公开(公告)号：US20110018670A1

公开(公告)日：2011-01-27

申请号：US12648117

申请日：2009-12-28

申请人： Hyun-Cheol BAE ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

发明人： Hyun-Cheol BAE ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F2017/002 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/19107 ,  H01L2924/00014

摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.

摘要翻译： 提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到 第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

公开(公告)号：US20100320596A1

公开(公告)日：2010-12-23

申请号：US12565171

申请日：2009-09-23

申请人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

发明人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/486 ,  H01L21/563 ,  H01L23/29 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/1134 ,  H01L2224/1152 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a method for fabricating semiconductor package and a semiconductor package fabricated using the same. The method for fabricating semiconductor package dopes a mixture including the polymer material and the solder particle on the substrate in which the terminal is formed and applies heat, and thus the solder particle flows (or diffuses) toward the terminal in the heated polymer resin to adhere to the exposed surface of the terminal, i.e., the side surface and upper surface of the terminal, thereby forming the solder layer. The solder layer improves the adhesive strength between the terminal of the semiconductor chip and the terminal of the substrate in the subsequent flip chip bonding process.

摘要翻译： 提供一种制造半导体封装的方法和使用其制造的半导体封装。 制造半导体封装的方法在形成端子的基板上涂覆包括聚合物材料和焊料颗粒的混合物，并施加热量，从而焊料颗粒向加热的聚合物树脂中的端子流动（或扩散）以粘附 到端子的暴露表面，即端子的侧表面和上表面，从而形成焊料层。 焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子和衬底的端子之间的粘合强度。

公开(公告)号：US20120161326A1

公开(公告)日：2012-06-28

申请号：US13330719

申请日：2011-12-20

申请人： Kwang-Seong Choi ,  Yong Sung Eom ,  Hyun-cheol Bae ,  Jong Tae Moon

发明人： Kwang-Seong Choi ,  Yong Sung Eom ,  Hyun-cheol Bae ,  Jong Tae Moon

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided is a composition for filling a Through Silicon Via (TSV) including: a metal powder; a solder powder; a curable resin; a reducing agent; and a curing agent. A TSV filling method using the composition and a substrate including a TSV plug formed of the composition are also provided.

摘要翻译： 提供了一种用于填充通硅（TSV）的组合物，其包括：金属粉末; 焊粉; 可固化树脂; 还原剂; 和固化剂。 还提供了使用该组合物的TSV填充方法和包含由该组合物形成的TSV塞的基板。

公开(公告)号：US08044757B2

公开(公告)日：2011-10-25

申请号：US12648117

申请日：2009-12-28

申请人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

发明人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

IPC分类号： H01F5/00 ,  H01F27/29 ,  H01F27/28 ,  H01L23/34 ,  H01L23/48

CPC分类号： H01F17/0013 ,  H01F2017/002 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/19107 ,  H01L2924/00014

摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.

摘要翻译： 提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到 第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

公开(公告)号：US20120222738A1

公开(公告)日：2012-09-06

申请号：US13411501

申请日：2012-03-02

申请人： Soo Young OH ,  Yong Sung Eom ,  Jong Tae Moon ,  Kwang Seong Choi

发明人： Soo Young OH ,  Yong Sung Eom ,  Jong Tae Moon ,  Kwang Seong Choi

IPC分类号： H01L31/0224 ,  H01L31/0232

CPC分类号： H01L31/022425 ,  H01B1/22 ,  H01L31/02168 ,  Y02E10/50

摘要： A conductive composition for a front electrode busbar of a silicon solar cell includes a metallic powder, a solder powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing a front electrode busbar of a silicon solar cell includes applying the composition to the front surface of the silicon solar cell wherein its front electrode finger line is formed. A substrate includes a front electrode busbar of a silicon solar cell, formed with a conductive composition. A silicon solar cell includes one or more electrodes containing a conductive composition including a conductive powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing the silicon solar cell includes forming a first electrode array with a first conductive composition, forming a second electrode, and forming a third electrode with a third conductive composition.

摘要翻译： 硅太阳能电池的前电极汇流条的导电组合物包括金属粉末，焊料粉末，固化树脂，还原剂和固化剂。 制造硅太阳能电池的前电极汇流条的方法包括将该组合物涂布在其前电极指线形成的硅太阳能电池的正面上。 基板包括由导电组合物形成的硅太阳能电池的前电极母线。 硅太阳能电池包括一个或多个包含导电组合物的电极，所述导电组合物包括导电粉末，可固化树脂，还原剂和固化剂。 制造硅太阳能电池的方法包括：用第一导电组合物形成第一电极阵列，形成第二电极，并用第三导电组合物形成第三电极。

公开(公告)号：US08030200B2

公开(公告)日：2011-10-04

申请号：US12565171

申请日：2009-09-23

申请人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

发明人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

IPC分类号： H01L21/44

CPC分类号： H01L24/81 ,  H01L21/486 ,  H01L21/563 ,  H01L23/29 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/1134 ,  H01L2224/1152 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fabricating a semiconductor package, includes the steps of forming a first terminal at a first substrate; mixing a polymer resin and solder particles to provide a mixture; covering at least one of an upper surface and side surfaces of the first terminal with the mixture; and heating the first substrate at a temperature higher than a melting point of the solder particles of the mixture to form a solder layer that covers the at least one of an upper surface and a side surface of the first terminal. The solder particles flow or diffuse toward the terminal in the heated polymer resin to adhere to at least some of the exposed surfaces of the terminal thereby forming the solder layer. The solder layer improves the adhesive strength between the terminals of the semiconductor chip and the substrate in the subsequent flip chip bonding process.

