

CPC分类号： H01L21/67376 ,  H01L21/67393 ,  H01L21/67772

摘要： A carrier comprises an enclosure, a cabinet and at least one substrate holder. The enclosure comprises a door. The cabinet is coupled to the carrier. The cabinet comprises at least one valve and contains at least one reduction fluid. The substrate holder is disposed within the enclosure to support at least one substrate.

摘要翻译： 载体包括外壳，机壳和至少一个基板保持器。 外壳包括一个门。 机柜耦合到载体。 所述柜包括至少一个阀并且包含至少一个还原流体。 衬底保持器设置在外壳内以支撑至少一个衬底。

公开(公告)号：US08668131B2

公开(公告)日：2014-03-11

申请号：US13031040

申请日：2011-02-18

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

IPC分类号： B23K3/08 ,  B23K1/20

CPC分类号： B23K1/203 ,  B23K3/082

摘要： A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

摘要翻译： 焊剂浸渍装置包括具有顶表面的焊剂板; 以及在焊剂板中的浸入腔并且从顶表面凹陷。 助熔剂矫正器设置在焊剂板上方并且被配置成平行于顶表面移动。 压电致动器被配置为响应于施加到第一压电致动器的电极的控制电压来调节通量调节器和顶表面之间的距离。

公开(公告)号：US08373269B1

公开(公告)日：2013-02-12

申请号：US13227969

申请日：2011-09-08

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L24/95 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75272 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A device includes a lower jig and an upper jig, wherein the lower jig and the upper jig are configured to secure a package substrate. The lower jig includes a first base material and a first plurality of features attached to the first base material. The first plurality of features is disposed adjacent to a peripheral of the lower jig. The upper jig includes a second base material and a second plurality of features attached to the second base material. The second plurality of features is disposed adjacent to a peripheral of the upper jig. The first plurality of features is configured to be attracted to the second plurality of features by a magnetic force.

摘要翻译： 一种装置包括下夹具和上夹具，其中下夹具和上夹具构造成固定封装衬底。 下夹具包括第一基材和附接到第一基材的第一多个特征。 第一多个特征被布置成与下夹具的周边相邻。 上夹具包括第二基材和附接到第二基材的第二多个特征。 第二多个特征被布置成与上夹具的周边相邻。 第一多个特征被配置为通过磁力被吸引到第二多个特征。

公开(公告)号：US08109407B2

公开(公告)日：2012-02-07

申请号：US11755508

申请日：2007-05-30

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

IPC分类号： B65D45/28 ,  B65D53/06

CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

公开(公告)号：US20080298933A1

公开(公告)日：2008-12-04

申请号：US11754789

申请日：2007-05-29

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

IPC分类号： H01L21/00

CPC分类号： H01L21/67017 ,  H01L21/67393 ,  H01L21/67772

摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.

摘要翻译： 一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。 第一个外壳具有第一个开口。 第一个门被配置为密封第一个开口。 第一阀联接到第一外壳。 入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。 设置在第一外壳内的每个衬底保持器支撑至少一个衬底。