摘要:
A magnetic head having an air bearing surface (ABS) and a first pole tip. A second pole tip is spaced apart from and facing the upper end of the first pole tip across a write gap. A bump extends into a portion of the upper end of the first pole tip and a portion of the bottom end of the second pole tip, the bump being positioned away from the ABS. The bump defines a throat height of the first and second pole tips.
摘要:
A method of making a magnetic write head assembly, which has a head surface and a track width, comprises the steps of forming a first pole piece layer of a first pole piece which has a pole tip portion, a back gap portion which is recessed from the head surface and a yoke portion which is located between the pole tip and back gap portions, forming an insulation stack with at least one coil layer embedded therein on the yoke portion of the first pole piece layer, forming a pedestal of the first pole piece on the pole tip portion of the first pole piece layer, forming a write gap layer on the pedestal, forming on a substantially planar surface a first component of a second pole piece on the write gap layer with the width at the head surface which is greater than the track width and with a throat height which extends from the head surface into the head assembly where the first and second pole pieces first commence to separate after the head surface, forming a second component of the second pole piece which has a track width on the first component and, with the second component employed as a mask, ion milling the first component to define the first component with the track width.
摘要:
A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.
摘要:
A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure. Chemical-mechanical polishing may then be used to planarize the conductive material.
摘要:
A perpendicular write head includes a beveled main pole having corners defining a track width and having a planarized surface and encapsulated on either side thereof and below by an alumina layer, the alumina layer having a polished surface and extending above the main pole on either side thereof as steps.
摘要:
A perpendicular write head includes a main pole comprising a Durimide/Alumina hard mask formed over a laminate layer process to form the main pole without using a liftoff or chemical mechanical polishing process, thereby avoiding rounding corners of the pole, the main pole being controlled in shape for improved control of critical dimension of track width and angle of the bevel to avoid undesirable adjacent track writing.
摘要:
The fabrication of the read head sensor components where chemical mechanical polishing (CMP) stop layer is deposited above the sensor layers, a first reactive ion etch (RIE) layer and a second RIE layer are deposited, where the second RIE layer is etchable with a different ion species than the first RIE layer. A stencil layer is then deposited and patterned to create an etching stencil having the desired magnetic read track width of the sensor. An RIE step is then conducted in which the second RIE layer is etched. An RIE step for the first RIE layer is then conducted with a different ion species. Thereafter, the sensor layers are milled where the remaining portions of the first and second RIE layers act as a milling mask. A CMP assisted liftoff step is then conducted in which the remaining portions of the ion milling mask are removed.
摘要:
A giant magnetoresistive (GMR) head contains an overcoat layer consisting of silicon dioxide or silicon nitride. These materials have a coefficient of thermal expansion (CTE) that is less than alumina, which is conventionally used for the overcoat layer. As a result, the overcoat layer exhibits a smaller temperature-induced protrusion when the head heats up from friction with the passing air stream. The process of forming the head includes forming a recess in the overcoat layer that reduces the stress on the poles and improves the performance of the head. The process includes depositing a seed layer over the overcoat layer in preparation to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer. With the seed layer completely removed, a trench having smooth sidewalls and bottom can be etched in the overcoat layer by a reactive ion etch (RIE) process. The saw that is used to separate the head elements in the wafer can be passed through the clean trench without contacting the overcoat layer, thereby avoiding the chipping and cracking that might otherwise result from the use of a silicon dioxide or silicon nitride overcoat layer.
摘要:
An improved method of fabricating thin-film magnetic recording heads is disclosed. For the method, one or more layers for a feature (such as a read element, a write element, etc) are deposited and patterned. A layer of adhesion material is then deposited on the layers of the feature. The adhesion material provides better adhesion to a Diamond-Like Carbon (DLC) layer and to the underlying feature surface, such as monolithic Silicon (Si) or Titanium (Ti). A layer of DLC material is then deposited on the layer of adhesion material. The steps of depositing the layer of adhesion material and the layer of DLC material are repeated more than one time. Thus, more than one set of alternating layers of adhesion material and DLC material are deposited on the layers of the feature to form a multi-layer protective coating on the feature.