公开(公告)号：US08322299B2

公开(公告)日：2012-12-04

申请号：US11419933

申请日：2006-05-23

申请人： Chen-Hua Yu ,  Minghsing Tsai ,  Yi-Li Hsiao

发明人： Chen-Hua Yu ,  Minghsing Tsai ,  Yi-Li Hsiao

IPC分类号： B05C13/00 ,  B05C15/00 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： H01L21/67196 ,  H01L21/67017 ,  H01L21/76849 ,  H01L21/76883

摘要： An apparatus includes an enclosure, at least one process chamber, a robot and at least one valve. The enclosure has a gas therein and at least one door configured to cover an opening into the enclosure. The gas includes at least one reduction gas. The robot is disposed within the enclosure and configured to transfer a substrate between the door and the process chamber. The valve is coupled to the enclosure.

摘要翻译： 一种装置包括外壳，至少一个处理室，机​​器人和至少一个阀。 外壳中具有气体，并且至少一个门构造成覆盖到外壳中的开口。 气体包括至少一种还原气体。 机器人设置在外壳内并且构造成在门和处理室之间传送基板。 阀连接到外壳。

公开(公告)号：US20120227886A1

公开(公告)日：2012-09-13

申请号：US13045365

申请日：2011-03-10

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

IPC分类号： B32B37/00 ,  B23B31/28 ,  H01L21/673 ,  B23K31/02

CPC分类号： H01L21/6833 ,  H01L21/67346 ,  Y10T29/49998 ,  Y10T156/10 ,  Y10T279/23

摘要： A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface.

摘要翻译： 便携式静电卡盘托架包括具有电介质顶表面的保持器和在电介质顶表面下方的双极电极。 双极电极包括与正极电绝缘的正极和负极。 正电极和负电极在基本上平行于电介质顶表面的平面中以交替图案分配。

公开(公告)号：US20120061059A1

公开(公告)日：2012-03-15

申请号：US13033840

申请日：2011-02-24

申请人： Yi-Li HSIAO ,  Chen-Hua Yu ,  Da-Yuan Shih ,  Chih-Hang Tung ,  Chun Hui Yu

发明人： Yi-Li HSIAO ,  Chen-Hua Yu ,  Da-Yuan Shih ,  Chih-Hang Tung ,  Chun Hui Yu

IPC分类号： F28D15/00

CPC分类号： F28D15/02 ,  H01L23/34 ,  H01L23/473 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus for cooling a stacked die package comprises a first die provided above a substrate; a second die above the first die; a cooling fluid in fluid communication with the first die and the second die, the cooling fluid for absorbing thermal energy from the first and the second die; a housing containing the first and second dies, the housing sealing the first and second dies from an environment, wherein the housing further includes a first opening and a second opening, the first and second openings being vertically displaced from one another; a conduit having one end connected to the first opening and the other end connected to the second opening, the conduit allowing the cooling liquid to circulate from the first opening to the second opening; a first temperature sensor being arranged to provide an output that is dependent on a local temperature at the first opening; and a second temperature sensor being arranged to provide an output that is dependent on a local temperature at the second opening, wherein the outputs of the first and second temperature sensors relative to each other are indicative of a level of the cooling fluid.

摘要翻译： 一种用于冷却堆叠的管芯封装的设备，包括设置在衬底上的第一管芯; 第一个模具上方的第二个模具; 与第一模具和第二模具流体连通的冷却流体，用于从第一模具和第二模具吸收热能的冷却流体; 壳体，其包含第一和第二模具，所述壳体将环境中的第一和第二模具密封，其中所述壳体还包括第一开口和第二开口，所述第一和第二开口彼此垂直移位; 导管，其一端连接到第一开口，另一端连接到第二开口，导管允许冷却液从第一开口循环到第二开口; 第一温度传感器被布置成提供依赖于第一开口处的局部温度的输出; 并且第二温度传感器被布置成提供取决于第二开口处的局部温度的输出，其中第一和第二温度传感器相对于彼此的输出指示冷却流体的水平。

公开(公告)号：US20110186989A1

公开(公告)日：2011-08-04

申请号：US12883950

申请日：2010-09-16

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chih-Hang Tung ,  Cheng-Chang Wei

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chih-Hang Tung ,  Cheng-Chang Wei

IPC分类号： H01L23/52 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L21/44 ,  H01L21/76885 ,  H01L23/49811 ,  H01L23/52 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13018 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/80815 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.