摘要翻译： 一种半导体封装的制造方法，包括在第一基板上形成第一端子的工序; 混合聚合物树脂和焊料颗粒以提供混合物; 用所述混合物覆盖所述第一端子的上表面和侧表面中的至少一个; 以及在高于混合物的焊料颗粒的熔点的温度下加热第一衬底，以形成覆盖第一端子的上表面和侧表面中的至少一个的焊料层。 焊料颗粒朝向加热的聚合物树脂中的端子流动或扩散以粘附到端子的至少一些暴露表面，从而形成焊料层。 焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子与衬底之间的粘合强度。

公开(公告)号：US20110089577A1

公开(公告)日：2011-04-21

申请号：US12761715

申请日：2010-04-16

申请人： Yong Sung Eom ,  Jong Tae Moon ,  Kwang-Seong Choi

发明人： Yong Sung Eom ,  Jong Tae Moon ,  Kwang-Seong Choi

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L25/50 ,  H01L24/29 ,  H01L2224/114 ,  H01L2224/1152 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06575 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.

摘要翻译： 提供了一种在提高制造成品率的同时将倒装芯片接合的方法和结构。 在该方法中，分别在设置在第一和第二基板上的第一电极和/或第二电极上形成焊料凸点。 此外，第一和第二电极被布置成使第二树脂彼此面对，该第二树脂包括设置在第一和第二基板之间的间隔球。 此外，在流动第二树脂时，第一和第二基板被压制直到第一和第二基板之间的距离小于间隔球的直径，以便连接第一和第二电极之间的焊料凸块。

公开(公告)号：US20130146342A1

公开(公告)日：2013-06-13

申请号：US13611220

申请日：2012-09-12

申请人： Yong Sung EOM ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jung Hyun Noh ,  Jong Tae Moon

发明人： Yong Sung EOM ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jung Hyun Noh ,  Jong Tae Moon

IPC分类号： H01B1/02 ,  H05K3/00 ,  C25D5/02 ,  H05K1/09 ,  H05K3/12

CPC分类号： H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

摘要： The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

公开(公告)号：US08211745B2

公开(公告)日：2012-07-03

申请号：US12761715

申请日：2010-04-16

申请人： Yong Sung Eom ,  Jong Tae Moon ,  Kwang-Seong Choi

发明人： Yong Sung Eom ,  Jong Tae Moon ,  Kwang-Seong Choi

IPC分类号： H01L21/60 ,  H01L21/44 ,  H01L23/498

CPC分类号： H01L25/50 ,  H01L24/29 ,  H01L2224/114 ,  H01L2224/1152 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06575 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.

摘要翻译： 提供了一种在提高制造成品率的同时将倒装芯片接合的方法和结构。 在该方法中，分别在设置在第一和第二基板上的第一电极和/或第二电极上形成焊料凸点。 此外，第一和第二电极被布置成使第二树脂彼此面对，该第二树脂包括设置在第一和第二基板之间的间隔球。 此外，在流动第二树脂时，第一和第二基板被压制直到第一和第二基板之间的距离小于间隔球的直径，以便连接第一和第二电极之间的焊料凸块。

公开(公告)号：US20110227228A1

公开(公告)日：2011-09-22

申请号：US12886927

申请日：2010-09-21

申请人： Yong Sung EOM ,  Jong Tae Moon ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jong Jin Lee

发明人： Yong Sung EOM ,  Jong Tae Moon ,  Kwang-Seong Choi ,  Hyun-cheol Bae ,  Jong Jin Lee

IPC分类号： H01L23/488 ,  H01B1/22 ,  H01L21/50

CPC分类号： B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/321 ,  H05K2201/0245 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a filling composition. The filling composition includes: a first particle including Cu and/or Ag; a second particle electrically connecting the first particles; and a resin containing a high molecular compound, a hardener, and a reducer, in which the first and second particles are dispersed, wherein the hardener includes amine and/or anhydride, and the reducer includes carboxyl.

摘要翻译： 提供了一种填充组合物。 填充组合物包括：包含Cu和/或Ag的第一颗粒; 电连接第一颗粒的第二颗粒; 以及分散有第一和第二粒子的含有高分子化合物，硬化剂和还原剂的树脂，其中所述固化剂包括胺和/或酸酐，所述还原剂包括羧基。