摘要翻译： 半导体器件包括覆盖并电连接到焊盘区域的焊料凸块和形成在焊料凸块的至少一部分上的金属盖层。 金属盖层的熔融温度大于焊料凸块的熔化温度。

公开(公告)号：US07418982B2

公开(公告)日：2008-09-02

申请号：US11419914

申请日：2006-05-23

申请人： Chen-Hua Yu ,  Yi-Li Hsiao

发明人： Chen-Hua Yu ,  Yi-Li Hsiao

IPC分类号： B65B1/04

CPC分类号： H01L21/67376 ,  H01L21/67393 ,  H01L21/67772

摘要： A carrier comprises an enclosure, a cabinet and at least one substrate holder. The enclosure comprises a door. The cabinet is coupled to the carrier. The cabinet comprises at least one valve and contains at least one reduction fluid. The substrate holder is disposed within the enclosure to support at least one substrate.

摘要翻译： 载体包括外壳，机壳和至少一个基板保持器。 外壳包括一个门。 机柜耦合到载体。 所述柜包括至少一个阀并且包含至少一个还原流体。 衬底保持器设置在外壳内以支撑至少一个衬底。

公开(公告)号：US09021682B2

公开(公告)日：2015-05-05

申请号：US13527459

申请日：2012-06-19

申请人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： H01R43/052 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/78 ,  H01L2224/056 ,  H01L2224/1111 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  Y10T29/49192 ,  Y10T29/49213 ,  Y10T29/514 ,  Y10T29/5177 ,  Y10T29/53217 ,  Y10T29/53235 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049 ,  H01L2224/4554

摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

摘要翻译： 一种装置包括：线圈，其被配置为供应线，被配置为在所述线中形成切口的切割装置，以及被配置为结合所述线并形成柱形凸块的毛细管。 该设备还被配置为拉动线在凹口处断裂，尾部区域附接到柱形凸块。

公开(公告)号：US08540136B1

公开(公告)日：2013-09-24

申请号：US13605403

申请日：2012-09-06

申请人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： B23K31/02 ,  B21D53/36 ,  B23K20/007 ,  H01L2224/78301 ,  Y10T29/49

摘要： Methods for forming stud bumps and apparatuses for forming stud bumps are disclosed. According to an embodiment, a method includes clamping a wire with a clamp. The clamp includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method further includes bonding the wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface. The second notch is the notch pitch distance from the first notch along the wire.

摘要翻译： 公开了用于形成柱形凸块的方法和用于形成凸块凸块的装置。 根据实施例，一种方法包括用夹具夹紧线。 所述夹具包括至少两个相对的板，并且当所述线被夹紧形成所述线中的第一凹口时，所述相对板中的至少一个包括与所述线相交的突出特征。 该方法还包括将线接合到接合表面，将线从夹具中释放出来，使线穿过钳口的间距距离通过夹具夹紧线，夹具在线中形成第二凹口，并将线断开， 接合表面上的导线的接合部分。 第二个凹口是距离第一个凹口沿导线的切口间距距离。

公开(公告)号：US08276648B2

公开(公告)日：2012-10-02

申请号：US13356950

申请日：2012-01-24

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B22D11/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

摘要翻译： 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件，熔化所需的管 材料，将熔融管材注入内部模制件和外部模制件之间的空间中，冷却熔融管材料，在熔融管材冷却并固化成管之后，从模具构件中取出管子，将管子 在物理气相沉积靶中，其中管形成基于管的检测器的外壳。

公开(公告)号：US20120131784A1

公开(公告)日：2012-05-31

申请号：US13356950

申请日：2012-01-24

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B23P11/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

摘要翻译： 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件，熔化所需的管 材料，将熔融管材注入内部模制件和外部模制件之间的空间中，冷却熔融管材料，在熔融管材冷却并固化成管之后，从模具构件中取出管子，将管子 在物理气相沉积靶中，其中管形成基于管的检测器的外壳。

公开(公告)号：US20110126397A1

公开(公告)日：2011-06-02

申请号：US13022221

申请日：2011-02-07

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B23P11/00 ,  B29C41/42 ,  B29C41/02

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure. Each detector includes an enclosure which may be made by forming a plurality of bores in a bulk material and separating the bulk material into a plurality of discrete enclosure units each including one of the bores. Alternatively, the enclosure of the detector may be made using a mold having one or more mold members and an extrusion, casting, electrical chemical plating, and/or sheet forming method.

摘要翻译： 用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器，用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命端点的给定量。 每个检测器包括可以通过在散装材料中形成多个孔并将散装材料分离成多个分立的包围单元而构成的外壳，每个孔包括孔中的一个。 或者，检测器的外壳可以使用具有一个或多个模具构件的模具和挤出，铸造，电化学镀和/或片材成型方法来制造。